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TE Connectivity AMP Connectors 643647-1 SIP Socket Equivalent & Substitute Parts
Part Overview
The TE Connectivity AMP Connectors 643647-1 is a 15-position single inline package (SIP) socket designed for through-hole mounting applications. This connector features tin-plated beryllium copper contacts, a closed frame design, and operates across a temperature range of -55°C to 105°C. The part is classified as obsolete, making identification of functionally equivalent alternatives necessary for ongoing design support, maintenance, and production continuity. Substitute parts must maintain electrical and mechanical compatibility while meeting the same performance and compliance standards.
Substiute Parts
Key Parameters
| Parameter | Specification |
|---|---|
| Number of Positions | 15 (1 x 15) |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Contact Finish - Mating | Tin |
| Contact Finish - Post | Tin |
| Operating Temperature Range | -55°C to 105°C |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution eligibility for the TE Connectivity 643647-1 is determined by the following critical parameters:
Mandatory Matching Parameters:
- Number of positions: 15 (1 x 15)
- Pitch - Mating: 0.100" (2.54mm)
- Pitch - Post: 0.100" (2.54mm)
- Mounting type: Through Hole
- Contact material - Mating: Beryllium Copper
- Termination: Solder
- Material Flammability Rating: UL94 V-0
- RoHS Status: ROHS3 Compliant
- Moisture Sensitivity Level: 1 (Unlimited)
Allowable Variations:
- Contact finish - Mating: Gold or Tin (both acceptable for electrical compatibility)
- Contact finish - Post: Tin or alternative finishes (both acceptable for solder termination)
- Contact material - Post: Beryllium Copper or Brass (both acceptable for through-hole solder termination)
- Housing material: Thermoplastic glass-filled or Polyamide glass-filled (both acceptable for mechanical support)
- Frame design: Closed or Open (both acceptable for functional performance)
- Termination post length: Minor variations within 0.005" tolerance acceptable
The Aries Electronics 15-0518-10 meets all mandatory matching parameters and falls within allowable variations for contact finish and housing material, qualifying it as a direct substitute.
Parameter Comparison
| Parameter | TE Connectivity 643647-1 | Aries Electronics 15-0518-10 | Compatibility |
|---|---|---|---|
| Number of Positions | 15 (1 x 15) | 15 (1 x 15) | Match |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | Match |
| Pitch - Post | 0.100" (2.54mm) | 0.100" (2.54mm) | Match |
| Mounting Type | Through Hole | Through Hole | Match |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper | Match |
| Contact Finish - Mating | Tin | Gold | Acceptable Variation |
| Contact Material - Post | Beryllium Copper | Brass | Acceptable Variation |
| Contact Finish - Post | Tin | Tin | Match |
| Termination | Solder | Solder | Match |
| Termination Post Length | 0.130" (3.30mm) | 0.125" (3.18mm) | Acceptable Variation |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 | Match |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Match |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | Match |
Engineering Selection Recommendations
The Aries Electronics 15-0518-10 is a qualified substitute for the obsolete TE Connectivity 643647-1 based on the following engineering criteria:
Compliance and Certification Alignment: Both parts maintain ROHS3 compliance and UL94 V-0 flammability ratings, ensuring regulatory and safety standard continuity. Both parts carry MSL 1 (Unlimited) moisture sensitivity classification, indicating no special handling requirements during storage or assembly.
Electrical and Mechanical Compatibility: The 15-position SIP configuration with 0.100" (2.54mm) pitch is identical across both parts, ensuring direct footprint compatibility on printed circuit boards. Beryllium copper mating contacts in both parts provide equivalent electrical performance and contact reliability. The through-hole solder termination method is consistent, supporting standard PCB assembly processes.
Contact Finish Considerations: The Aries Electronics substitute features gold-plated mating contacts (10.0µin thickness) compared to tin plating on the original part. Gold plating provides enhanced corrosion resistance and contact reliability in applications subject to environmental exposure or extended storage periods. This represents an upgrade in contact durability without compromising electrical compatibility.
Housing Material and Frame Design: The Aries Electronics part uses polyamide (PA46) nylon 4/6 glass-filled housing compared to thermoplastic glass-filled housing in the original. Both materials provide equivalent mechanical support and thermal stability. The open frame design of the substitute is functionally equivalent to the closed frame original for through-hole mounting applications.
Post Length Variation: The termination post length difference of 0.005" (0.12mm) falls within standard manufacturing tolerances for through-hole solder termination and does not impact PCB assembly compatibility.
Product Status: The Aries Electronics 15-0518-10 carries active product status, ensuring ongoing availability and supply chain continuity compared to the obsolete TE Connectivity original.
Frequently Asked Questions (FAQ)
Q: Can the Aries Electronics 15-0518-10 be used as a direct replacement for the TE Connectivity 643647-1 on existing PCBs?
A: Yes. Both parts share identical 15-position SIP configuration with 0.100" (2.54mm) pitch spacing, through-hole mounting, and solder termination. The footprint and electrical interface are directly compatible. The 0.005" difference in post length is within standard manufacturing tolerance and does not affect PCB assembly or functionality.
Q: What is the difference between tin and gold contact finishes in SIP sockets?
A: Tin plating provides cost-effective contact protection suitable for standard applications. Gold plating offers enhanced corrosion resistance and contact reliability, particularly in environments with temperature cycling, humidity exposure, or extended storage periods. Both finishes are electrically compatible and suitable for solder termination.
Q: Does the open frame design of the Aries Electronics part affect performance compared to the closed frame original?
A: No. For through-hole mounted SIP sockets, both open and closed frame designs provide equivalent mechanical support and electrical performance. Frame design does not impact contact reliability, thermal characteristics, or solder joint integrity.
Q: Are both parts compliant with current regulatory standards?
A: Yes. Both the TE Connectivity 643647-1 and Aries Electronics 15-0518-10 are ROHS3 compliant and carry UL94 V-0 flammability ratings. Both maintain MSL 1 (Unlimited) moisture sensitivity classification, requiring no special handling during storage or assembly.
Q: What is the current availability status of each part?
A: The TE Connectivity 643647-1 is classified as obsolete. The Aries Electronics 15-0518-10 carries active product status with documented inventory availability, ensuring supply chain continuity for new designs and production support.
Q: Are there any temperature operating range differences between the two parts?
A: The TE Connectivity 643647-1 specifies an operating temperature range of -55°C to 105°C. The Aries Electronics 15-0518-10 does not specify an operating temperature range in the provided data. For applications requiring confirmed temperature performance specifications, contact the manufacturer directly.
Q: Can these parts be used interchangeably in high-reliability applications?
A: Both parts meet UL94 V-0 flammability and ROHS3 compliance standards. The Aries Electronics substitute features gold-plated contacts, which provide enhanced reliability in demanding environments. Compatibility is confirmed for standard through-hole solder assembly processes.
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