Equivalent & Substitute Parts for 6116SA25TDB

Part Overview

The 6116SA25TDB is a 16Kbit asynchronous SRAM memory IC manufactured by Renesas Electronics Corporation, packaged in a 24-CDIP through-hole configuration. This device operates with a 25 ns access time and supports parallel memory interface with 2K x 8 organization. The part is classified as obsolete, making substitute components necessary for new designs or system maintenance where through-hole or surface-mount alternatives are required.

Substiute Parts

6116SA25TDB
Renesas Electronics CorporationIn Stock: 11476116SA25TDB Datasheet
6116SA25TDB
Current Part
6116LA20SOG
Renesas Electronics CorporationIn Stock: 10626116LA20SOG Datasheet
6116LA20SOG
MFR Recommended

Key Parameters

Parameter Value
Memory Type Volatile SRAM
Memory Size 16Kbit
Memory Organization 2K x 8
Memory Interface Parallel
Access Time 25 ns
Write Cycle Time 25 ns
Supply Voltage 4.5V ~ 5.5V
Operating Temperature -55°C ~ 125°C
Package Type 24-CDIP (Through Hole)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the 6116SA25TDB is determined by the following critical parameters:

  • Memory Capacity & Organization: Substitute parts must maintain 16Kbit capacity with 2K x 8 organization to ensure functional equivalence
  • Memory Interface: Parallel interface is mandatory for pin-compatible operation
  • Supply Voltage Range: 4.5V ~ 5.5V compatibility ensures direct electrical substitution
  • Access Time: Substitute parts with equal or faster access times (≤25 ns) maintain or improve performance characteristics
  • Package Compatibility: Surface-mount (SOIC) variants represent functional substitutes for applications where package transition is acceptable

The 6116LA20SOG qualifies as a substitute based on identical memory capacity, organization, interface type, and voltage specifications. The faster 20 ns access time provides performance improvement while maintaining backward compatibility with the electrical interface.

Parameter Comparison

Parameter 6116SA25TDB (Main Part) 6116LA20SOG (Substitute)
Memory Size 16Kbit 16Kbit
Memory Organization 2K x 8 2K x 8
Memory Interface Parallel Parallel
Access Time 25 ns 20 ns
Write Cycle Time 25 ns 20 ns
Supply Voltage 4.5V ~ 5.5V 4.5V ~ 5.5V
Operating Temperature -55°C ~ 125°C 0°C ~ 70°C
Mounting Type Through Hole Surface Mount
Package 24-CDIP 24-SOIC
Product Status Obsolete Active
RoHS Status Non-compliant ROHS3 Compliant

Engineering Selection Recommendations

The 6116LA20SOG serves as the primary substitute for the 6116SA25TDB based on the following factors:

Functional Equivalence: Both devices share identical memory capacity (16Kbit), organization (2K x 8), interface type (parallel), and supply voltage specifications (4.5V ~ 5.5V), ensuring direct functional substitution.

Performance Improvement: The 6116LA20SOG provides faster access and write cycle times (20 ns versus 25 ns), delivering improved performance characteristics without compromising compatibility.

Product Status: The 6116LA20SOG maintains active product status with current manufacturing support, whereas the 6116SA25TDB is obsolete. This transition ensures long-term component availability and supply chain continuity.

Compliance Status: The 6116LA20SOG achieves ROHS3 compliance, addressing regulatory requirements for new designs. The 6116SA25TDB is non-compliant, making the substitute necessary for applications subject to RoHS restrictions.

Package Consideration: The transition from 24-CDIP (through-hole) to 24-SOIC (surface-mount) requires PCB redesign. Applications requiring through-hole mounting must evaluate alternative solutions or implement adapter solutions.

Temperature Range: The 6116LA20SOG operates within 0°C ~ 70°C, which is narrower than the 6116SA25TDB range (-55°C ~ 125°C). Applications requiring extended temperature operation must verify compatibility with the substitute's thermal specifications.

Frequently Asked Questions (FAQ)

Q: Can the 6116LA20SOG directly replace the 6116SA25TDB in existing designs?

A: Functional substitution is possible due to identical memory specifications and electrical interface. However, the package transition from 24-CDIP to 24-SOIC requires PCB redesign. Pin-to-pin compatibility exists, but physical mounting differs between through-hole and surface-mount configurations.

Q: What are the key parameters that determine substitution eligibility?

A: Memory capacity (16Kbit), organization (2K x 8), interface type (parallel), and supply voltage range (4.5V ~ 5.5V) are the primary determinants. Access time and write cycle time must be equal to or faster than the original specification. Operating temperature range and package type are secondary considerations dependent on application requirements.

Q: Does the faster access time of the 6116LA20SOG affect compatibility?

A: No. Faster access time (20 ns versus 25 ns) improves performance and maintains backward compatibility. Systems designed for 25 ns operation function correctly with 20 ns components.

Q: Are there temperature limitations when using the 6116LA20SOG as a substitute?

A: Yes. The 6116LA20SOG operates within 0°C ~ 70°C, compared to the 6116SA25TDB range of -55°C ~ 125°C. Applications requiring extended temperature operation, particularly below 0°C or above 70°C, must verify that the substitute meets thermal requirements.

Q: What compliance advantages does the 6116LA20SOG provide?

A: The 6116LA20SOG is ROHS3 compliant and carries EAR99 ECCN classification, whereas the 6116SA25TDB is RoHS non-compliant. This compliance status is essential for applications subject to environmental and export regulations.

Q: Is the 6116LA20SOG currently available?

A: Yes. The 6116LA20SOG maintains active product status with current manufacturing support and documented inventory availability, ensuring reliable supply for new designs and production requirements.

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