Equivalent & Substitute Parts for Intel 5AGZME5H2F35I3LN

Part Overview

The Intel 5AGZME5H2F35I3LN is an Arria V GZ Field Programmable Gate Array (FPGA) featuring 534 I/O pins, 400,000 logic elements, and 34,322,432 total RAM bits in a 1152-FBGA package. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, maintenance, and component procurement strategies.

Substiute Parts

5AGZME5H2F35I3LN

IntelIn Stock: 10895AGZME5H2F35I3LN Datasheet

Current PartRFQ

5AGZME5H2F35I3LG

IntelIn Stock: 9115AGZME5H2F35I3LG Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 5AGZME5H2F35I3LN is determined by strict equivalence across the following critical parameters:

• Logic Architecture: Identical number of logic elements (400,000) and LABs/CLBs (18,870)
• I/O Configuration: Matching I/O pin count (534 pins)
• Memory Capacity: Equivalent total RAM bits (34,322,432)
• Package Specification: Same package type (1152-BBGA, FCBGA) and physical dimensions (1152-FBGA 35x35)
• Electrical Characteristics: Identical supply voltage range (0.82V ~ 0.88V) and operating temperature range (-40°C ~ 100°C)
• Compliance Standards: RoHS compliance and MSL rating (3, 168 Hours)

The substitute part 5AGZME5H2F35I3LG meets all these criteria, differing only in packaging format (Tray vs. unspecified) and product status (Active vs. Obsolete).

Parameter Comparison

Engineering Selection Recommendations

The 5AGZME5H2F35I3LG is a direct functional equivalent to the 5AGZME5H2F35I3LN. Both components share identical electrical specifications, logic capacity, I/O configuration, and physical packaging. The primary distinction is product status: the main part is obsolete while the substitute is active.

For new designs or component replenishment, the 5AGZME5H2F35I3LG is the appropriate selection due to its active product status and continued availability. Both parts maintain RoHS compliance and equivalent moisture sensitivity ratings, ensuring compatibility with standard PCB assembly and storage protocols.

Frequently Asked Questions (FAQ)

Q: Can the 5AGZME5H2F35I3LG replace the 5AGZME5H2F35I3LN in existing designs?

A: Yes. Both parts are functionally identical across all critical parameters: logic elements, I/O count, RAM capacity, package type, voltage specifications, and operating temperature range. No design modifications are required.

Q: What is the difference between these two part numbers?

A: The parts differ in packaging format (Tray vs. unspecified) and product lifecycle status. The 5AGZME5H2F35I3LN is obsolete; the 5AGZME5H2F35I3LG is active and currently available.

Q: Are there any compliance or certification differences?

A: No. Both parts are RoHS compliant and carry identical MSL ratings (3, 168 Hours). Compliance requirements are equivalent.

Q: What does the 1152-FBGA (35x35) package specification mean?

A: This indicates a Fine-pitch Ball Grid Array package with 1152 solder balls arranged in a 35mm × 35mm footprint. Both parts use this identical package specification.

Q: Can I use either part interchangeably in PCB assembly?

A: Yes. Both parts have identical mounting type (Surface Mount), package dimensions, and electrical characteristics. PCB footprints and assembly processes are identical.