23K256T-E/SN SRAM Memory IC Equivalent & Substitute Parts

Part Overview

The 23K256T-E/SN is a 256Kbit SRAM memory integrated circuit manufactured by Microchip Technology, designed for SPI serial interface applications operating at 20 MHz. This volatile memory device is actively produced and widely used in embedded systems requiring fast, non-persistent data storage with low power consumption. The part is housed in an 8-SOIC surface mount package and operates across an extended temperature range of -40°C to 125°C.

Substitute parts become necessary when the primary part experiences supply constraints, extended lead times, or when design flexibility permits component standardization across manufacturing batches or procurement channels. Alternative qualified parts maintain electrical and mechanical compatibility while potentially offering different packaging options or manufacturer sourcing.

Key Parameters

Parameter	Value
Memory Size	256Kbit
Memory Format	SRAM
Memory Organization	32K x 8
Memory Interface	SPI
Clock Frequency	20 MHz
Voltage Supply Range	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 125°C (TA)
Package Type	8-SOIC (0.154", 3.90mm Width)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the 23K256T-E/SN is determined by strict alignment of the following critical parameters:

Memory Capacity & Organization: 256Kbit capacity with 32K x 8 organization
Interface Protocol: SPI serial interface at 20 MHz maximum frequency
Supply Voltage: 2.7V to 3.6V operating range
Package & Pinout: 8-SOIC surface mount package with identical mechanical dimensions
Compliance Standards: ROHS3 compliance and EAR99 export classification

The substitute parts listed below meet these core electrical and mechanical requirements. Variations in operating temperature range and moisture sensitivity level are noted but do not preclude functional substitution when application requirements permit.

Parameter Comparison

Parameter	23K256T-E/SN (Main)	23K256-E/SN	N25S830HAS22I	N25S830HAS22IT
Manufacturer	Microchip Technology	Microchip Technology	onsemi	onsemi
Memory Size	256Kbit	256Kbit	256Kbit	256Kbit
Memory Format	SRAM	SRAM	SRAM	SRAM
Memory Organization	32K x 8	32K x 8	32K x 8	32K x 8
Memory Interface	SPI	SPI	SPI	SPI
Clock Frequency	20 MHz	20 MHz	20 MHz	20 MHz
Voltage Supply	2.7V ~ 3.6V	2.7V ~ 3.6V	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 85°C	-40°C ~ 85°C
Package Type	8-SOIC	8-SOIC	8-SOIC	8-SOIC
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Packaging Option	Tube	Tube	Tube	Cut Tape (CT) & Digi-Reel®
MSL Rating	1 (Unlimited)	1 (Unlimited)	3 (168 Hours)	3 (168 Hours)

Engineering Selection Recommendations

23K256-E/SN (Microchip Technology): Direct equivalent from the same manufacturer with identical electrical specifications and extended temperature range (-40°C to 125°C). This part is the primary substitute when supply of the 23K256T-E/SN is constrained. Both parts maintain ROHS3 compliance and MSL Level 1 rating, ensuring equivalent handling and storage requirements.

N25S830HAS22I & N25S830HAS22IT (onsemi): Cross-manufacturer alternatives meeting all core electrical parameters. Both onsemi variants operate within the specified voltage and frequency ranges with identical memory organization. The operating temperature range is limited to -40°C to 85°C, which is acceptable for applications not requiring the extended upper temperature capability of the Microchip parts. MSL Level 3 rating requires adherence to 168-hour moisture exposure limits during storage and handling. The N25S830HAS22IT variant offers Cut Tape and Digi-Reel packaging options for high-volume production environments, while N25S830HAS22I is supplied in tube packaging.

Selection between these substitutes depends on application temperature requirements, packaging logistics, and supply availability. All listed parts maintain active product status and full regulatory compliance.

Frequently Asked Questions (FAQ)

Q: Can N25S830HAS22I replace 23K256T-E/SN in all applications?

A: Electrical and mechanical compatibility is confirmed for applications operating within -40°C to 85°C. Applications requiring operation above 85°C must use Microchip parts (23K256T-E/SN or 23K256-E/SN) to maintain the extended temperature range. MSL Level 3 moisture sensitivity requires compliance with 168-hour storage limits.

Q: What is the difference between N25S830HAS22I and N25S830HAS22IT?

A: Both parts are electrically identical. The primary difference is packaging: N25S830HAS22I is supplied in tube packaging, while N25S830HAS22IT is available in Cut Tape and Digi-Reel formats. Selection depends on assembly process requirements and volume handling.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All listed parts—23K256T-E/SN, 23K256-E/SN, N25S830HAS22I, and N25S830HAS22IT—are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards.

Q: What does MSL Level 1 versus Level 3 mean for component handling?

A: MSL (Moisture Sensitivity Level) 1 indicates unlimited shelf life with no moisture exposure restrictions. MSL Level 3 requires components to be used within 168 hours of bag opening under controlled humidity conditions. Microchip parts (MSL 1) offer simpler inventory management, while onsemi parts (MSL 3) require stricter moisture control protocols.

Q: Can these parts be used interchangeably on the same PCB assembly?

A: Yes. All substitute parts share identical 8-SOIC pinout and mechanical dimensions, enabling direct PCB footprint compatibility. Electrical performance is equivalent within the specified operating ranges.

Q: What is the inventory status of these parts?

A: 23K256T-E/SN: 2200 pcs; 23K256-E/SN: 2200 pcs; N25S830HAS22I: 1450 pcs; N25S830HAS22IT: 1712 pcs. All parts are listed as new original stock with active product status.

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