Equivalent & Substitute Parts for 24AA08HT-I/MS

Part Overview

The 24AA08HT-I/MS is an 8Kbit EEPROM memory IC manufactured by Microchip Technology, featuring I2C interface operation at 400 kHz with 900 ns access time. This component is designed for non-volatile data storage applications requiring low-power, serial communication in embedded systems. The part maintains Active product status with full RoHS3 compliance and unlimited moisture sensitivity rating. Substitute parts are identified to address inventory availability, extended performance specifications, or specific packaging requirements while maintaining core functional compatibility.

Substiute Parts

24AA08HT-I/MS
Microchip TechnologyIn Stock: 93524AA08HT-I/MS Datasheet
24AA08HT-I/MS
Current Part
BR24G08FVJ-3AGTE2
Rohm SemiconductorIn Stock: 946BR24G08FVJ-3AGTE2 Datasheet
BR24G08FVJ-3AGTE2
MFR Recommended
BR24G08FVM-3AGTTR
Rohm SemiconductorIn Stock: 9452BR24G08FVM-3AGTTR Datasheet
BR24G08FVM-3AGTTR
MFR Recommended

Key Parameters

Parameter Value
Memory Size 8Kbit
Memory Format EEPROM
Memory Organization 256 x 8 x 4
Interface Type I2C
Clock Frequency 400 kHz
Access Time 900 ns
Write Cycle Time 5 ms
Supply Voltage Range 1.7V ~ 5.5V
Operating Temperature -40°C ~ 85°C
Package Type 8-MSOP (0.118", 3.00mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the 24AA08HT-I/MS are qualified based on the following electrical and mechanical parameters:

Core Compatibility Criteria:

  • Memory capacity: 8Kbit minimum
  • Memory format: EEPROM technology
  • Interface: I2C serial communication
  • Write cycle time: 5 ms maximum
  • Operating temperature range: -40°C ~ 85°C minimum
  • Supply voltage: Minimum 1.6V to 5.5V overlap required
  • Mounting: Surface mount configuration
  • Package footprint: 8-pin TSSOP or 8-pin MSOP compatible

Substitutes identified:

  • BR24G08FVJ-3AGTE2 (Rohm Semiconductor): 8-TSSOP package variant with 1 MHz I2C operation
  • BR24G08FVM-3AGTTR (Rohm Semiconductor): 8-MSOP package variant with 1 MHz I2C operation

Both substitutes maintain identical memory capacity, organization, write cycle time, and temperature range. Enhanced clock frequency (1 MHz vs. 400 kHz) provides backward compatibility with the original specification.

Parameter Comparison

Parameter 24AA08HT-I/MS (Microchip) BR24G08FVJ-3AGTE2 (Rohm) BR24G08FVM-3AGTTR (Rohm)
Memory Size 8Kbit 8Kbit 8Kbit
Memory Format EEPROM EEPROM EEPROM
Memory Organization 256 x 8 x 4 1K x 8 1K x 8
Interface I2C I2C I2C
Clock Frequency 400 kHz 1 MHz 1 MHz
Access Time 900 ns Not specified Not specified
Write Cycle Time 5 ms 5 ms 5 ms
Supply Voltage 1.7V ~ 5.5V 1.6V ~ 5.5V 1.6V ~ 5.5V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Package Type 8-MSOP 8-TSSOP 8-MSOP
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
MSL Rating 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

BR24G08FVM-3AGTTR Selection: This substitute maintains identical 8-MSOP packaging with the original 24AA08HT-I/MS, enabling direct footprint compatibility on PCB layouts. The part is manufactured by Rohm Semiconductor with Active product status, ROHS3 compliance, and unlimited moisture sensitivity rating. Enhanced 1 MHz clock frequency provides operational margin above the original 400 kHz specification while maintaining full backward compatibility. Current inventory of 9,439 units supports production requirements.

BR24G08FVJ-3AGTE2 Selection: This substitute provides 8-TSSOP packaging as an alternative form factor. Rohm Semiconductor manufacturing with Active product status ensures supply chain continuity. ROHS3 compliance and unlimited MSL rating match the original specification. The 1 MHz I2C operation exceeds original performance. PCB layout modification is required due to package footprint difference. Current inventory of 886 units is available.

Selection Criteria: Choose BR24G08FVM-3AGTTR for direct replacement without PCB redesign. Select BR24G08FVJ-3AGTE2 when package footprint modification is acceptable and alternative sourcing is required.

Frequently Asked Questions (FAQ)

Q: Can BR24G08FVM-3AGTTR replace 24AA08HT-I/MS without PCB modification? A: Yes. Both parts use 8-MSOP packaging with identical pin configuration and electrical interface. No PCB layout changes are required.

Q: What is the difference between the two Rohm substitutes? A: BR24G08FVM-3AGTTR uses 8-MSOP packaging (0.110", 2.80mm width). BR24G08FVJ-3AGTE2 uses 8-TSSOP packaging (0.118", 3.00mm width). Electrical specifications are identical. Package selection depends on PCB footprint availability.

Q: Are the substitute parts backward compatible with 400 kHz I2C bus operation? A: Yes. Both BR24G08 variants operate at 1 MHz, which is backward compatible with 400 kHz I2C bus specifications. The higher clock frequency does not affect communication with 400 kHz controllers.

Q: Do the substitute parts meet the same compliance requirements? A: Yes. Both BR24G08FVM-3AGTTR and BR24G08FVJ-3AGTE2 are ROHS3 compliant, REACH unaffected, and carry unlimited moisture sensitivity rating (MSL 1), matching the original 24AA08HT-I/MS specifications.

Q: What is the memory organization difference between 256 x 8 x 4 and 1K x 8? A: Both configurations provide 8Kbit total capacity. The 24AA08HT-I/MS uses 256 x 8 x 4 organization (256 addresses, 8-bit words, 4 pages). The BR24G08 variants use 1K x 8 organization (1024 addresses, 8-bit words). Both support identical I2C addressing and data access patterns for 8Kbit EEPROM applications.

Q: Can I use these parts interchangeably in existing designs? A: BR24G08FVM-3AGTTR provides direct pin-for-pin and footprint compatibility. BR24G08FVJ-3AGTE2 requires PCB layout modification due to package footprint differences. Both maintain electrical interface compatibility with I2C bus specifications.

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