Equivalent & Substitute Parts for Renesas 6116SA20TDB

Part Overview

The Renesas 6116SA20TDB is a 16Kbit asynchronous SRAM memory IC with parallel interface, organized as 2K x 8 bits, featuring 20 ns access time and through-hole 24-CDIP packaging. This part is classified as obsolete, making substitute components necessary for new designs and ongoing production support. The 6116SA20TDB operates across an extended temperature range of -55°C to 125°C with supply voltage tolerance of 4.5V to 5.5V.

Key Parameters

Parameter	Value
Memory Type	Volatile SRAM
Memory Size	16Kbit
Memory Organization	2K x 8
Access Time	20 ns
Write Cycle Time	20 ns
Supply Voltage	4.5V – 5.5V
Operating Temperature	-55°C to 125°C
Memory Interface	Parallel
Package Type	24-CDIP (Through Hole)

Substitute Part Grouping Explanation

Substitution for the 6116SA20TDB is determined by the following critical parameters:

Memory Capacity & Organization: Substitute parts must maintain 16Kbit capacity with 2K x 8 organization to ensure address and data line compatibility.
Access & Cycle Time: Substitute parts must meet or exceed the 20 ns specification to maintain system timing requirements.
Supply Voltage Range: Substitute parts must operate within the 4.5V to 5.5V range for direct voltage compatibility.
Memory Interface: Substitute parts must use parallel interface architecture.
Manufacturer: Renesas Electronics Corporation maintains consistent pinout and functional compatibility across the 6116 series.

The identified substitute part 6116LA20SOG meets all electrical parameter requirements but differs in mounting technology (surface mount vs. through hole) and operating temperature range (0°C to 70°C vs. -55°C to 125°C).

Parameter Comparison

Parameter	6116SA20TDB (Main)	6116LA20SOG (Substitute)
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation
Memory Type	Volatile SRAM	Volatile SRAM
Memory Size	16Kbit	16Kbit
Memory Organization	2K x 8	2K x 8
Access Time	20 ns	20 ns
Write Cycle Time	20 ns	20 ns
Supply Voltage	4.5V – 5.5V	4.5V – 5.5V
Memory Interface	Parallel	Parallel
Operating Temperature	-55°C to 125°C	0°C to 70°C
Mounting Type	Through Hole	Surface Mount
Package / Case	24-CDIP (0.300", 7.62mm)	24-SOIC (0.295", 7.50mm Width)
Product Status	Obsolete	Active
RoHS Status	RoHS non-compliant	ROHS3 Compliant

Engineering Selection Recommendations

The 6116LA20SOG substitute part is electrically equivalent to the 6116SA20TDB across all core memory parameters: capacity, organization, access time, cycle time, and supply voltage. Both parts are manufactured by Renesas Electronics Corporation and maintain identical parallel interface architecture.

Selection between these parts depends on application constraints:

For applications requiring extended temperature operation (-55°C to 125°C): The 6116SA20TDB remains the only option within this substitute group, though its obsolete status limits availability.
For standard industrial and commercial temperature ranges (0°C to 70°C): The 6116LA20SOG is the active substitute, offering ROHS3 compliance and current manufacturing support.
For PCB assembly technology: The 6116LA20SOG requires surface-mount assembly capability, while the 6116SA20TDB uses through-hole mounting. PCB redesign may be necessary when transitioning between these mounting technologies.

Frequently Asked Questions (FAQ)

Q: Can the 6116LA20SOG directly replace the 6116SA20TDB in existing designs?

A: Electrical substitution is valid for applications operating within 0°C to 70°C. PCB layout modification is required due to different mounting technologies (surface mount vs. through hole) and package dimensions (24-SOIC vs. 24-CDIP).

Q: What is the impact of the operating temperature difference?

A: The 6116SA20TDB operates from -55°C to 125°C, while the 6116LA20SOG operates from 0°C to 70°C. Applications requiring extended temperature operation must retain the 6116SA20TDB or identify alternative memory solutions outside this substitute group.

Q: Are there pinout differences between these parts?

A: Both parts maintain the same 24-pin configuration and parallel interface architecture. Pin assignments are functionally equivalent across the 6116 series from Renesas Electronics Corporation.

Q: What is the significance of RoHS compliance differences?

A: The 6116SA20TDB is RoHS non-compliant, while the 6116LA20SOG is ROHS3 compliant. For applications subject to RoHS regulations, the 6116LA20SOG is the compliant substitute option.

Q: How do package dimension differences affect board design?

A: The 24-CDIP package measures 0.300" (7.62mm) width, while the 24-SOIC package measures 0.295" (7.50mm) width. These minor dimensional differences require PCB footprint redesign and may affect board layout spacing.

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