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24LC025-E/MS EEPROM Memory IC Equivalent & Substitute Parts
Part Overview
The 24LC025-E/MS is a 2Kbit I2C EEPROM memory IC manufactured by Microchip Technology, designed for non-volatile data storage applications requiring I2C serial communication at 400 kHz. The device is actively produced and widely used in embedded systems, IoT devices, and consumer electronics requiring compact, low-power memory solutions.
Substitute parts become necessary when the primary part experiences supply constraints, extended lead times, or when design requirements necessitate alternative manufacturers or package configurations. The parts listed below maintain functional equivalence through matching memory capacity, interface protocol, and electrical operating parameters.
Substiute Parts
Key Parameters
| Parameter | 24LC025-E/MS |
|---|---|
| Memory Size | 2Kbit |
| Memory Organization | 256 x 8 |
| Memory Interface | I2C |
| Clock Frequency | 400 kHz |
| Write Cycle Time | 5ms |
| Access Time | 900 ns |
| Voltage Supply Range | 2.5V ~ 5.5V |
| Operating Temperature | -40°C ~ 125°C |
| Package Type | 8-MSOP (0.118", 3.00mm Width) |
| Mounting Type | Surface Mount |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution validity for the 24LC025-E/MS is determined by the following critical parameters:
- Memory Capacity: Must be 2Kbit with 256 x 8 organization
- Interface Protocol: Must support I2C communication
- Clock Frequency: Must support minimum 400 kHz operation
- Write Cycle Time: Must not exceed 5ms
- Access Time: Must not exceed 900 ns
- Supply Voltage Range: Must encompass or exceed 2.5V ~ 5.5V
- Operating Temperature Range: Must support -40°C minimum and 125°C maximum
- Package Compatibility: Surface mount packages with compatible pinout and thermal characteristics
- Regulatory Compliance: Must maintain ROHS3 compliance
Substitute parts are grouped by package type and manufacturer, with variations in voltage supply range and maximum operating temperature noted where they differ from the primary specification.
Parameter Comparison
| Parameter | 24LC025-E/MS | BR24G02FVM-3GTTR | BR24L02FVJ-WE2 | BR24T02FVM-WTR | BR34E02FVT-3E2 | M24C02-DRDW8TP/K | M34E02-FDW6TP |
|---|---|---|---|---|---|---|---|
| Manufacturer | Microchip Technology | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor | STMicroelectronics | STMicroelectronics |
| Memory Size | 2Kbit | 2Kbit | 2Kbit | 2Kbit | 2Kbit | 2Kbit | 2Kbit |
| Memory Organization | 256 x 8 | 256 x 8 | 256 x 8 | 256 x 8 | 256 x 8 | 256 x 8 | 256 x 8 |
| I2C Interface | 400 kHz | 400 kHz | 400 kHz | 400 kHz | 400 kHz | 1 MHz | 400 kHz |
| Write Cycle Time | 5ms | 5ms | 5ms | 5ms | 5ms | 4ms | 5ms |
| Access Time | 900 ns | — | — | — | — | 450 ns | 900 ns |
| Voltage Supply Range | 2.5V ~ 5.5V | 1.6V ~ 5.5V | 1.8V ~ 5.5V | 1.6V ~ 5.5V | 1.7V ~ 5.5V | 1.8V ~ 5.5V | 1.7V ~ 5.5V |
| Operating Temperature | -40°C ~ 125°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 105°C | -40°C ~ 85°C |
| Package Type | 8-MSOP | 8-MSOP | 8-TSSOP | 8-MSOP | 8-TSSOP | 8-TSSOP | 8-TSSOP |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Product Status | Active | Active | Not For New Designs | Active | Active | Active | Active |
Engineering Selection Recommendations
Package-Matched Substitutes (8-MSOP)
BR24G02FVM-3GTTR and BR24T02FVM-WTR maintain identical 8-MSOP package geometry to the 24LC025-E/MS, enabling direct PCB layout compatibility. Both devices are actively produced. BR24G02FVM-3GTTR offers extended lower voltage operation (1.6V minimum) compared to the primary part's 2.5V minimum. BR24T02FVM-WTR provides equivalent voltage range (1.6V ~ 5.5V). Both limit maximum operating temperature to 85°C, which represents a constraint for applications requiring 125°C operation.
