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TE Connectivity 5-146258-3 Equivalent & Substitute Parts
Part Overview
The TE Connectivity 5-146258-3 is a rectangular connector header classified as a vertical through-hole component with 6 positions arranged in 2 rows at 0.100" (2.54mm) pitch. This connector belongs to the AMPMODU Mod II series and features unshrouded male pin contacts with solder termination and push-pull fastening. The part is currently active in production with 928 units in stock.
Substitute parts are identified when equivalent rectangular connectors share the same critical mating parameters: 6 positions, 2-row configuration, 0.100" (2.54mm) pitch, male pin contact type, through-hole mounting, solder termination, and push-pull fastening. Alternative manufacturers and series options provide functional equivalence for board-to-board or cable applications.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | 5-146258-3 |
| Manufacturer | TE Connectivity AMP Connectors |
| Series | AMPMODU Mod II |
| Category | Rectangular Connectors |
| Connector Type | Header, Breakaway |
| Contact Type | Male Pin |
| Number of Positions | 6 |
| Number of Rows | 2 |
| Pitch - Mating | 0.100" (2.54mm) |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Termination | Solder |
| Fastening Type | Push-Pull |
| Style | Board to Board or Cable |
| Shrouding | Unshrouded |
| Current Rating | 3A |
| Operating Temperature | -65°C ~ 105°C |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
| Product Status | Active |
Substitute Part Grouping Explanation
Substitute parts for the TE Connectivity 5-146258-3 are identified based on strict equivalence of the following critical parameters:
Core Mating Parameters (Non-Negotiable):
- Number of Positions: 6
- Number of Rows: 2
- Pitch - Mating: 0.100" (2.54mm)
- Row Spacing - Mating: 0.100" (2.54mm)
- Contact Type: Male Pin
- Mounting Type: Through Hole
- Termination: Solder
- Fastening Type: Push-Pull
- Style: Board to Board or Cable
- Shrouding: Unshrouded
Acceptable Variations:
- Connector Type: Header or Header, Breakaway
- Contact Finish: Tin or Gold (both acceptable for electrical continuity)
- Contact Material: Copper Alloy or Phosphor Bronze
- Insulation Material: Liquid Crystal Polymer (LCP), with or without glass fill, or Polybutylene Terephthalate (PBT)
- Insulation Color: Black or Natural
- Packaging: Bulk or Bag
- Operating Temperature Range: Must encompass or exceed -65°C to 105°C minimum
- Material Flammability Rating: UL94 V-0 required
- RoHS Compliance: RoHS Compliant or ROHS3 Compliant acceptable
Substitute parts from Molex (C-Grid 70280 and C-Grid 70287 series), Amphenol ICC/FCI (BERGSTIK® II series), and Samtec Inc. (TSW and HTSW series) meet these criteria and are listed below.
Parameter Comparison
| Parameter | 5-146258-3 (TE) | 0010897060 (Molex) | 0010897061 (Molex) | 0010897062 (Molex) | 0702871001 (Molex) | 68602-106HLF (Amphenol) | 69192-106HLF (Amphenol) | 69192-406HLF (Amphenol) | HTSW-103-07-G-D (Samtec) | TSW-103-07-F-D (Samtec) | TSW-103-08-G-D (Samtec) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Manufacturer | TE Connectivity | Molex | Molex | Molex | Molex | Amphenol ICC (FCI) | Amphenol ICC (FCI) | Amphenol ICC (FCI) | Samtec Inc. | Samtec Inc. | Samtec Inc. |
| Series | AMPMODU Mod II | C-Grid 70280 | C-Grid 70280 | C-Grid 70280 | C-Grid 70287 | BERGSTIK® II | BERGSTIK® II | BERGSTIK® II | HTSW | TSW | TSW |
| Number of Positions | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| Number of Rows | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Row Spacing - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Type | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin |
| Connector Type | Header, Breakaway | Header, Breakaway | Header, Breakaway | Header, Breakaway | Header, Breakaway | Header | Header | Header | Header | Header | Header |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole |
| Termination | Solder | Solder | Solder | Solder | Kinked Pin, Solder | Solder | Kinked Pin, Solder | Kinked Pin, Solder | Solder | Solder | Solder |
| Fastening Type | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull |
| Style | Board to Board or Cable | Board to Board or Cable | Board to Board or Cable | Board to Board or Cable | Board to Board or Cable | Board to Board | Board to Board | Board to Board | Board to Board or Cable | Board to Board or Cable | Board to Board or Cable |
