553MLF Clock Fanout Buffer - Equivalent & Substitute Parts

Part Overview

The 553MLF is a Clock Fanout Buffer (Distribution) IC manufactured by Renesas Electronics Corporation, designed for 1:4 clock distribution at frequencies up to 200 MHz. This active product operates across a supply voltage range of 2.375V to 5.25V and is housed in an 8-SOIC surface mount package. The device features CMOS input and output stages, making it suitable for standard logic level clock distribution applications. Substitute parts are identified to provide alternative sourcing options while maintaining functional and electrical compatibility within the specified parameter constraints.

Substiute Parts

553MLF

Renesas Electronics CorporationIn Stock: 1078553MLF Datasheet

Current PartRFQ

NB3L553DG

onsemiIn Stock: 2437NB3L553DG Datasheet

UpgradeRFQ

NB3L553DR2G

onsemiIn Stock: 2771NB3L553DR2G Datasheet

UpgradeRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the 553MLF are qualified based on the following critical parameters that determine functional interchangeability:

• Fanout Ratio: 1:4 input-to-output configuration
• Maximum Frequency: 200 MHz operation capability
• Supply Voltage Range: 2.375V ~ 5.25V compatibility
• Package Type: 8-SOIC (0.154", 3.90mm Width) surface mount
• Logic Levels: CMOS-compatible input and output stages
• Differential Characteristics: Non-differential input and output
• RoHS Compliance: ROHS3 Compliant status

The identified substitute parts (NB3L553DG and NB3L553DR2G) from onsemi meet all critical electrical and mechanical parameters. Both devices maintain the 1:4 fanout ratio, 200 MHz maximum frequency, identical supply voltage range, and 8-SOIC package footprint. The substitute parts support LVCMOS and LVTTL input/output logic levels, which are compatible with CMOS signaling. Packaging format differences (Tube for 553MLF versus Cut Tape/Digi-Reel for substitutes) do not affect electrical performance or board-level functionality.

Parameter Comparison

Engineering Selection Recommendations

Both NB3L553DG and NB3L553DR2G are active products from onsemi that satisfy all electrical and mechanical substitution criteria for the 553MLF. Selection between these two onsemi alternatives depends on procurement and inventory requirements rather than technical performance:

• NB3L553DG is supplied in Tube packaging, matching the original 553MLF packaging format.
• NB3L553DR2G is supplied in Cut Tape (CT) and Digi-Reel® format, suitable for automated assembly processes requiring tape-and-reel delivery.

Both parts maintain ROHS3 compliance and are classified as active products. The onsemi substitutes provide an extended operating temperature range (-40°C to 85°C) compared to the 553MLF (0°C to 70°C), offering broader environmental capability within the same electrical specifications. Logic level compatibility (LVCMOS and LVTTL support) ensures seamless integration into existing clock distribution circuits designed for CMOS-level signaling.

Frequently Asked Questions (FAQ)

Q: Can NB3L553DG or NB3L553DR2G be used as direct replacements for 553MLF on the same PCB?

A: Yes. Both onsemi parts are pin-compatible and functionally equivalent. The 8-SOIC package footprint is identical, and electrical specifications match across all critical parameters including fanout ratio, frequency, supply voltage, and logic levels.

Q: What is the difference between NB3L553DG and NB3L553DR2G?

A: The electrical specifications are identical. The difference is packaging format: NB3L553DG is supplied in Tube, while NB3L553DR2G is supplied in Cut Tape and Digi-Reel format. Select based on your assembly process requirements.

Q: Are the onsemi substitutes compatible with CMOS logic circuits?

A: Yes. The substitute parts support LVCMOS and LVTTL logic levels, which are compatible with standard CMOS signaling. The 553MLF specifies CMOS input and output, and the onsemi parts maintain this compatibility.

Q: Does the extended temperature range of the onsemi parts affect compatibility?

A: No. The onsemi substitutes operate across -40°C to 85°C, which encompasses the 553MLF operating range of 0°C to 70°C. This extended range does not impact compatibility and may provide additional design margin for temperature-sensitive applications.

Q: Are all three parts RoHS compliant?

A: Yes. The 553MLF and both onsemi substitutes (NB3L553DG and NB3L553DR2G) are ROHS3 compliant.

Q: Can I mix packaging formats in the same production run?

A: Packaging format does not affect electrical performance or board-level functionality. However, assembly process compatibility should be evaluated based on your manufacturing equipment and handling procedures.