Package-Alternative Substitutes (8-TSSOP)
BR24L02FVJ-WE2, BR34E02FVT-3E2, M24C02-DRDW8TP/K, and M34E02-FDW6TP utilize 8-TSSOP packaging with different physical dimensions (0.173", 4.40mm width versus 0.118", 3.00mm width for MSOP). These require PCB layout modification but maintain functional I2C compatibility. BR24L02FVJ-WE2 carries "Not For New Designs" status and should be avoided for new development. M24C02-DRDW8TP/K supports automotive qualification (AEC-Q100) and extends maximum operating temperature to 105°C. M34E02-FDW6TP maintains 900 ns access time matching the primary part and is actively produced.
Performance Considerations
M24C02-DRDW8TP/K and M24C02-DRDW3TP/K (STMicroelectronics) operate at 1 MHz I2C frequency with 450 ns access time and 4ms write cycle time, providing performance enhancement over the 400 kHz, 900 ns specification. These devices support higher temperature operation (105°C and 125°C respectively) and carry automotive-grade qualification.
Temperature-Constrained Applications
Applications requiring sustained operation at 125°C must use M24C02-DRDW3TP/K (125°C maximum) or remain with the primary 24LC025-E/MS part. All Rohm Semiconductor substitutes limit operation to 85°C maximum.
Frequently Asked Questions (FAQ)
Q: Can BR24G02FVM-3GTTR replace 24LC025-E/MS in all applications?
A: BR24G02FVM-3GTTR provides functional I2C EEPROM equivalence with matching 2Kbit capacity, 256 x 8 organization, 400 kHz operation, and 8-MSOP package. However, it limits maximum operating temperature to 85°C versus the primary part's 125°C specification. Applications operating above 85°C require alternative selection or the original part.
Q: What is the difference between 8-MSOP and 8-TSSOP packages?
A: Both are 8-pin surface mount packages with identical pinout compatibility for I2C EEPROM devices. The primary difference is physical footprint: 8-MSOP measures 0.118" × 3.00mm width, while 8-TSSOP measures 0.173" × 4.40mm width. PCB layout and component placement must accommodate the selected package geometry. Electrical performance and I2C protocol operation remain identical between packages.
Q: Why does M24C02-DRDW8TP/K show 1 MHz clock frequency instead of 400 kHz?
A: M24C02-DRDW8TP/K supports I2C operation at 1 MHz, which is backward-compatible with 400 kHz bus operation. The device will function correctly on 400 kHz I2C buses while offering performance headroom for faster applications. The 450 ns access time and 4ms write cycle time represent performance improvements over the 900 ns and 5ms specifications of the primary part.
Q: Are all substitute parts RoHS3 compliant?
A: Yes. All listed substitute parts maintain ROHS3 compliance matching the primary 24LC025-E/MS specification, ensuring regulatory equivalence for applications subject to RoHS requirements.
Q: Which substitute part offers the widest operating temperature range?
A: M24C02-DRDW3TP/K supports -40°C to 125°C operation, matching the primary part's temperature range. M24C02-DRDW8TP/K extends to 105°C maximum. All Rohm Semiconductor substitutes limit operation to 85°C maximum.
Q: Can I use M34E02-FDW6TP as a direct replacement?
A: M34E02-FDW6TP provides functional equivalence with matching 2Kbit capacity, 256 x 8 organization, 400 kHz I2C operation, and 900 ns access time. However, it uses 8-TSSOP packaging instead of 8-MSOP, requiring PCB layout modification. Operating temperature limits to 85°C maximum. Verify PCB layout compatibility before implementation.
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