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55GN01MA-TL-E RF Transistor NPN Equivalent & Substitute Parts
Part Overview
The 55GN01MA-TL-E is an RF transistor NPN manufactured by onsemi, designed for high-frequency applications operating in the 4.5GHz to 5.5GHz frequency range. This component is classified as obsolete, indicating discontinuation from active production. The device operates at a maximum collector-emitter breakdown voltage of 10V with a maximum power dissipation of 400mW and supports a maximum collector current of 70mA. Due to its obsolete status, identifying equivalent and substitute parts is necessary for design continuity, procurement alternatives, and long-term product support.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Transistor Type | NPN | — |
| Voltage - Collector Emitter Breakdown (Max) | 10 | V |
| Frequency - Transition | 4.5 ~ 5.5 | GHz |
| Power - Max | 400 | mW |
| Current - Collector (Ic) (Max) | 70 | mA |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 100 @ 10mA, 5V | — |
| Noise Figure (dB Typ @ f) | 1.9 @ 1GHz | dB |
| Operating Temperature (TJ) | 150 | °C |
| Mounting Type | Surface Mount | — |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitution of the 55GN01MA-TL-E is determined by strict alignment of the following electrical and mechanical parameters:
Critical Matching Parameters:
- Transistor Type: NPN configuration
- Voltage - Collector Emitter Breakdown (Max): 10V minimum
- Frequency - Transition: 4.5GHz to 5.5GHz operating range
- Current - Collector (Ic) (Max): 70mA minimum
- DC Current Gain (hFE) (Min): 100 @ 10mA, 5V minimum
- Operating Temperature: 150°C (TJ) maximum
- Mounting Type: Surface Mount
- RoHS Status: ROHS3 Compliant
- Moisture Sensitivity Level: 1 (Unlimited)
The 55GN01FA-TL-H qualifies as a direct substitute based on matching all critical electrical parameters. While the substitute exhibits a reduced maximum power dissipation (250mW versus 400mW) and different package configuration (3-SSFP versus 3-MCP), it maintains functional equivalence for applications within its power rating. The substitute part is currently in active production status, providing improved long-term availability compared to the obsolete main part.
Parameter Comparison
| Parameter | 55GN01MA-TL-E (Main) | 55GN01FA-TL-H (Substitute) | Match Status |
|---|---|---|---|
| Manufacturer | onsemi | onsemi | Identical |
| Transistor Type | NPN | NPN | Identical |
| Voltage - Collector Emitter Breakdown (Max) | 10V | 10V | Identical |
| Frequency - Transition | 4.5 ~ 5.5 GHz | 4.5 ~ 5.5 GHz | Identical |
| Noise Figure (dB Typ @ f) | 1.9dB @ 1GHz | 1.9dB @ 1GHz | Identical |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 100 @ 10mA, 5V | 100 @ 10mA, 5V | Identical |
| Current - Collector (Ic) (Max) | 70mA | 70mA | Identical |
| Operating Temperature (TJ) | 150°C | 150°C | Identical |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| Power - Max | 400mW | 250mW | Substitute Lower |
| Package / Case | SC-70, SOT-323 | SC-81 | Different |
| Supplier Device Package | 3-MCP | 3-SSFP | Different |
| Product Status | Obsolete | Active | Substitute Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | Identical |
Engineering Selection Recommendations
The 55GN01FA-TL-H is the qualified substitute for the obsolete 55GN01MA-TL-E based on the following engineering criteria:
Compliance and Certification Alignment: Both parts maintain ROHS3 compliance and MSL Level 1 (Unlimited) moisture sensitivity rating, ensuring compatibility with modern manufacturing and storage requirements. Both parts are REACH Unaffected and classified under EAR99 export control.
Electrical Parameter Equivalence: The substitute part maintains identical specifications for all critical RF and DC parameters: 10V collector-emitter breakdown voltage, 4.5GHz to 5.5GHz transition frequency, 70mA maximum collector current, 100 minimum DC current gain, and 1.9dB noise figure at 1GHz. These parameters ensure functional equivalence in RF circuit applications.
Power Dissipation Consideration: The substitute part exhibits a maximum power dissipation of 250mW compared to the main part's 400mW. Circuit designs must verify that thermal requirements do not exceed 250mW during normal operation. Applications requiring power dissipation above 250mW require alternative component selection.
Packaging and Availability: The substitute part is supplied in 3-SSFP package (SC-81) versus the main part's 3-MCP package (SC-70, SOT-323). PCB layout modifications are required to accommodate the different package footprint. The substitute part maintains active production status with significantly higher inventory availability (8523 pieces versus 2566 pieces), providing superior long-term procurement reliability.
Frequently Asked Questions (FAQ)
Q: Can the 55GN01FA-TL-H directly replace the 55GN01MA-TL-E without circuit modification?
A: The substitute part maintains identical electrical specifications for RF and DC parameters. However, the different package configuration (3-SSFP versus 3-MCP) requires PCB layout modifications. The reduced maximum power dissipation (250mW versus 400mW) requires verification that circuit thermal requirements remain within the substitute part's rating.
Q: What is the primary reason for substitution?
A: The 55GN01MA-TL-E is classified as obsolete, indicating discontinuation from active production. The 55GN01FA-TL-H is an active production part from the same manufacturer with identical RF and DC electrical characteristics, providing design continuity and improved long-term availability.
Q: Are there differences in gain specifications between the two parts?
A: The main part specifies 10dB gain at 1GHz. The substitute part specifies 11dB to 19dB gain across the 1GHz to 400MHz frequency range. Both parts meet the minimum gain requirement of 10dB at 1GHz, ensuring functional equivalence in this parameter.
Q: What packaging considerations apply to the substitute part?
A: The 55GN01FA-TL-H uses SC-81 package configuration versus the main part's SC-70/SOT-323 configuration. The different physical dimensions and pin layout require PCB footprint redesign. The substitute part is supplied in Tape & Reel (TR) packaging versus the main part's Cut Tape (CT) packaging, affecting component handling and assembly processes.
Q: Does the substitute part meet the same compliance requirements?
A: Both parts are ROHS3 compliant, REACH Unaffected, and classified as EAR99 for export control. Both maintain MSL Level 1 (Unlimited) moisture sensitivity rating. Compliance requirements are identical between the main and substitute parts.
Q: What is the maximum power dissipation difference, and how does it affect circuit design?
A: The substitute part is rated for 250mW maximum power dissipation compared to the main part's 400mW. Circuit designs must ensure that actual power dissipation during operation remains below 250mW. Applications requiring sustained power dissipation above 250mW require alternative component selection outside this substitution group.
Q: Are there inventory advantages to using the substitute part?
A: The substitute part maintains significantly higher inventory availability (8523 pieces) compared to the main part (2566 pieces). Additionally, the substitute part is in active production status, ensuring continued availability for future procurement cycles, whereas the main part is obsolete and subject to inventory depletion.
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