553MILF Clock Fanout Buffer - Equivalent & Substitute Parts

Part Overview

The 553MILF is a Clock Fanout Buffer (Distribution) IC manufactured by Renesas Electronics Corporation, designed for 1:4 clock distribution applications with a maximum frequency of 200 MHz. This component operates across a supply voltage range of 2.375V to 5.25V and is housed in an 8-SOIC surface mount package. The part is currently in active production status with ROHS3 compliance and unlimited moisture sensitivity rating (MSL 1).

Substitute parts are identified when equivalent electrical performance, mechanical compatibility, and regulatory compliance can be maintained across different manufacturers while preserving the core functionality of clock distribution in digital systems.

Substiute Parts

553MILF
Renesas Electronics CorporationIn Stock: 1429553MILF Datasheet
553MILF
Current Part
NB3L553DG
onsemiIn Stock: 2437NB3L553DG Datasheet
NB3L553DG
Direct
NB3L553DR2G
onsemiIn Stock: 2771NB3L553DR2G Datasheet
NB3L553DR2G
Direct

Key Parameters

Parameter Specification
Type Fanout Buffer (Distribution)
Number of Circuits 1
Ratio - Input:Output 1:4
Differential - Input:Output No/No
Frequency - Max 200 MHz
Voltage - Supply 2.375V ~ 5.25V
Operating Temperature -40°C ~ 85°C
Package / Case 8-SOIC (0.154", 3.90mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitute parts for the 553MILF are qualified based on the following critical parameters that determine functional and mechanical interchangeability:

Electrical Compatibility Criteria:

  • Fanout Buffer type with 1:4 distribution ratio
  • Maximum frequency of 200 MHz or greater
  • Supply voltage range of 2.375V ~ 5.25V
  • Non-differential input and output configuration
  • Single circuit configuration

Mechanical Compatibility Criteria:

  • 8-SOIC surface mount package with 0.154" (3.90mm) width
  • Pin-to-pin compatible footprint

Regulatory Compliance Criteria:

  • ROHS3 compliance
  • MSL 1 rating
  • Active product status

The substitute parts NB3L553DG and NB3L553DR2G, both manufactured by onsemi, meet all specified electrical and mechanical parameters. These parts maintain identical package geometry, frequency specifications, and supply voltage ranges while offering alternative input/output logic families (LVCMOS, LVTTL) that are compatible with standard CMOS signaling environments.

Parameter Comparison

Parameter 553MILF (Renesas) NB3L553DG (onsemi) NB3L553DR2G (onsemi)
Manufacturer Renesas Electronics Corporation onsemi onsemi
Type Fanout Buffer (Distribution) Fanout Buffer (Distribution) Fanout Buffer (Distribution)
Number of Circuits 1 1 1
Ratio - Input:Output 1:4 1:4 1:4
Differential - Input:Output No/No No/No No/No
Input Logic Family CMOS LVCMOS, LVTTL LVCMOS, LVTTL
Output Logic Family CMOS LVCMOS, LVTTL LVCMOS, LVTTL
Frequency - Max 200 MHz 200 MHz 200 MHz
Voltage - Supply 2.375V ~ 5.25V 2.375V ~ 5.25V 2.375V ~ 5.25V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Package / Case 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width)
Mounting Type Surface Mount Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
Product Status Active Active Active

Engineering Selection Recommendations

All three parts—553MILF, NB3L553DG, and NB3L553DR2G—are active production components with ROHS3 compliance and MSL 1 ratings, qualifying them for equivalent use in clock distribution applications requiring 1:4 fanout at 200 MHz.

The primary distinction between parts lies in packaging format and manufacturer sourcing:

553MILF (Renesas): Standard 8-SOIC package with CMOS input/output specification. Suitable for applications where Renesas component qualification is required or preferred.

NB3L553DG (onsemi): Supplied in Tube packaging. Supports LVCMOS and LVTTL input/output logic families, providing broader compatibility with low-voltage signaling environments.

NB3L553DR2G (onsemi): Supplied in Cut Tape (CT) & Digi-Reel® format. Identical electrical specifications to NB3L553DG with alternative packaging for automated assembly processes.

Selection between onsemi substitutes depends on procurement and assembly requirements rather than electrical performance, as both maintain identical functional specifications.

Frequently Asked Questions (FAQ)

Q: Can NB3L553DG or NB3L553DR2G be used as direct replacements for 553MILF in existing designs?

A: Yes. Both onsemi parts maintain identical package geometry, pin configuration, frequency rating, and supply voltage specifications. The 8-SOIC footprint is mechanically and electrically compatible. LVCMOS and LVTTL logic families are compatible with standard CMOS signaling.

Q: What is the difference between NB3L553DG and NB3L553DR2G?

A: Both parts are electrically identical with the same 1:4 fanout buffer specifications and 200 MHz maximum frequency. The difference is packaging format: NB3L553DG is supplied in Tube packaging, while NB3L553DR2G is supplied in Cut Tape (CT) & Digi-Reel® format. Selection depends on assembly process requirements.

Q: Are all three parts suitable for -40°C to 85°C operating temperature range applications?

A: Yes. All three parts specify identical operating temperature ranges of -40°C to 85°C, making them suitable for industrial and commercial temperature environments.

Q: Do the onsemi substitutes require any design modifications?

A: No design modifications are required. The LVCMOS and LVTTL input/output specifications of the onsemi parts are compatible with CMOS signaling levels across the specified supply voltage range of 2.375V to 5.25V.

Q: Are all parts RoHS compliant?

A: Yes. All three parts carry ROHS3 compliance certification and are suitable for applications requiring lead-free component qualification.

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