Equivalent & Substitute Parts for Aries Electronics 20-3518-11

Part Overview

The Aries Electronics 20-3518-11 is a 20-position DIP socket with 0.3" (7.62mm) row spacing, designed for through-hole mounting of dual inline package integrated circuits and transistors. This connector features gold-plated beryllium copper mating contacts and brass posts, rated for 3A current capacity. The part is active in production and ROHS3 compliant, making it suitable for modern electronic assemblies requiring reliable IC socket connections.

Substitute parts are identified when equivalent electrical and mechanical parameters align with the main part specifications, enabling component interchangeability in circuit designs where the primary part becomes unavailable or when alternative packaging or supplier options are required.

Key Parameters

Parameter	Value
Number of Positions	20 (2 x 10)
Row Spacing	0.3" (7.62mm)
Pitch - Mating	0.100" (2.54mm)
Pitch - Post	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Termination	Solder
Termination Post Length	0.125" (3.18mm)
Current Rating	3 A
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for DIP sockets is determined by strict alignment of mechanical and electrical parameters. The critical parameters that define interchangeability are:

Position Count and Row Spacing: All substitute parts must maintain 20 positions in a 2 x 10 configuration with 0.3" row spacing
Pitch Specifications: Both mating pitch (0.100") and post pitch (0.100") must match exactly
Contact Material - Mating: Beryllium copper mating contacts are required for consistent contact performance
Mounting Configuration: Through-hole solder termination with 0.125" post length
Compliance Status: ROHS3 compliance and MSL 1 rating required

The three substitute parts listed below meet all critical mechanical and electrical parameters. Variations in contact finish thickness, post material finish, housing material composition, and current rating represent acceptable engineering tolerances within the DIP socket category and do not affect functional interchangeability in standard IC socket applications.

Parameter Comparison

Parameter	Aries 20-3518-11	Mill-Max 110-13-320-41-001000	Preci-Dip 110-83-320-41-001101	Samtec ICA-320-SGG
Manufacturer	Aries Electronics	Mill-Max Manufacturing Corp.	Preci-Dip	Samtec Inc.
Number of Positions	20 (2 x 10)	20 (2 x 10)	20 (2 x 10)	20 (2 x 10)
Row Spacing	0.3" (7.62mm)	0.3" (7.62mm)	0.3" (7.62mm)	0.3" (7.62mm)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Gold	Gold	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)	30.0µin (0.76µm)	29.5µin (0.75µm)	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Mounting Type	Through Hole	Through Hole	Through Hole	Through Hole
Termination	Solder	Solder	Solder	Solder
Termination Post Length	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)
Current Rating (Amps)	3 A	3 A	1 A	1 A
Operating Temperature	-	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)
Packaging	Bulk	Tube	Bulk	Tube
Product Status	Active	Active	Active	Active

Engineering Selection Recommendations

All three substitute parts are active production components with ROHS3 compliance and MSL 1 ratings, meeting the regulatory and environmental requirements of the primary part.

Mill-Max 110-13-320-41-001000 maintains the 3A current rating of the Aries 20-3518-11 and provides specified operating temperature range (-55°C ~ 125°C). This part is supplied in tube packaging rather than bulk. The mating contact finish thickness is increased to 30.0µin (0.76µm), providing enhanced durability in high-cycle insertion applications.

Preci-Dip 110-83-320-41-001101 is supplied in bulk packaging matching the primary part. This part specifies a 1A current rating and includes documented contact resistance of 10mOhm. The mating contact finish thickness is 29.5µin (0.75µm). The post finish is tin rather than gold, and the housing material includes glass-filled polyester composition.

Samtec ICA-320-SGG is supplied in tube packaging and specifies a 1A current rating with 10mOhm contact resistance. The mating and post contact finishes are both gold at 30.0µin (0.76µm) thickness. REACH status is listed as affected for this part, whereas the primary part and other substitutes are REACH unaffected.

Selection between substitutes depends on application current requirements, packaging preferences, and regulatory compliance scope. For applications requiring 3A current capacity, Mill-Max 110-13-320-41-001000 is the appropriate selection. For applications with lower current requirements, Preci-Dip or Samtec options provide alternative sourcing with documented contact resistance specifications.

Frequently Asked Questions (FAQ)

Q: Can these substitute parts be used interchangeably with the Aries 20-3518-11 in existing PCB designs?

A: Yes, all three substitute parts share identical mechanical dimensions, pin pitch, row spacing, and through-hole termination specifications. PCB footprints designed for the Aries 20-3518-11 will accommodate any of the listed substitutes without modification.

Q: What is the significance of the different current ratings (3A vs. 1A) among the parts?

A: Current rating indicates the maximum continuous current the socket contacts can safely carry. The Aries 20-3518-11 and Mill-Max 110-13-320-41-001000 are rated for 3A, while Preci-Dip and Samtec parts are rated for 1A. Selection should match or exceed the actual circuit current requirements. Lower-rated parts are suitable for applications drawing less than 1A per contact.

Q: Why do the substitute parts have different contact finish thicknesses?

A: Contact finish thickness variations (10.0µin to 30.0µin) represent acceptable engineering tolerances within DIP socket specifications. Thicker finishes provide extended contact life in high-cycle insertion environments. All finishes meet the gold plating requirements for reliable electrical contact and corrosion resistance.

Q: What is the difference between bulk and tube packaging?

A: Bulk packaging supplies loose components in larger quantities, suitable for high-volume manufacturing. Tube packaging provides individual component protection in smaller quantities, reducing handling damage and simplifying inventory management for lower-volume applications. Both packaging types are suitable for standard PCB assembly processes.

Q: Does the REACH affected status of the Samtec part affect its usability?

A: REACH affected status indicates the component contains substances of concern under European chemical regulations. This designation does not prevent use but requires compliance documentation for distribution within European markets. Selection depends on supply chain and regulatory requirements specific to the end application and geographic distribution.

Q: Are the housing material differences between parts significant for circuit performance?

A: Housing materials (polyamide, polycyclohexylenedimethylene terephthalate, polyester) provide structural support and electrical isolation. All specified materials meet UL94 V-0 or equivalent flammability requirements. Material selection does not affect electrical performance or mechanical compatibility in standard IC socket applications.

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