Amphenol ICC 50006-1165C High Density Backplane Connector Header

Part Overview

The Amphenol ICC 50006-1165C is a 165-position high-density backplane connector header designed for daughtercard applications. This component features male pins with through-hole press-fit termination and is manufactured to UL94 V-0 flammability standards. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support and procurement planning.

Substiute Parts

50006-1165C

Amphenol ICC (FCI)In Stock: 85950006-1165C Datasheet

Current PartRFQ

50006-1165CLF

Amphenol ICC (FCI)In Stock: 89550006-1165CLF Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the 50006-1165C is determined by strict equivalence across the following critical parameters:

• Connector Position Count: 165 positions (non-negotiable)
• Pitch Specification: 0.100" (2.54mm) center-to-center spacing
• Physical Configuration: 3 rows × 55 columns arrangement
• Connector Type and Gender: Header with male pins
• Mounting Technology: Through-hole press-fit termination
• Contact Material and Finish: Gold plating at 30.0µin (0.76µm) thickness
• Mechanical Housing: Black high-density connector body
• Flammability Compliance: UL94 V-0 rating
• Moisture Sensitivity: MSL 1 classification

Only components matching all these parameters across electrical and mechanical specifications qualify as direct substitutes.

Parameter Comparison

Engineering Selection Recommendations

The 50006-1165CLF serves as the direct functional equivalent to the obsolete 50006-1165C. Both components are manufactured by Amphenol ICC within the HPC™ series and maintain identical electrical and mechanical specifications across all critical parameters: 165-position configuration, 0.100" pitch, 3×55 row-column arrangement, through-hole press-fit termination, and UL94 V-0 flammability rating.

The primary distinction between these parts is product lifecycle status and regulatory compliance. The 50006-1165C is classified as obsolete, while the 50006-1165CLF maintains active production status. Additionally, the 50006-1165CLF carries RoHS compliance certification, whereas the original part does not. For new designs or system refreshes, the 50006-1165CLF is the appropriate selection. For legacy system maintenance requiring exact historical equivalence, the 50006-1165C remains functionally interchangeable where inventory permits.

Frequently Asked Questions (FAQ)

Q: Can the 50006-1165CLF be used as a direct replacement for the 50006-1165C in existing assemblies?

A: Yes. Both components share identical electrical and mechanical specifications across all critical parameters including position count, pitch, row-column configuration, termination method, contact finish, and flammability rating. The components are mechanically and electrically interchangeable.

Q: What is the significance of the "LF" suffix in the part number 50006-1165CLF?

A: The "LF" designation indicates lead-free construction and RoHS compliance. This represents a manufacturing variant of the base 50006 series that meets current environmental and regulatory standards while maintaining full compatibility with the original design.

Q: Are there any differences in PCB footprint or mounting hole patterns between these parts?

A: No. Both the 50006-1165C and 50006-1165CLF maintain identical through-hole press-fit mounting specifications, pitch geometry, and physical dimensions. PCB layouts designed for either component are directly compatible with the other.

Q: Why is the 50006-1165C classified as obsolete?

A: Product obsolescence typically reflects manufacturer lifecycle decisions and the transition to lead-free, RoHS-compliant variants. The 50006-1165CLF represents the current production equivalent within the HPC™ series.

Q: What is the Moisture Sensitivity Level (MSL) 1 rating?

A: MSL 1 indicates unlimited shelf life without moisture control requirements. Components with this rating do not require special storage conditions or baking procedures prior to assembly.