| Shrouding | Unshrouded | Unshrouded | Unshrouded | Unshrouded | Unshrouded | Unshrouded | Unshrouded | Unshrouded | Unshrouded | Unshrouded | Unshrouded |
| Contact Finish - Mating | Tin | Gold | Tin | Gold | Tin | Gold or Gold, GXT™ | Gold or Gold, GXT™ | Tin | Gold | Gold | Gold |
| Contact Material | Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy | Phosphor Bronze | Phosphor Bronze | Phosphor Bronze | Phosphor Bronze | Phosphor Bronze | Phosphor Bronze |
| Insulation Material | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP), Glass Filled | Liquid Crystal Polymer (LCP), Glass Filled | Liquid Crystal Polymer (LCP), Glass Filled | Liquid Crystal Polymer (LCP), Glass Filled | Not specified | Not specified | Not specified | Liquid Crystal Polymer (LCP) | Polybutylene Terephthalate (PBT) | Polybutylene Terephthalate (PBT) |
| Insulation Color | Black | Black | Black | Black | Black | Black | Black | Black | Natural | Black | Black |
| Current Rating (Amps) | 3A | Not specified | Not specified | Not specified | Not specified | 3A | 3A | 3A | Varies by Wire Gauge | Not specified | Not specified |
| Operating Temperature | -65°C ~ 105°C | Not specified | Not specified | Not specified | Not specified | -65°C ~ 130°C | -65°C ~ 130°C | -65°C ~ 130°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 |
| RoHS Status | RoHS Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| Product Status | Active | Active | Active | Active | Active | Active | Active | Active | Active | Active | Active |
Engineering Selection Recommendations
All listed substitute parts are active products with current manufacturing status. Selection among equivalent parts should be based on the following criteria:
Compliance and Certification: All substitute parts meet UL94 V-0 material flammability requirements and maintain Moisture Sensitivity Level 1 (Unlimited) classification, matching the original TE Connectivity 5-146258-3 specification. RoHS compliance is maintained across all options, with Molex and Samtec parts offering ROHS3 Compliant status.
Operating Temperature Considerations: The original part operates from -65°C to 105°C. Amphenol ICC (FCI) BERGSTIK® II series parts (68602-106HLF, 69192-106HLF, 69192-406HLF) extend the upper temperature limit to 130°C. Samtec TSW and HTSW series parts operate from -55°C to 125°C, which covers the original specification range with extended upper temperature capability. Molex C-Grid series parts do not specify operating temperature ranges.
Contact Finish and Material: The original part features tin-plated copper alloy contacts. Substitute parts offer both tin and gold plating options. Gold-plated contacts (Molex 0010897060, 0010897062; Amphenol 68602-106HLF, 69192-106HLF; Samtec HTSW-103-07-G-D, TSW-103-07-F-D, TSW-103-08-G-D) provide enhanced corrosion resistance. Tin-plated options (Molex 0010897061; Amphenol 69192-406HLF) maintain cost efficiency. Phosphor bronze contacts in Amphenol and Samtec parts offer superior spring characteristics compared to copper alloy.
Termination Variations: Standard solder termination is available across all substitutes. Kinked pin solder termination (Molex 0702871001; Amphenol 69192-106HLF, 69192-406HLF) provides enhanced mechanical retention during PCB assembly.
Inventory Availability: Samtec TSW-103-07-F-D offers the highest inventory level (9,136 units). Molex 0010897062 provides 5,278 units. Amphenol ICC (FCI) 69192-406HLF stocks 2,267 units. All parts maintain active production status.
Frequently Asked Questions (FAQ)
Q: Can I substitute the TE Connectivity 5-146258-3 with any of the listed Molex C-Grid parts?
A: Yes. Molex parts 0010897060, 0010897061, and 0010897062 from the C-Grid 70280 series are direct functional equivalents. All three share identical mating pitch (0.100"), position count (6 in 2 rows), contact type (male pin), mounting method (through-hole solder), and fastening mechanism (push-pull). The primary differences are contact finish (gold or tin) and contact length variations. Molex 0702871001 from the C-Grid 70287 series is also equivalent but features kinked pin termination for enhanced mechanical retention.
Q: What is the difference between tin and gold contact finishes?
