335HSM050M Equivalent & Substitute Parts Reference

Part Overview

The 335HSM050M is a 3.3 µF, 50 V aluminum electrolytic capacitor in radial, can package manufactured by Cornell Dubilier / Illinois Capacitor. This component is classified as obsolete product status. The HSM series capacitor is designed for general purpose applications requiring polar electrolytic capacitance with ±20% tolerance and through-hole mounting configuration. Due to obsolete status, equivalent substitute parts from active product lines are necessary for ongoing procurement and design continuity.

Substiute Parts

335HSM050M

Cornell Dubilier / Illinois CapacitorIn Stock: 978335HSM050M Datasheet

Current PartRFQ

200LEX3.3MEFC6.3X11

RubyconIn Stock: 1075200LEX3.3MEFC6.3X11 Datasheet

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400LEX3.3MEFC8X11.5

RubyconIn Stock: 2603400LEX3.3MEFC8X11.5 Datasheet

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400LEX3R3MEFC8X11.5

RubyconIn Stock: 744400LEX3R3MEFC8X11.5 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the 335HSM050M are selected based on the following critical parameters that determine functional equivalence:

Core Matching Criteria:

• Capacitance: 3.3 µF (exact match required)
• Tolerance: ±20% (exact match required)
• Polarization: Polar (exact match required)
• Mounting Type: Through Hole (exact match required)
• Package / Case: Radial, Can (exact match required)
• Operating Temperature Range: -40°C ~ 125°C (exact match required)

Allowable Variations:

• Voltage - Rated: Substitute parts may have equal or higher voltage rating than the original 50 V specification
• Physical dimensions: Lead spacing and case diameter must remain compatible with PCB layout; height may vary within mechanical constraints
• Lifetime @ Temp.: Substitute parts may have equal or longer operational lifetime
• Ripple Current: Substitute parts may have equal or higher ripple current capability

The three substitute parts listed (200LEX3.3MEFC6.3X11, 400LEX3.3MEFC8X11.5, 400LEX3R3MEFC8X11.5) all meet the core matching criteria. Voltage ratings are higher (200 V and 400 V respectively), providing enhanced electrical margin. All substitutes are from the active Rubycon LEX series product line.

Parameter Comparison

Engineering Selection Recommendations

Substitute Selection Basis:

All three substitute parts are from the active Rubycon LEX series and carry ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment for current manufacturing standards.

200LEX3.3MEFC6.3X11 Considerations: This substitute provides 200 V rated voltage with smaller physical dimensions (0.248" diameter, 2.50mm lead spacing). The reduced lead spacing may require PCB layout modification if the original 0.138" (3.50mm) spacing was utilized. This part offers 4000 Hrs @ 125°C lifetime, doubling the original specification. Selection is appropriate when PCB space constraints permit smaller component footprint and lead spacing adjustment is feasible.

400LEX3.3MEFC8X11.5 and 400LEX3R3MEFC8X11.5 Considerations: Both 400 V rated substitutes maintain identical lead spacing (0.138" / 3.50mm) and case diameter (0.315" / 8.00mm) as the original part, enabling direct PCB footprint compatibility. Height increases marginally from 0.512" to 0.531" (13.50mm maximum). Both provide 5000 Hrs @ 125°C lifetime. The 400LEX3R3MEFC8X11.5 variant includes high-frequency ripple current specification (94 mA @ 100 kHz), providing additional performance data for applications with AC ripple content.

Recommendation Logic: Selection between substitutes depends on PCB layout constraints and application voltage margin requirements. For direct footprint replacement without layout modification, the 400 V rated parts (400LEX3.3MEFC8X11.5 or 400LEX3R3MEFC8X11.5) are preferred. The 200 V part requires lead spacing verification and potential PCB rework.

Frequently Asked Questions (FAQ)

Q: Can 200LEX3.3MEFC6.3X11 be used as a direct replacement for 335HSM050M?

A: Electrical substitution is valid (3.3 µF, ±20%, polar, through-hole, radial can package). However, the lead spacing differs (0.098" vs. 0.138"). PCB layout verification is required to confirm whether the reduced spacing accommodates existing pad patterns. If pad spacing is incompatible, PCB modification or rework is necessary.

Q: What is the advantage of using 400 V rated substitutes instead of 50 V?

A: Higher voltage rating provides increased electrical margin and stress relief in the application circuit. The 400 V substitutes (400LEX3.3MEFC8X11.5 and 400LEX3R3MEFC8X11.5) maintain identical lead spacing and case diameter as the original 335HSM050M, enabling direct PCB footprint compatibility without layout modification.

Q: Are all substitute parts RoHS compliant?

A: Yes. All three substitute parts (200LEX3.3MEFC6.3X11, 400LEX3.3MEFC8X11.5, 400LEX3R3MEFC8X11.5) are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements for electronic component manufacturing and distribution.

Q: What is the difference between 400LEX3.3MEFC8X11.5 and 400LEX3R3MEFC8X11.5?

A: Both parts share identical electrical specifications (3.3 µF, 400 V, ±20%, 5000 Hrs @ 125°C) and physical dimensions. The 400LEX3R3MEFC8X11.5 includes documented high-frequency ripple current specification (94 mA @ 100 kHz), providing additional performance characterization for applications with AC ripple content at elevated frequencies.

Q: Can the height difference (0.512" vs. 0.531") affect PCB assembly?

A: The height increase of 0.019" (0.50mm) is marginal. Verify clearance with adjacent components and PCB enclosure constraints. For most applications, this variation is within standard mechanical tolerance and does not require design modification.

Q: What is the lifetime advantage of substitute parts?

A: The original 335HSM050M specifies 2000 Hrs @ 125°C. Substitute parts provide 4000 Hrs (200LEX3.3MEFC6.3X11) or 5000 Hrs (400 V variants) at the same temperature, representing 2x to 2.5x improvement in rated operational lifetime.

Q: Are substitute parts available in the same packaging format?

A: Yes. All substitute parts are through-hole mounted, radial can package components. Packaging format (Bulk) differs from the original, but component form factor and mounting method are identical.