24LC16B-E/ST EEPROM Memory IC Equivalent & Substitute Parts

Part Overview

The 24LC16B-E/ST is a 16Kbit I2C EEPROM memory IC manufactured by Microchip Technology, designed for non-volatile data storage applications requiring serial communication. This device is actively produced and widely used in embedded systems, industrial equipment, and consumer electronics requiring persistent memory functionality. Substitute parts are identified to provide design flexibility, supply chain alternatives, and compatibility options while maintaining electrical and mechanical specifications.

Substiute Parts

24LC16B-E/ST
Microchip TechnologyIn Stock: 108624LC16B-E/ST Datasheet
24LC16B-E/ST
Current Part
CAV24C16YE-GT3
onsemiIn Stock: 5281CAV24C16YE-GT3 Datasheet
CAV24C16YE-GT3
MFR Recommended
R1EX24016ATAS0I#S0
Renesas Electronics CorporationIn Stock: 3563R1EX24016ATAS0I#S0 Datasheet
R1EX24016ATAS0I#S0
MFR Recommended

Key Parameters

Parameter Specification
Memory Size 16Kbit
Memory Organization 2K x 8
Memory Interface I2C
Clock Frequency 400 kHz
Access Time 900 ns
Write Cycle Time 5ms
Voltage Supply Range 2.5V ~ 5.5V
Operating Temperature -40°C ~ 125°C
Package Type 8-TSSOP
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the 24LC16B-E/ST are qualified based on the following critical parameters that determine functional and mechanical compatibility:

  • Memory Capacity & Organization: 16Kbit, 2K x 8 configuration
  • Serial Interface Protocol: I2C at 400 kHz clock frequency
  • Access & Write Performance: 900 ns access time, 5ms write cycle time
  • Package & Pinout: 8-TSSOP surface mount package with identical pin configuration
  • Supply Voltage Compatibility: Minimum 2.5V operation required for primary application compatibility
  • Temperature Range: Operating range of -40°C minimum for industrial applications

Two qualified substitutes meet these criteria: CAV24C16YE-GT3 (onsemi) and R1EX24016ATAS0I#S0 (Renesas Electronics Corporation). Both devices maintain identical memory specifications, I2C interface characteristics, and 8-TSSOP packaging.

Parameter Comparison

Parameter 24LC16B-E/ST (Microchip) CAV24C16YE-GT3 (onsemi) R1EX24016ATAS0I#S0 (Renesas)
Memory Size 16Kbit 16Kbit 16Kbit
Memory Organization 2K x 8 2K x 8 2K x 8
Memory Interface I2C I2C I2C
Clock Frequency 400 kHz 400 kHz 400 kHz
Access Time 900 ns 900 ns 900 ns
Write Cycle Time 5ms 5ms 5ms
Voltage Supply Range 2.5V ~ 5.5V 2.5V ~ 5.5V 1.8V ~ 5.5V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 85°C
Package Type 8-TSSOP 8-TSSOP 8-TSSOP
Mounting Type Surface Mount Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Active Active Active

Engineering Selection Recommendations

24LC16B-E/ST (Microchip Technology): Primary specification baseline. Active production status with 1041 units in stock. ROHS3 compliant. Suitable for standard industrial and consumer applications within the specified voltage and temperature ranges.

CAV24C16YE-GT3 (onsemi): Direct functional equivalent with automotive-grade qualification (AEC-Q100). Identical electrical specifications and 8-TSSOP packaging. Tape & Reel packaging format. 5266 units in stock. Recommended for automotive applications or when automotive-grade reliability is required.

R1EX24016ATAS0I#S0 (Renesas Electronics Corporation): Functional equivalent with extended lower voltage support (1.8V minimum). Operating temperature range limited to -40°C ~ 85°C. Tape & Reel packaging format. 3534 units in stock. Suitable for low-voltage applications; temperature range must be verified for applications requiring operation above 85°C.

Frequently Asked Questions (FAQ)

Q: Can CAV24C16YE-GT3 be used as a direct replacement for 24LC16B-E/ST?

A: Yes. Both devices share identical memory capacity (16Kbit), organization (2K x 8), I2C interface (400 kHz), access time (900 ns), write cycle time (5ms), supply voltage range (2.5V ~ 5.5V), operating temperature range (-40°C ~ 125°C), and 8-TSSOP package. The primary difference is packaging format (Tape & Reel vs. Tube) and automotive qualification of the onsemi part.

Q: What is the key limitation of R1EX24016ATAS0I#S0 compared to the primary part?

A: The Renesas device operates at a maximum temperature of 85°C, whereas the 24LC16B-E/ST supports up to 125°C. Applications requiring operation above 85°C must use the Microchip or onsemi alternatives.

Q: Are all three parts pin-compatible?

A: Yes. All three devices use the 8-TSSOP package with identical pinout configuration, enabling direct PCB-level substitution without layout modifications.

Q: What is the difference between Tube and Tape & Reel packaging?

A: Tube packaging is used for lower-volume orders and manual handling. Tape & Reel packaging is used for automated assembly processes. Both formats contain the same device; packaging selection depends on manufacturing process requirements.

Q: Does the lower minimum voltage of R1EX24016ATAS0I#S0 provide an advantage?

A: The Renesas part supports operation down to 1.8V, compared to 2.5V for the other devices. This is beneficial only for applications specifically designed for low-voltage operation. Standard applications operating at 2.5V or higher show no functional advantage.

Q: Are all parts RoHS compliant?

A: Yes. All three devices are ROHS3 compliant and REACH unaffected, meeting environmental and regulatory requirements for industrial and consumer applications.

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