5ASXMB3G6F40C6N Equivalent & Substitute Parts

Part Overview

The 5ASXMB3G6F40C6N is a Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) featuring Arria V SX FPGA with 350K Logic Elements, operating at 700MHz in a 1517-FBGA package. This embedded processor combines ARM processing capability with FPGA fabric for heterogeneous computing applications. The main part is classified as Obsolete, making substitute parts necessary for ongoing production and maintenance requirements.

Substiute Parts

5ASXMB3G6F40C6N
IntelIn Stock: 10655ASXMB3G6F40C6N Datasheet
5ASXMB3G6F40C6N
Current Part
5ASXMB3G6F40C6G
IntelIn Stock: 7315ASXMB3G6F40C6G Datasheet
5ASXMB3G6F40C6G
Direct
5ASXBB3D6F40C6G
IntelIn Stock: 8685ASXBB3D6F40C6G Datasheet
5ASXBB3D6F40C6G
Parametric Equivalent
5ASXFB3H6F40C6G
IntelIn Stock: 9475ASXFB3H6F40C6G Datasheet
5ASXFB3H6F40C6G
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Intel
Category Embedded
Series Arria V SX
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed 700MHz
Primary Attributes FPGA - 350K Logic Elements
RAM Size 64KB
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FBGA, FC (40x40)
Number of I/O MCU - 208, FPGA - 540
Operating Temperature 0°C ~ 85°C (TJ)
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution for the 5ASXMB3G6F40C6N is determined by strict equivalence across the following critical parameters:

  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Speed: 700MHz
  • FPGA Logic Elements: 350K
  • Package: 1517-FBGA, FC (40x40)
  • RAM Size: 64KB
  • I/O Configuration: MCU - 208, FPGA - 540
  • Operating Temperature Range: 0°C ~ 85°C (TJ)
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

All substitute parts maintain identical electrical and mechanical specifications. Differences are limited to product status (Active vs. Obsolete) and packaging format (Tray vs. standard packaging).

Parameter Comparison

Parameter 5ASXMB3G6F40C6N 5ASXMB3G6F40C6G 5ASXBB3D6F40C6G 5ASXFB3H6F40C6G
Manufacturer Intel Intel Intel Intel
Series Arria V SX Arria V SX Arria V SX Arria V SX
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed 700MHz 700MHz 700MHz 700MHz
Primary Attributes FPGA - 350K Logic Elements FPGA - 350K Logic Elements FPGA - 350K Logic Elements FPGA - 350K Logic Elements
RAM Size 64KB 64KB 64KB 64KB
Package / Case 1517-BBGA, FCBGA 1517-BBGA, FCBGA 1517-BBGA, FCBGA 1517-BBGA, FCBGA
Supplier Device Package 1517-FBGA, FC (40x40) 1517-FBGA, FC (40x40) 1517-FBGA, FC (40x40) 1517-FBGA, FC (40x40)
Number of I/O MCU - 208, FPGA - 540 MCU - 208, FPGA - 540 MCU - 208, FPGA - 540 MCU - 208, FPGA - 540
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Peripherals DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RoHS Status RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active Active Active
Packaging Format Standard Tray Tray Tray

Engineering Selection Recommendations

All three substitute parts (5ASXMB3G6F40C6G, 5ASXBB3D6F40C6G, 5ASXFB3H6F40C6G) are functionally equivalent to the 5ASXMB3G6F40C6N and maintain Active product status. Selection among substitutes should be based on:

  • Availability: 5ASXFB3H6F40C6G (886 Pcs), 5ASXMB3G6F40C6G (697 Pcs), 5ASXBB3D6F40C6G (840 Pcs)
  • Compliance: All substitute parts are RoHS Compliant and REACH Unaffected
  • Packaging: All substitutes are supplied in Tray format
  • Moisture Sensitivity: All parts maintain MSL 3 (168 Hours) rating

The obsolete status of the main part necessitates transition to one of the Active substitute parts for new designs and ongoing production.

Frequently Asked Questions (FAQ)

Q: Are the substitute parts electrically identical to the 5ASXMB3G6F40C6N?

A: Yes. All substitute parts maintain identical core processor architecture, clock speed (700MHz), FPGA logic element count (350K), RAM size (64KB), I/O configuration, peripheral set, and connectivity options. Electrical performance and functional capability are equivalent.

Q: What is the difference between the substitute part numbers?

A: The substitute parts differ only in internal Intel product designation codes. These variations do not affect electrical specifications, package dimensions, or pin configuration. All three are housed in the 1517-FBGA, FC (40x40) package.

Q: Can I use these substitutes in existing designs without PCB modification?

A: Yes. All substitute parts are pin-compatible and package-compatible with the 5ASXMB3G6F40C6N. No PCB redesign is required for direct substitution.

Q: Why is the main part marked as Obsolete?

A: The 5ASXMB3G6F40C6N has reached end-of-life status. The Active substitute parts provide continued access to equivalent functionality for production and maintenance applications.

Q: Are there any compliance differences between the main part and substitutes?

A: No. All parts are RoHS Compliant and maintain the same Moisture Sensitivity Level (MSL 3, 168 Hours). The substitute parts additionally carry REACH Unaffected certification.

Q: What is the packaging difference between the main part and substitutes?

A: The main part uses standard packaging, while all substitute parts are supplied in Tray format. This is a logistics distinction and does not affect component performance or compatibility.

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