Equivalent & Substitute Parts for 2SC4604,F(J

Part Overview

The 2SC4604,F(J is an NPN bipolar junction transistor manufactured by Toshiba Semiconductor and Storage, designed for general-purpose switching and amplification applications. This through-hole component operates at 50 V collector-emitter breakdown voltage with a maximum collector current of 3 A and power dissipation of 900 mW. The device is classified as obsolete, necessitating identification of active substitute components that maintain electrical and mechanical compatibility for existing designs and new production requirements.

Substiute Parts

2SC4604,F(J
Toshiba Semiconductor and StorageIn Stock: 8782SC4604,F(J Datasheet
2SC4604,F(J
Current Part
2SC5712(TE12L,F)
Toshiba Semiconductor and StorageIn Stock: 20572SC5712(TE12L,F) Datasheet
2SC5712(TE12L,F)
Similar

Key Parameters

Parameter Value Unit
Transistor Type NPN
Voltage - Collector Emitter Breakdown (Max) 50 V
Current - Collector (Ic) (Max) 3 A
Power - Max 900 mW
Frequency - Transition 100 MHz
Operating Temperature (TJ) 150 °C
Current - Collector Cutoff (Max) 100 nA
Mounting Type Through Hole

Substitute Part Grouping Explanation

Substitution of the 2SC4604,F(J is determined by equivalence across the following critical electrical parameters: NPN transistor type, 50 V maximum collector-emitter breakdown voltage, 3 A maximum collector current, and 100 nA maximum collector cutoff current. These parameters establish the functional operating envelope for the device in switching and amplification circuits.

The 2SC5712(TE12L,F meets all core electrical requirements: identical NPN type, 50 V breakdown voltage, 3 A collector current rating, and 100 nA cutoff current specification. The substitute provides enhanced power dissipation capability (1 W versus 900 mW) and improved DC current gain characteristics, offering superior performance margins in equivalent circuit applications.

Substitution is valid where the mounting technology transition from through-hole to surface-mount is acceptable within the design and manufacturing constraints of the application.

Parameter Comparison

Parameter 2SC4604,F(J 2SC5712(TE12L,F) Unit
Transistor Type NPN NPN
Voltage - Collector Emitter Breakdown (Max) 50 50 V
Current - Collector (Ic) (Max) 3 3 A
Current - Collector Cutoff (Max) 100 100 nA
Power - Max 900 1000 mW
Operating Temperature (TJ) 150 150 °C
Mounting Type Through Hole Surface Mount
Package / Case TO-226-3, TO-92-3 Long Body TO-243AA
Product Status Obsolete Active

Engineering Selection Recommendations

The 2SC5712(TE12L,F serves as the primary substitute for the obsolete 2SC4604,F(J based on electrical parameter equivalence and active product status. The substitute maintains all critical voltage and current specifications required for circuit functionality while providing enhanced power dissipation capability.

The 2SC5712(TE12L,F is RoHS3 compliant and carries active manufacturing status with 2000 units in stock, ensuring long-term availability and supply chain continuity. The transition from through-hole TO-92MOD packaging to surface-mount PW-MINI packaging requires corresponding modifications to printed circuit board layout and assembly processes.

Selection of the 2SC5712(TE12L,F is appropriate for new designs and production transitions where surface-mount technology is implemented. For applications requiring through-hole mounting, alternative through-hole NPN transistors with equivalent electrical parameters must be evaluated.

Frequently Asked Questions (FAQ)

Q: What electrical parameters must match between the 2SC4604,F(J and its substitute?

A: The substitute must maintain NPN transistor type, 50 V maximum collector-emitter breakdown voltage, 3 A maximum collector current, and 100 nA maximum collector cutoff current. These parameters define the functional operating range and circuit compatibility.

Q: Can the 2SC5712(TE12L,F directly replace the 2SC4604,F(J in existing through-hole designs?

A: No. The 2SC5712(TE12L,F uses surface-mount PW-MINI packaging (TO-243AA) while the 2SC4604,F(J uses through-hole TO-92MOD packaging. Direct board-level substitution requires PCB redesign and assembly process modification.

Q: What is the significance of the improved DC current gain in the 2SC5712(TE12L,F?

A: The 2SC5712(TE12L,F exhibits higher DC current gain (400 @ 300mA, 2V versus 120 @ 100mA, 2V), providing improved switching efficiency and reduced base drive requirements in circuit applications.

Q: Does the increased power rating of the 2SC5712(TE12L,F affect circuit design?

A: The 1 W power rating of the 2SC5712(TE12L,F exceeds the 900 mW specification of the 2SC4604,F(J, providing additional thermal margin. This enhancement does not require circuit redesign but improves reliability in power-dissipative applications.

Q: Are there compliance differences between the two devices?

A: The 2SC5712(TE12L,F is RoHS3 compliant with active product status. The 2SC4604,F(J is classified as obsolete. Both devices carry EAR99 export classification and unlimited moisture sensitivity level (MSL 1).

Q: What packaging considerations apply when transitioning from 2SC4604,F(J to 2SC5712(TE12L,F?

A: The transition requires conversion from through-hole TO-92-3 Long Body to surface-mount TO-243AA (PW-MINI) packaging. This involves PCB layout modification, solder reflow process implementation, and assembly equipment compatibility verification.

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