Equivalent & Substitute Parts for 2225PC684MAT1A

Part Overview

The 2225PC684MAT1A is a 0.68 µF ceramic capacitor rated at 250V with X7R temperature coefficient, manufactured by KYOCERA AVX. This surface mount multilayer ceramic capacitor (MLCC) is designed for general purpose applications and is currently in active production status. The part is ROHS3 compliant with MSL 1 rating, indicating unlimited moisture sensitivity protection. Substitute parts are identified to provide alternative sourcing options while maintaining electrical and mechanical compatibility within specified tolerance ranges.

Substiute Parts

2225PC684MAT1A

KYOCERA AVXIn Stock: 8222225PC684MAT1A Datasheet

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C2225C684KARAC7800

KEMETIn Stock: 1532C2225C684KARAC7800 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the 2225PC684MAT1A is determined by the following critical parameters:

• Capacitance Value: Must be 0.68 µF
• Voltage Rating: Must be 250V or higher
• Temperature Coefficient: Must be X7R
• Package / Case: Must be 2225 (5763 Metric)
• Mounting Type: Must be Surface Mount, MLCC
• Operating Temperature Range: Must support -55°C ~ 125°C
• Compliance: Must maintain ROHS3 and REACH compliance status

The substitute part C2225C684KARAC7800 from KEMET meets all critical substitution criteria. Tolerance variation (±10% versus ±20%) represents an upgrade in precision capability and does not prevent substitution. Physical dimension variations within the 2225 package specification and thickness differences are acceptable within standard PCB assembly tolerances.

Parameter Comparison

Engineering Selection Recommendations

Both the 2225PC684MAT1A and C2225C684KARAC7800 are active production parts with full ROHS3 and REACH compliance. The substitute part offers improved tolerance specification (±10% versus ±20%), which provides tighter capacitance control without introducing incompatibility. The reduced thickness of the KEMET part (1.45mm versus 2.54mm) may provide design flexibility for space-constrained applications while remaining within the 2225 package specification. Both parts maintain identical electrical ratings, temperature performance, and moisture sensitivity classification. Selection between these parts should be based on availability, packaging format requirements (Tape & Reel for KEMET), and tolerance requirements for the specific application.

Frequently Asked Questions (FAQ)

Q: Can C2225C684KARAC7800 be used as a direct replacement for 2225PC684MAT1A?

A: Yes. Both parts share identical capacitance (0.68 µF), voltage rating (250V), temperature coefficient (X7R), package (2225), and operating temperature range (-55°C ~ 125°C). The substitute part features improved tolerance (±10%) and reduced thickness, both of which are compatible with standard PCB assembly processes.

Q: What is the significance of the tolerance difference between ±20% and ±10%?

A: Tolerance defines the acceptable deviation of actual capacitance from the nominal value. The ±10% tolerance of C2225C684KARAC7800 provides tighter capacitance control compared to the ±20% tolerance of 2225PC684MAT1A. This represents an upgrade in precision and does not prevent substitution in applications designed for the original part.

Q: Are there physical compatibility concerns due to thickness differences?

A: No. The 2225 package specification accommodates both thickness values. The KEMET part at 1.45mm thickness is thinner than the KYOCERA AVX part at 2.54mm, which may provide additional PCB assembly clearance without affecting electrical performance or mechanical fit.

Q: Do both parts meet the same compliance requirements?

A: Yes. Both 2225PC684MAT1A and C2225C684KARAC7800 are ROHS3 compliant, REACH unaffected, and classified as MSL 1 (unlimited moisture sensitivity protection). Compliance status is identical between the two parts.

Q: What packaging format is available for the substitute part?

A: C2225C684KARAC7800 is supplied in Tape & Reel (TR) format, which is standard for high-volume surface mount assembly operations. Confirm packaging compatibility with your assembly process requirements.