2SC3668-Y,T2F(J Equivalent & Substitute Parts

Part Overview

The 2SC3668-Y,T2F(J is an NPN bipolar junction transistor manufactured by Toshiba Semiconductor and Storage, rated for 50V collector-emitter breakdown voltage and 2A maximum collector current. This component is classified as obsolete, necessitating identification of active substitute parts for new designs and ongoing production requirements. The through-hole MSTM package configuration and 1W power rating establish the baseline specifications for equivalent component selection.

Substiute Parts

2SC3668-Y,T2F(J
Toshiba Semiconductor and StorageIn Stock: 8292SC3668-Y,T2F(J Datasheet
2SC3668-Y,T2F(J
Current Part
2SC5712(TE12L,F)
Toshiba Semiconductor and StorageIn Stock: 20572SC5712(TE12L,F) Datasheet
2SC5712(TE12L,F)
Similar

Key Parameters

Parameter Value Unit
Transistor Type NPN
Voltage - Collector Emitter Breakdown (Max) 50 V
Current - Collector (Ic) (Max) 2 A
Power - Max 1 W
Vce Saturation (Max) 500 mV @ 50mA, 1A
DC Current Gain (hFE) (Min) 70 @ 500mA, 2V
Frequency - Transition 100 MHz
Operating Temperature (TJ) 150 °C
Mounting Type Through Hole
Package / Case SC-71

Substitute Part Grouping Explanation

Substitution of the 2SC3668-Y,T2F(J is determined by electrical parameter compatibility within the NPN transistor category. The critical parameters governing substitution are:

Electrical Compatibility Criteria:

  • Transistor Type: NPN (required match)
  • Voltage - Collector Emitter Breakdown (Max): 50V minimum
  • Current - Collector (Ic) (Max): Equal to or greater than 2A
  • Power - Max: Equal to or greater than 1W
  • Operating Temperature: 150°C or higher

The 2SC5712(TE12L,F) satisfies these electrical requirements with a 50V breakdown voltage rating, 3A maximum collector current (exceeding the 2A requirement), and 1W power rating. Both components operate at 150°C maximum junction temperature.

Mechanical and Packaging Considerations: The 2SC3668-Y,T2F(J utilizes through-hole mounting in SC-71 package configuration. The 2SC5712(TE12L,F) employs surface-mount technology in TO-243AA package. This represents a packaging technology transition from through-hole to surface-mount, requiring circuit board redesign and assembly process modification.

Parameter Comparison

Parameter 2SC3668-Y,T2F(J 2SC5712(TE12L,F) Compatibility
Transistor Type NPN NPN Match
Voltage - Collector Emitter Breakdown (Max) 50 V 50 V Match
Current - Collector (Ic) (Max) 2 A 3 A Substitute exceeds requirement
Power - Max 1 W 1 W Match
Vce Saturation (Max) 500 mV @ 50mA, 1A 140 mV @ 20mA, 1A Substitute has lower saturation voltage
DC Current Gain (hFE) (Min) 70 @ 500mA, 2V 400 @ 300mA, 2V Substitute has higher gain
Operating Temperature (TJ) 150 °C 150 °C Match
Mounting Type Through Hole Surface Mount Different technology
Package / Case SC-71 TO-243AA Different package
Product Status Obsolete Active Substitute is current production

Engineering Selection Recommendations

The 2SC5712(TE12L,F) is the identified substitute for the obsolete 2SC3668-Y,T2F(J based on electrical parameter alignment and active product status.

Electrical Suitability: The 2SC5712(TE12L,F) meets all critical electrical specifications. The 50V breakdown voltage matches the original component. The 3A maximum collector current exceeds the 2A requirement, providing operational margin. The 1W power rating is equivalent. Both components operate at 150°C maximum junction temperature.

Performance Characteristics: The 2SC5712(TE12L,F) exhibits superior electrical performance in saturation voltage (140mV versus 500mV) and DC current gain (400 versus 70 minimum). These improvements result in lower power dissipation and enhanced switching characteristics.

Product Availability and Compliance: The 2SC5712(TE12L,F) is classified as active product with 2000 units in stock inventory, ensuring supply continuity. The substitute component is RoHS3 compliant, meeting current environmental and regulatory requirements applicable to electronic components.

Implementation Constraints: Substitution requires circuit board redesign due to packaging technology transition from through-hole SC-71 to surface-mount TO-243AA. Assembly process modification is necessary to accommodate surface-mount soldering techniques. Pin configuration and electrical connectivity must be verified against specific circuit requirements prior to implementation.

Frequently Asked Questions (FAQ)

Q: Can the 2SC5712(TE12L,F) directly replace the 2SC3668-Y,T2F(J in existing through-hole circuit boards?

A: No. The 2SC5712(TE12L,F) is a surface-mount component in TO-243AA package, while the 2SC3668-Y,T2F(J is a through-hole component in SC-71 package. Direct board-level substitution is not possible without circuit board redesign and assembly process modification.

Q: What are the electrical advantages of the 2SC5712(TE12L,F) substitute?

A: The 2SC5712(TE12L,F) provides lower saturation voltage (140mV versus 500mV) and higher DC current gain (400 minimum versus 70 minimum). These characteristics result in reduced power dissipation and improved switching performance in circuit applications.

Q: Are both components rated for the same maximum operating temperature?

A: Yes. Both the 2SC3668-Y,T2F(J and 2SC5712(TE12L,F) are rated for 150°C maximum junction temperature (TJ).

Q: Does the higher collector current rating of the 2SC5712(TE12L,F) affect circuit compatibility?

A: The 3A maximum collector current rating of the 2SC5712(TE12L,F) exceeds the 2A requirement of the original 2SC3668-Y,T2F(J. This provides operational margin and does not create compatibility issues in circuits designed for the original 2A specification.

Q: What compliance certifications apply to the substitute component?

A: The 2SC5712(TE12L,F) is RoHS3 compliant, meeting current environmental and regulatory requirements for electronic components.

Q: Is the 2SC5712(TE12L,F) available in the same packaging format as the original component?

A: No. The 2SC5712(TE12L,F) is supplied in Cut Tape (CT) and Digi-Reel packaging for surface-mount assembly, whereas the 2SC3668-Y,T2F(J was supplied in through-hole format. Packaging format selection depends on assembly process requirements.

Request Quote (Ships tomorrow)