TE Connectivity AMP Connectors 534236-3 Equivalent & Substitute Parts

Part Overview

The TE Connectivity AMP Connectors 534236-3 is a 6 Position Receptacle connector with 0.100" (2.54mm) pitch, designed for board-to-board applications with bottom or top entry configuration. This connector features gold-plated mating contacts and through-hole solder termination with push-pull fastening. The part is classified as obsolete, necessitating identification of active equivalent and substitute components that maintain functional compatibility while offering current product availability and compliance status.

Substiute Parts

534236-3

TE Connectivity AMP ConnectorsIn Stock: 916534236-3 Datasheet

Current PartRFQ

0015446806

MolexIn Stock: 8390015446806 Datasheet

SimilarRFQ

89891-303LF

Amphenol ICC (FCI)In Stock: 402289891-303LF Datasheet

SimilarRFQ

ESD-103-G-23

Samtec Inc.In Stock: 1004ESD-103-G-23 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TE Connectivity 534236-3 is determined by strict alignment of the following critical parameters:

Primary Matching Criteria:

• Number of Positions: 6
• Pitch - Mating: 0.100" (2.54mm)
• Number of Rows: 2
• Row Spacing - Mating: 0.100" (2.54mm)
• Connector Type: Receptacle
• Contact Type: Female Socket
• Mounting Type: Through Hole
• Termination: Solder
• Fastening Type: Push-Pull
• Style: Board to Board or Board to Board/Cable

Secondary Compatibility Parameters:

• Insulation Height: 0.335" to 0.340" (8.51mm to 8.64mm)
• Contact Material: Phosphor Bronze
• Contact Shape: Square or Circular
• Operating Temperature Range: Minimum -40°C to maximum 105°C or greater

The identified substitute parts maintain these critical dimensional and functional parameters. Variations in contact finish (gold versus tin), insulation material composition, and compliance certifications do not affect mechanical or electrical interchangeability for standard board-to-board applications.

Parameter Comparison

Engineering Selection Recommendations

Primary Substitute: Amphenol ICC 89891-303LF

The Amphenol ICC 89891-303LF (Dubox™ series) is the closest functional equivalent to the TE Connectivity 534236-3. This part maintains identical mating pitch (0.100"), position count (6), row configuration (2 rows), and contact finish specification (gold plating at 30.0µin). Both connectors feature bottom or top entry receptacle configuration with push-pull fastening and solder termination. The 89891-303LF is currently in active production status with RoHS compliance and offers superior inventory availability (3948 units in stock). The insulation height differential of 0.005" (0.13mm) falls within acceptable mechanical tolerance for standard board-to-board applications.

Secondary Substitute: Molex 0015446806

The Molex 0015446806 (C-Grid 71850 series) provides functional compatibility with identical pitch, position count, and row spacing. This connector features tin contact finish rather than gold, which represents a material change but maintains electrical performance for general-purpose applications. The part is active and RoHS3 compliant. The tin finish thickness (150.0µin) exceeds the original specification, providing enhanced durability. This option is suitable for applications where contact finish material is not a critical design constraint.

Tertiary Substitute: Samtec ESD-103-G-23

The Samtec ESD-103-G-23 (ESD series) maintains critical dimensional parameters and gold contact finish. This elevated socket configuration offers extended operating temperature range (-55°C to 125°C) compared to the original part. The contact shape differs (circular versus square), and the insulation height is reduced to 0.300" (7.62mm). This part is suitable for applications requiring enhanced thermal performance and is RoHS3 compliant with unlimited moisture sensitivity rating.

Compliance Consideration:

The original TE Connectivity 534236-3 is RoHS non-compliant. All identified substitute parts are RoHS compliant (ROHS3 or equivalent), aligning with current regulatory requirements for new designs and procurement.

Frequently Asked Questions (FAQ)

Q: Can the Molex 0015446806 directly replace the TE Connectivity 534236-3 in existing designs?

A: The Molex 0015446806 maintains identical mating pitch (0.100"), position count (6), row configuration, and mounting type. The primary difference is contact finish material (tin versus gold). For applications where contact finish material is not specified as a critical parameter, direct substitution is mechanically and electrically compatible. Verify design documentation to confirm contact finish requirements.

Q: What is the significance of the insulation height variation between substitute parts?

A: The insulation height variation ranges from 0.300" (Samtec) to 0.340" (TE Connectivity and Molex). This 0.040" maximum difference affects the overall connector profile and stacking height in multi-connector assemblies. For single-connector applications with standard PCB spacing, this variation is typically accommodated within design tolerances. Verify PCB layout and mating connector specifications before selection.

Q: Are all substitute parts compatible with the same mating connectors as the original TE Connectivity part?

A: All identified substitutes maintain the 0.100" (2.54mm) pitch and 6-position configuration, ensuring compatibility with standard 0.100" pitch plug connectors. However, the Samtec ESD-103-G-23 features an elevated socket design, which may affect mating depth and connector engagement characteristics. Confirm mating connector specifications and engagement requirements before final selection.

Q: What is the difference between RoHS non-compliant and RoHS compliant status?

A: The original TE Connectivity 534236-3 is RoHS non-compliant, indicating it may contain restricted substances such as lead in solder or plating materials. All substitute parts are RoHS compliant, meeting current regulatory requirements for electrical and electronic equipment in regulated markets. For new designs and procurement in regulated regions, RoHS-compliant substitutes are required.

Q: Does contact material (Phosphor Bronze versus Beryllium Copper) affect interchangeability?

A: Contact material affects mechanical spring characteristics and electrical conductivity. The Samtec ESD-103-G-23 uses Beryllium Copper contacts, while other parts use Phosphor Bronze. Both materials are suitable for 0.100" pitch connectors and provide adequate contact force and conductivity for standard applications. Material selection does not prevent mechanical interchangeability but may affect contact resistance and durability in high-cycle applications.

Q: What is the impact of insulation material differences (Polyester versus LCP versus Thermoplastic)?

A: Insulation material affects thermal stability, moisture absorption, and dimensional stability. Liquid Crystal Polymer (LCP) and Thermoplastic materials offer superior thermal and moisture performance compared to Polyester. For applications with elevated temperature exposure or high-humidity environments, LCP-based substitutes (Molex 0015446806 or Samtec ESD-103-G-23) provide enhanced reliability. For standard indoor applications, material differences do not affect functional compatibility.

Q: Can the Samtec ESD-103-G-23 be used in applications requiring the original -65°C lower temperature limit?

A: The Samtec ESD-103-G-23 specifies an operating temperature range of -55°C to 125°C, which does not extend to the original -65°C lower limit. For applications requiring operation below -55°C, the Samtec part is not suitable. The Amphenol ICC 89891-303LF and Molex 0015446806 do not specify lower temperature limits in provided documentation. Verify application temperature requirements before final selection.

Q: What packaging format differences exist between substitute parts?

A: The TE Connectivity 534236-3 packaging format is not specified. The Molex 0015446806 is supplied in Tray packaging, while the Amphenol ICC 89891-303LF is supplied in Bulk packaging. The Samtec ESD-103-G-23 packaging format is not specified. Packaging format affects handling, storage, and assembly processes but does not affect connector functionality. Confirm packaging requirements with procurement and assembly specifications.