2KBP005M-E4/51 Bridge Rectifier Equivalent & Substitute Parts

Part Overview

The 2KBP005M-E4/51 is a single-phase bridge rectifier manufactured by Vishay General Semiconductor - Diodes Division, rated for 50 V peak reverse voltage and 2 A average rectified current in a through-hole KBPM package. This component is classified as obsolete, making equivalent substitutes necessary for new designs and ongoing production requirements. Substitute parts must maintain electrical compatibility across voltage, current, and thermal specifications while accommodating packaging and availability constraints.

Substiute Parts

2KBP005M-E4/51
Vishay General Semiconductor - Diodes DivisionIn Stock: 12512KBP005M-E4/51 Datasheet
2KBP005M-E4/51
Current Part
KBP005G
Diodes IncorporatedIn Stock: 2155KBP005G Datasheet
KBP005G
MFR Recommended
KBP2005G
SMC Diode SolutionsIn Stock: 3481KBP2005G Datasheet
KBP2005G
MFR Recommended

Key Parameters

Parameter Value
Voltage - Peak Reverse (Max) 50 V
Current - Average Rectified (Io) 2 A
Voltage - Forward (Vf) (Max) @ If 1.1 V @ 3.14 A
Current - Reverse Leakage @ Vr 5 µA @ 50 V
Operating Temperature Range -55°C ~ 165°C (TJ)
Mounting Type Through Hole
Package / Case 4-SIP, KBPM
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the 2KBP005M-E4/51 is determined by the following critical parameters:

Voltage Rating: Peak reverse voltage must equal or exceed 50 V to maintain circuit protection and reliability.

Current Rating: Average rectified current must meet or exceed 2 A to handle the design load without thermal stress.

Forward Voltage Drop: Maximum forward voltage at rated current must not exceed 1.1 V to preserve circuit efficiency and thermal margins.

Reverse Leakage: Maximum reverse leakage at rated voltage must not exceed 5 µA to maintain rectifier integrity.

Mounting Configuration: Through-hole mounting is required for mechanical compatibility with existing PCB layouts.

Thermal Range: Operating temperature range must encompass the application's thermal requirements.

Compliance: RoHS3 compliance is mandatory for regulatory alignment.

Two substitute parts meet these criteria: KBP005G (Diodes Incorporated) and KBP2005G (SMC Diode Solutions). Both maintain the 50 V voltage rating, through-hole mounting, and RoHS3 compliance. KBP2005G matches the 2 A current rating exactly, while KBP005G operates at 1.5 A, representing a reduced-current alternative suitable for applications with lower current demands.

Parameter Comparison

Parameter 2KBP005M-E4/51 (Main) KBP005G (Substitute) KBP2005G (Substitute)
Manufacturer Vishay General Semiconductor Diodes Incorporated SMC Diode Solutions
Product Status Obsolete Active Active
Voltage - Peak Reverse (Max) 50 V 50 V 50 V
Current - Average Rectified (Io) 2 A 1.5 A 2 A
Voltage - Forward (Vf) (Max) @ If 1.1 V @ 3.14 A 1.1 V @ 1.5 A 1.1 V @ 2 A
Current - Reverse Leakage @ Vr 5 µA @ 50 V 5 µA @ 50 V 5 µA @ 50 V
Operating Temperature Range -55°C ~ 165°C (TJ) -65°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Through Hole Through Hole Through Hole
Package / Case 4-SIP, KBPM 4-SIP, KBP 4-ESIP
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

KBP2005G (Primary Substitute): This part is the direct functional equivalent, matching the 2 A current rating and maintaining identical voltage and leakage specifications. Manufactured by SMC Diode Solutions with active product status, it provides continuity for designs requiring full 2 A capacity. The 4-ESIP package differs from the original KBPM, requiring PCB layout verification. Operating temperature range extends to 150°C, which is 15°C lower than the original specification; applications operating above 150°C require thermal analysis. REACH status is affected, necessitating compliance verification for regulated markets.

KBP005G (Secondary Substitute): This part is suitable for applications with current requirements of 1.5 A or less. Manufactured by Diodes Incorporated with active product status, it maintains the 50 V voltage rating and identical leakage characteristics. The 4-SIP KBP package provides closer mechanical compatibility than KBP2005G. Operating temperature range extends to -65°C, providing superior low-temperature performance. REACH status is unaffected, simplifying regulatory compliance. This substitute is not appropriate for designs requiring the full 2 A capacity.

Both substitutes maintain RoHS3 compliance and EAR99 export classification, aligning with the original part's regulatory framework.

Frequently Asked Questions (FAQ)

Q: Can KBP005G replace 2KBP005M-E4/51 in all applications?

A: KBP005G is suitable only for applications with average rectified current requirements of 1.5 A or less. If the design requires 2 A capacity, KBP2005G is the appropriate substitute.

Q: What is the impact of the package change from KBPM to 4-ESIP in KBP2005G?

A: Package geometry differences may require PCB layout modifications. Pin spacing and lead configuration must be verified against the original design before implementation.

Q: Does the reduced operating temperature range of KBP2005G affect compatibility?

A: KBP2005G operates to 150°C maximum junction temperature, compared to 165°C for the original part. Applications operating above 150°C require thermal margin analysis to confirm suitability.

Q: Are there compliance differences between the substitute parts?

A: KBP005G maintains REACH unaffected status, while KBP2005G is REACH affected. Regulatory requirements for the target market determine which substitute is appropriate.

Q: What is the significance of the different forward voltage test currents?

A: Forward voltage is specified at different current levels reflecting each part's rated capacity. KBP005G is tested at 1.5 A, KBP2005G at 2 A, and the original at 3.14 A. All maintain the 1.1 V maximum specification, ensuring circuit compatibility.

Q: Can both substitutes be used interchangeably in the same design?

A: No. KBP005G and KBP2005G have different current ratings and package configurations. The selection must be based on the specific application's current requirement and PCB layout constraints.

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