A: Both tin and gold finishes provide electrical conductivity and are acceptable for the 3A current rating. Gold plating offers superior corrosion resistance and is preferred in high-reliability or harsh environment applications. Tin plating is cost-effective and suitable for standard industrial applications. The choice depends on application requirements and environmental exposure.
Q: Are Amphenol ICC (FCI) BERGSTIK® II parts compatible with the TE Connectivity 5-146258-3?
A: Yes. Amphenol ICC (FCI) parts 68602-106HLF, 69192-106HLF, and 69192-406HLF are functionally equivalent. All maintain the 0.100" (2.54mm) pitch, 6-position 2-row configuration, male pin contacts, through-hole mounting, and push-pull fastening. These parts feature phosphor bronze contacts instead of copper alloy and extend the operating temperature range to -65°C to 130°C. Amphenol parts are rated for 3A current, matching the original specification.
Q: What are the key differences between Samtec TSW and HTSW series headers?
A: Both Samtec TSW and HTSW series maintain the required 0.100" (2.54mm) pitch and 6-position 2-row configuration. The primary differences are insulation material (TSW uses Polybutylene Terephthalate/PBT; HTSW uses Liquid Crystal Polymer/LCP) and contact post length. TSW-103-07-F-D has a 0.100" post length, while TSW-103-08-G-D has a 0.200" post length for deeper PCB penetration. HTSW-103-07-G-D features a 0.100" post length with LCP insulation. All operate from -55°C to 125°C and feature gold-plated phosphor bronze contacts.
Q: Do all substitute parts have the same insulation height?
A: No. The original TE Connectivity 5-146258-3 has an insulation height of 0.090" (2.29mm). Amphenol ICC (FCI) BERGSTIK® II parts feature 0.100" (2.54mm) insulation height. Samtec parts also feature 0.100" (2.54mm) insulation height. Molex C-Grid parts maintain 0.090" (2.29mm) insulation height. This variation affects PCB clearance and should be verified during board layout design.
Q: Are all substitute parts RoHS compliant?
A: Yes. All listed substitute parts are RoHS compliant. TE Connectivity and Amphenol ICC (FCI) parts carry RoHS Compliant status. Molex and Samtec parts carry ROHS3 Compliant status, which represents the current RoHS directive compliance standard. Both compliance levels are acceptable for equivalent substitution.
Q: What is the significance of kinked pin termination?
A: Kinked pin termination (featured in Molex 0702871001 and Amphenol 69192-106HLF, 69192-406HLF) provides enhanced mechanical retention during PCB assembly and reflow soldering. The kinked design prevents the pin from backing out during thermal cycling or mechanical stress. Standard straight pin termination (featured in other substitutes) is suitable for standard assembly processes. Selection depends on assembly process robustness requirements.
Q: Can I use these connectors in automotive applications?
A: Molex C-Grid 70280 and 70287 series parts explicitly list automotive applications. Amphenol ICC (FCI) BERGSTIK® II parts list automotive, general purpose, lighting, medical, and telecommunications applications. Samtec TSW and HTSW series do not specify application categories in the provided data. All parts meet UL94 V-0 flammability requirements suitable for automotive use. Verify specific automotive qualification requirements with the connector manufacturer if needed.
Q: What is the current rating for each substitute part?
A: The original TE Connectivity 5-146258-3 is rated for 3A. Amphenol ICC (FCI) BERGSTIK® II parts (68602-106HLF, 69192-106HLF, 69192-406HLF) are also rated for 3A. Samtec HTSW-103-07-G-D is rated as "Varies by Wire Gauge," indicating current capacity depends on the wire gauge used in the mating connector. Molex C-Grid parts do not specify current ratings in the provided data. For applications requiring the full 3A rating, Amphenol parts provide explicit confirmation.
Q: Are there packaging differences among the substitute parts?
A: Yes. The original TE Connectivity 5-146258-3 is supplied in Bulk packaging. Molex parts are supplied in Bulk (0010897060, 0010897061, 0010897062, 0702871001). Amphenol ICC (FCI) parts are supplied in Bag (68602-106HLF, 69192-406HLF) or Bulk (69192-106HLF). Samtec parts are supplied in Bag (HTSW-103-07-G-D, TSW-103-07-F-D) or Bulk (TSW-103-08-G-D). Packaging affects handling and storage but does not impact electrical or mechanical function.
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