23LCV512-E/ST Equivalent & Substitute Parts

Part Overview

The 23LCV512-E/ST is a 512Kbit Synchronous SRAM memory IC manufactured by Microchip Technology, featuring SPI Dual I/O interface capability. This component is designed for applications requiring volatile memory with dual I/O serial communication at 20 MHz operation. The part is currently classified as obsolete, necessitating identification of active equivalent alternatives to maintain design continuity and ensure long-term component availability for new production and field replacements.

Substiute Parts

23LCV512-E/ST

Microchip TechnologyIn Stock: 93323LCV512-E/ST Datasheet

Current PartRFQ

23LC512-E/ST

Microchip TechnologyIn Stock: 100523LC512-E/ST Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The 23LC512-E/ST qualifies as a direct substitute based on the following alignment of critical parameters:

Matching Parameters:

• Memory capacity: 512Kbit (identical)
• Memory organization: 64K x 8 (identical)
• Voltage supply range: 2.5V ~ 5.5V (identical)
• Operating temperature range: -40°C ~ 125°C (identical)
• Package type: 8-TSSOP with identical physical dimensions (identical)
• Mounting type: Surface Mount (identical)
• RoHS compliance: ROHS3 Compliant (identical)
• Manufacturer: Microchip Technology (same source)

Interface Variation: The 23LC512-E/ST operates with SPI Dual I/O at 20 MHz, while the 23LC512-E/ST substitute features SPI Quad I/O at 16 MHz. Both configurations operate within the same voltage and temperature specifications, share identical memory capacity and organization, and use the same physical package footprint.

Parameter Comparison

Engineering Selection Recommendations

The 23LC512-E/ST is the designated manufacturer substitute for the obsolete 23LCV512-E/ST. Selection of this active component is supported by:

• Product Status: The substitute maintains active production status, ensuring availability for current and future procurement cycles.
• Compliance Alignment: Both parts maintain identical RoHS3 compliance and REACH unaffected status, satisfying regulatory requirements without modification.
• Electrical Compatibility: Identical voltage supply range (2.5V ~ 5.5V) and operating temperature range (-40°C ~ 125°C) ensure functional compatibility in existing circuit designs.
• Physical Compatibility: Identical 8-TSSOP package dimensions and surface mount configuration enable direct PCB footprint compatibility without layout revision.
• Memory Specifications: Matching 512Kbit capacity and 64K x 8 organization preserve data storage and access characteristics.

The interface variation from Dual I/O to Quad I/O, combined with the clock frequency reduction from 20 MHz to 16 MHz, requires verification of application-specific communication protocol requirements and timing constraints.

Frequently Asked Questions (FAQ)

Q: Can the 23LC512-E/ST directly replace the 23LCV512-E/ST in existing designs?

A: Physical and electrical compatibility is confirmed through matching package dimensions, voltage supply range, operating temperature range, and memory organization. Interface protocol compatibility must be verified against application-specific SPI communication requirements, as the substitute features Quad I/O capability versus the original Dual I/O configuration.

Q: What is the significance of the clock frequency difference between 20 MHz and 16 MHz?

A: The substitute operates at 16 MHz compared to the original 20 MHz specification. Applications with timing-critical SPI communication sequences must confirm that 16 MHz operation satisfies system performance requirements.

Q: Are there any compliance or certification differences between these parts?

A: Both parts maintain identical RoHS3 compliance status and REACH unaffected classification. No compliance-related barriers to substitution exist.

Q: Why is the original part classified as obsolete?

A: The 23LCV512-E/ST is listed as obsolete by the manufacturer. The 23LC512-E/ST represents the active production alternative within the Microchip 512Kbit SRAM product line.

Q: Does the Quad I/O interface provide backward compatibility with Dual I/O applications?

A: SPI Quad I/O devices typically support legacy Dual I/O and Single I/O communication modes through firmware or protocol configuration. Application-specific verification is required to confirm operational compatibility with existing host controller implementations.

Q: Are packaging and moisture sensitivity specifications identical?

A: Both parts use 8-TSSOP surface mount packaging with identical physical dimensions (0.173", 4.40mm Width) and Moisture Sensitivity Level 1 (Unlimited), confirming complete packaging compatibility.