Equivalent & Substitute Parts for Intel 5SEEBH40C3N Stratix® V E FPGA

Part Overview

The Intel 5SEEBH40C3N is a Stratix® V E Field Programmable Gate Array (FPGA) featuring 696 I/O pins, 952,000 logic elements, and 53.248 million RAM bits in a 1517-BBGA package. This component is classified as obsolete, making identification of active equivalent parts essential for ongoing system support and procurement planning. The substitute part maintains identical electrical and mechanical specifications while offering current market availability.

Substiute Parts

5SEEBH40C3N

IntelIn Stock: 12395SEEBH40C3N Datasheet

Current PartRFQ

5SEEBH40C3G

IntelIn Stock: 11925SEEBH40C3G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

The Intel 5SEEBH40C3G qualifies as a direct substitute for the 5SEEBH40C3N based on the following criteria:

Identical Electrical Parameters:

• Logic element count: 952,000
• RAM capacity: 53,248,000 bits
• I/O pin count: 696
• Supply voltage range: 0.82V – 0.88V
• Operating temperature range: 0°C – 85°C (TJ)

Identical Mechanical Parameters:

• Package designation: 1517-BBGA, FCBGA
• Physical dimensions: 1517-HBGA (45×45 mm)
• Mounting technology: Surface Mount

Compliance Alignment:

• RoHS Compliant status maintained
• Moisture Sensitivity Level: 3 (168 Hours)

The primary distinction is product status: the 5SEEBH40C3N is obsolete, while the 5SEEBH40C3G is active with current inventory availability (1,090 units in stock versus 1,134 units for the obsolete variant).

Parameter Comparison

Engineering Selection Recommendations

The 5SEEBH40C3G is the appropriate selection for new procurement and system refresh activities. This part maintains full electrical and mechanical compatibility with the obsolete 5SEEBH40C3N while offering the following advantages:

• Active product status ensures long-term availability and manufacturer support
• Current inventory levels support immediate fulfillment
• Identical performance specifications eliminate design modification requirements
• RoHS compliance and MSL rating remain unchanged
• Tray packaging provides standard handling and storage conditions

For systems currently utilizing the 5SEEBH40C3N, direct substitution with the 5SEEBH40C3G requires no circuit modifications, firmware updates, or thermal management adjustments.

Frequently Asked Questions (FAQ)

Q: Can the 5SEEBH40C3G replace the 5SEEBH40C3N in existing designs?

A: Yes. Both parts share identical electrical specifications (952,000 logic elements, 53.248 million RAM bits, 696 I/O pins, 0.82V–0.88V supply voltage, 0°C–85°C operating range) and mechanical specifications (1517-BBGA package, 45×45 mm footprint, surface mount). No design changes are required.

Q: What is the difference between these two part numbers?

A: The primary difference is product lifecycle status. The 5SEEBH40C3N is obsolete, while the 5SEEBH40C3G is active. The suffix letter change (N to G) reflects Intel's product designation convention. Packaging format differs (unspecified for 5SEEBH40C3N versus Tray for 5SEEBH40C3G).

Q: Are there any compliance or certification differences?

A: No. Both parts maintain RoHS compliance and identical Moisture Sensitivity Level 3 (168 Hours) ratings. The 5SEEBH40C3G includes REACH Unaffected status documentation.

Q: What is the 1517-HBGA package specification?

A: The 1517-HBGA is a High-Density Ball Grid Array package with 1,517 solder balls arranged in a 45×45 mm footprint. Both parts use this identical package configuration.

Q: Can I use these parts interchangeably in PCB assembly?

A: Yes. Identical package type, pin count, and footprint dimensions ensure direct PCB compatibility. No layout modifications are necessary.