Equivalent & Substitute Parts for 5ASXMB3G4F40C4N

Part Overview

The Intel 5ASXMB3G4F40C4N is a Dual ARM Cortex-A9 MPCore System-on-Chip (SOC) with integrated Arria V SX FPGA featuring 350K logic elements, operating at 925MHz in a 1517-FBGA package. This embedded processor combines ARM processing capability with programmable logic for heterogeneous computing applications.

The 5ASXMB3G4F40C4N carries an Obsolete product status. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support long-term production requirements for systems utilizing this component.

Key Parameters

Parameter	Value
Manufacturer Part Number	5ASXMB3G4F40C4N
Manufacturer	Intel
Series	Arria V SX
Core Processor	Dual ARM Cortex-A9 MPCore with CoreSight
FPGA Logic Elements	350K
Operating Speed	925MHz
Package Type	1517-FBGA, FC (40x40)
RAM Size	64KB
I/O Count	MCU - 208, FPGA - 540
Operating Temperature	0°C ~ 85°C (TJ)
RoHS Status	RoHS Compliant
Moisture Sensitivity Level	3 (168 Hours)
Product Status	Obsolete

Substitute Part Grouping Explanation

Substitute parts for the 5ASXMB3G4F40C4N are classified based on the following substitution criteria:

Direct Manufacturer Equivalent: Parts maintaining identical electrical and mechanical specifications, differing only in packaging format or product status transition from Obsolete to Active.

Parametric Equivalents: Parts sharing the same core architecture, FPGA logic element count (350K), package footprint (1517-FBGA, FC 40x40), I/O configuration, and thermal specifications, but with variations in operating speed (925MHz, 800MHz, or 700MHz) or internal device variant designations.

The allowed substitution parameters are:

Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight (fixed)
FPGA Logic Elements: 350K (fixed)
Package Type: 1517-FBGA, FC (40x40) (fixed)
I/O Configuration: MCU - 208, FPGA - 540 (fixed)
Operating Temperature: 0°C ~ 85°C (TJ) (fixed)
RAM Size: 64KB (fixed)
Operating Speed: 925MHz, 800MHz, or 700MHz (variable)
Device Variant: Multiple internal configurations (variable)
Product Status: Obsolete or Active (variable)
Packaging Format: Bulk or Tray (variable)

Parameter Comparison

Part Number	Speed (MHz)	Device Variant	Packaging	Product Status	Inventory (Pcs)	RoHS	MSL
5ASXMB3G4F40C4N	925	MB3G4	Bulk	Obsolete	923	Compliant	3
5ASXMB3G4F40C4G	925	MB3G4	Tray	Active	790	Compliant	3
5ASXBB3D4F40C4G	925	BB3D4	Tray	Active	1063	Compliant	3
5ASXBB3D4F40C5G	800	BB3D4	Tray	Active	877	Compliant	3
5ASXBB3D6F40C6G	700	BB3D6	Tray	Active	840	Compliant	3
5ASXFB3H4F40C4G	925	FB3H4	Tray	Active	837	Compliant	3
5ASXFB3H4F40C5G	800	FB3H4	Tray	Active	1109	Compliant	3
5ASXFB3H6F40C6G	700	FB3H6	Tray	Active	886	Compliant	3
5ASXMB3G4F40C5G	800	MB3G4	Tray	Active	854	Compliant	3
5ASXMB3G6F40C6G	700	MB3G6	Tray	Active	697	Compliant	3

Engineering Selection Recommendations

Primary Substitute (Highest Compatibility): 5ASXMB3G4F40C4G maintains identical device variant (MB3G4) and operating speed (925MHz) as the original part. The transition from Obsolete to Active product status and packaging change from Bulk to Tray represent the primary differences. This part provides direct functional equivalence with improved supply availability.

Speed-Reduced Alternatives: Parts operating at 800MHz (5ASXMB3G4F40C5G, 5ASXFB3H4F40C5G, 5ASXBB3D4F40C5G) and 700MHz (5ASXMB3G6F40C6G, 5ASXFB3H6F40C6G, 5ASXBB3D6F40C6G) maintain all core architectural parameters and package specifications. These substitutes are applicable where system timing requirements permit operation at reduced clock frequencies. All substitute parts maintain Active product status and RoHS compliance.

Device Variant Alternatives: Parts with different device variant designations (BB3D, FB3H) within the same speed grade provide parametric equivalence. Selection among variants should be based on specific application requirements and availability constraints, as all maintain identical electrical and mechanical interfaces.

Frequently Asked Questions (FAQ)

Q: Can 5ASXMB3G4F40C4G directly replace 5ASXMB3G4F40C4N in production?

A: Yes. Both parts share identical core processor architecture, FPGA logic element count, package footprint, I/O configuration, and operating speed. The primary differences are packaging format (Tray vs. Bulk) and product status (Active vs. Obsolete). Verify packaging requirements for your assembly process.

Q: Are the 800MHz and 700MHz variants functionally compatible?

A: These parts maintain identical core architecture, FPGA resources, package type, and I/O configuration. Compatibility depends on system timing requirements. If your design operates at or below the reduced clock frequency, these parts are electrically and mechanically compatible. If your design requires 925MHz operation, these variants are not suitable.

Q: What is the significance of device variant designations (MB3G4, BB3D4, FB3H4)?

A: Device variant designations indicate internal configuration differences within the Arria V SX family. All listed variants maintain the same external electrical interface, package footprint, and I/O count. Variant selection should be based on application-specific requirements and availability.

Q: Do all substitute parts maintain the same thermal and compliance specifications?

A: Yes. All substitute parts operate within the 0°C to 85°C temperature range, maintain RoHS compliance, and carry Moisture Sensitivity Level 3 (168 Hours). All parts are suitable for equivalent thermal management and environmental conditions.

Q: What packaging considerations apply when transitioning from 5ASXMB3G4F40C4N to substitute parts?

A: The original part is supplied in Bulk packaging, while all substitute parts are supplied in Tray packaging. Verify that your assembly equipment and handling procedures accommodate tray-packaged components. Tray packaging typically provides improved component protection and handling efficiency.

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