Equivalent & Substitute Parts for TE Connectivity 2-178238-7

Part Overview

The TE Connectivity 2-178238-7 is a 50-position receptacle connector from the CHAMP .050 II series, designed for panel mount, through-hole, right-angle solder applications. This connector features outer shroud contacts, board lock functionality, and gold-plated contacts with 30.0µin finish thickness. The part is classified as obsolete, necessitating identification of active equivalent and substitute components that maintain functional compatibility across the specified electrical and mechanical parameters.

Substiute Parts

2-178238-7

TE Connectivity AMP ConnectorsIn Stock: 8992-178238-7 Datasheet

Current PartRFQ

DX10G1M-50SE(50)

Hirose Electric Co LtdIn Stock: 1224DX10G1M-50SE(50) Datasheet

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N10250-52B2PC

3MIn Stock: 1053N10250-52B2PC Datasheet

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N10250-52E2PC

3MIn Stock: 3505N10250-52E2PC Datasheet

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N10250-52G3PC

3MIn Stock: 992N10250-52G3PC Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TE Connectivity 2-178238-7 is determined by strict alignment with the following core parameters: 50-position receptacle configuration, 2-row arrangement, panel mount through-hole right-angle mounting, solder termination, outer shroud contact style, gold contact finish, M2.6 housing/shell flange, and board lock feature. All substitute parts must maintain these electrical and mechanical specifications to ensure direct functional compatibility without design modification.

The substitute parts identified—N10250-52G3PC, DX10G1M-50SE(50), N10250-52E2PC, and N10250-52B2PC—satisfy these core substitution criteria. Variations in product status (active versus obsolete), RoHS compliance, packaging format, and secondary features such as shielding do not disqualify substitution eligibility but represent implementation considerations for specific application requirements.

Parameter Comparison

Engineering Selection Recommendations

All identified substitute parts—N10250-52G3PC, N10250-52B2PC, N10250-52E2PC, and DX10G1M-50SE(50)—maintain active product status and provide functional equivalence to the obsolete TE Connectivity 2-178238-7 across core electrical and mechanical parameters.

N10250-52G3PC (3M) provides direct substitution with identical flange specification (M2.6), matching contact finish thickness (30.0µin), and RoHS compliance. This part includes shielding as an additional feature and is available in bulk packaging.

N10250-52B2PC (3M) offers equivalent core specifications with M2.6 flange compatibility and identical contact finish thickness. Shielding is included as a supplementary feature. Box packaging is provided.

N10250-52E2PC (3M) maintains core parameter alignment with the exception of flange specification (4-40 instead of M2.6) and includes latchblocks as an additional feature. Shielding is present. This variant requires mechanical verification for panel mount hole compatibility.

DX10G1M-50SE(50) (Hirose Electric Co Ltd) provides substitution with M2.6 flange compatibility and board lock functionality. Contact finish thickness is not specified. This part is classified as miniature high-density (HD) type and is available in tray packaging. ROHS3 compliance is confirmed.

All substitute parts satisfy MSL 1 (Unlimited) moisture sensitivity requirements and maintain REACH compliance status. Selection between alternatives depends on specific application requirements regarding shielding, packaging format, and flange hole specifications.

Frequently Asked Questions (FAQ)

Q: Can N10250-52E2PC substitute for 2-178238-7 despite the different flange specification?

A: N10250-52E2PC features a 4-40 flange specification instead of M2.6. While core electrical and mechanical parameters align, the flange hole pattern differs. Direct substitution requires verification that the panel mount hole configuration accommodates the 4-40 specification. Mechanical redesign or adapter solutions may be necessary.

Q: What is the significance of shielding in the 3M substitute parts?

A: The 3M parts (N10250-52G3PC, N10250-52B2PC, N10250-52E2PC) include shielding as an additional feature not present in the original TE Connectivity 2-178238-7. Shielding provides electromagnetic interference (EMI) protection. Applications not requiring shielding can use these parts without functional degradation; applications requiring shielding benefit from this enhanced specification.

Q: How does the Hirose DX10G1M-50SE(50) differ from the 3M alternatives?

A: The Hirose part is classified as miniature high-density (HD) type and does not specify contact finish thickness. It maintains M2.6 flange compatibility and board lock functionality. The HD designation indicates a more compact form factor. Selection depends on application space constraints and whether contact finish thickness specification is a design requirement.

Q: Are all substitute parts RoHS compliant?

A: Yes. All substitute parts are RoHS compliant (N10250-52G3PC, N10250-52B2PC, N10250-52E2PC are RoHS Compliant; DX10G1M-50SE(50) is ROHS3 Compliant). The original TE Connectivity 2-178238-7 is RoHS non-compliant. Applications subject to RoHS regulatory requirements must use one of the compliant substitute parts.

Q: What packaging options are available for these substitute parts?

A: N10250-52G3PC is supplied in bulk packaging. N10250-52B2PC and N10250-52E2PC are supplied in box packaging. DX10G1M-50SE(50) is supplied in tray packaging. Packaging selection affects inventory management and component handling procedures.

Q: Do all substitute parts maintain the same contact finish thickness as the original?

A: N10250-52G3PC, N10250-52B2PC, and N10250-52E2PC all specify 30.0µin (0.76µm) contact finish thickness, matching the original TE Connectivity 2-178238-7. DX10G1M-50SE(50) does not specify contact finish thickness in the provided data.

Q: Can these parts be used interchangeably in existing designs?

A: Core electrical and mechanical parameters are equivalent, enabling functional substitution. However, physical differences such as flange specifications (M2.6 versus 4-40), shielding presence, and form factor (standard versus miniature HD) require design verification. Panel mount hole patterns and connector orientation must be confirmed for each substitute part before implementation.