Equivalent & Substitute Parts for 2309NZ-1HDCGI8

Part Overview

The 2309NZ-1HDCGI8 is a Clock Fanout Buffer (Distribution) IC manufactured by Renesas Electronics Corporation. This 1:9 clock distribution device operates at a maximum frequency of 133.33 MHz and is designed for LVTTL signal applications. The part is housed in a 16-SOIC package and is currently in active production status. Substitute parts are identified when equivalent functional performance can be maintained within the specified electrical and mechanical parameters while accommodating different packaging formats or inventory availability.

Substiute Parts

2309NZ-1HDCGI8

Renesas Electronics CorporationIn Stock: 151242309NZ-1HDCGI8 Datasheet

Current PartRFQ

PL123-09NSC

Microchip TechnologyIn Stock: 852PL123-09NSC Datasheet

MFR RecommendedRFQ

PL123-09NSC-R

Microchip TechnologyIn Stock: 2860PL123-09NSC-R Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the 2309NZ-1HDCGI8 are qualified based on the following critical parameters:

• Functional Equivalence: 1:9 fanout buffer configuration with clock distribution capability
• Frequency Compatibility: Maximum operating frequency of 134 MHz or greater (exceeds 133.33 MHz requirement)
• Signal Interface: Clock input and output compatibility
• Package Compatibility: 16-SOIC (0.154", 3.90mm Width) physical form factor
• Supply Voltage Range: Overlap or containment within 3V ~ 3.6V operating window
• Compliance: ROHS3 compliance and active product status
• Mounting Type: Surface mount technology

The substitute parts identified (PL123-09NSC and PL123-09NSC-R) from Microchip Technology meet these criteria. Both parts maintain the 1:9 distribution ratio, support the required frequency range, and are housed in compatible 16-SOIC packages. The primary difference between substitutes is packaging format (Tube versus Tape & Reel).

Parameter Comparison

Engineering Selection Recommendations

Both Microchip Technology substitute parts (PL123-09NSC and PL123-09NSC-R) are active products with ROHS3 compliance, meeting regulatory requirements equivalent to the primary part. The Microchip devices support a wider supply voltage range (1.62V ~ 3.63V) that fully encompasses the 3V ~ 3.6V requirement of the 2309NZ-1HDCGI8.

The operating temperature range of the Microchip substitutes (0°C ~ 70°C) is narrower than the Renesas part (-40°C ~ 85°C). Applications requiring extended temperature operation below 0°C or above 70°C must retain the 2309NZ-1HDCGI8.

The Microchip parts feature superior moisture sensitivity characteristics (MSL 1, Unlimited) compared to the Renesas part (MSL 3, 168 Hours), providing extended shelf life and reduced moisture-related handling constraints.

For packaging format selection: PL123-09NSC-R is supplied in Tape & Reel format matching the primary part's packaging, while PL123-09NSC is supplied in Tube format. Tape & Reel packaging is standard for high-volume automated assembly operations.

Frequently Asked Questions (FAQ)

Q: Can PL123-09NSC and PL123-09NSC-R be used interchangeably with 2309NZ-1HDCGI8?

A: Both Microchip parts are functionally equivalent for applications operating within 0°C to 70°C temperature range and 1.62V to 3.63V supply voltage. The primary difference is packaging format (Tube versus Tape & Reel). For applications requiring the extended temperature range of -40°C to 85°C, the 2309NZ-1HDCGI8 must be used.

Q: What is the difference between PL123-09NSC and PL123-09NSC-R?

A: Both parts are electrically and functionally identical. The suffix "-R" indicates Tape & Reel packaging, while PL123-09NSC is supplied in Tube format. Selection depends on assembly process requirements and inventory management practices.

Q: Are the 16-SOIC packages physically compatible?

A: Yes. Both the 2309NZ-1HDCGI8 and Microchip substitutes use 16-SOIC (0.154", 3.90mm Width) packages with identical physical dimensions and pin configurations, enabling direct board-level substitution.

Q: What are the key electrical differences between these parts?

A: The Microchip substitutes support a wider supply voltage range (1.62V ~ 3.63V versus 3V ~ 3.6V) and operate at a slightly higher maximum frequency (134 MHz versus 133.33 MHz). The operating temperature range is narrower for Microchip parts (0°C ~ 70°C versus -40°C ~ 85°C).

Q: Are all parts RoHS compliant?

A: Yes. The 2309NZ-1HDCGI8 and both Microchip substitute parts are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards.

Q: What does MSL rating mean for component selection?

A: Moisture Sensitivity Level (MSL) indicates the maximum time a component can be exposed to moisture before soldering. The Microchip substitutes have MSL 1 (Unlimited), providing greater flexibility in storage and handling compared to the Renesas part with MSL 3 (168 Hours maximum exposure).