1SS356TW11 Equivalent & Substitute Parts

Part Overview

The 1SS356TW11 is an RF diode standard manufactured by Rohm Semiconductor, designed for radio frequency applications requiring peak reverse voltage handling up to 35V with 200mW power dissipation capability. This single diode is packaged in SC-90/SOD-323F configuration and is currently in active production status. Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to inventory constraints, packaging preferences, or supply chain considerations.

Substiute Parts

1SS356TW11
Rohm SemiconductorIn Stock: 1201431SS356TW11 Datasheet
1SS356TW11
Current Part
1SS356VMTE-17
Rohm SemiconductorIn Stock: 20661SS356VMTE-17 Datasheet
1SS356VMTE-17
Similar

Key Parameters

Parameter Value
Manufacturer Part Number 1SS356TW11
Manufacturer Rohm Semiconductor
Diode Type Standard - Single
Voltage - Peak Reverse (Max) 35V
Current - Max 100 mA
Capacitance @ Vr, F 1.2pF @ 6V, 1MHz
Resistance @ If, F 900mOhm @ 2mA, 100MHz
Power Dissipation (Max) 200 mW
Operating Temperature 125°C (TJ)
Package / Case SC-90, SOD-323F
RoHS Status ROHS3 Compliant
Product Status Active

Substitute Part Grouping Explanation

Substitution eligibility for the 1SS356TW11 is determined by the following critical parameters:

  • Voltage - Peak Reverse (Max): 35V minimum
  • Current - Max: 100 mA minimum
  • Capacitance @ Vr, F: 1.2pF @ 6V, 1MHz
  • Resistance @ If, F: 900mOhm @ 2mA, 100MHz
  • Package compatibility: SC-90 or SOD-323 series
  • RoHS3 compliance requirement
  • Active product status

The 1SS356VMTE-17 qualifies as a substitute based on matching all critical electrical parameters and maintaining package family compatibility within the SC-90/SOD-323 series, despite differences in diode type classification and operating temperature rating.

Parameter Comparison

Parameter 1SS356TW11 1SS356VMTE-17
Manufacturer Rohm Semiconductor Rohm Semiconductor
Voltage - Peak Reverse (Max) 35V 35V
Current - Max 100 mA 100 mA
Capacitance @ Vr, F 1.2pF @ 6V, 1MHz 1.2pF @ 6V, 1MHz
Resistance @ If, F 900mOhm @ 2mA, 100MHz 900mOhm @ 2mA, 100MHz
Package / Case SC-90, SOD-323F SC-90, SOD-323FL
RoHS Status ROHS3 Compliant ROHS3 Compliant
Product Status Active Active
Operating Temperature 125°C (TJ) 150°C (TJ)

Engineering Selection Recommendations

Both the 1SS356TW11 and 1SS356VMTE-17 maintain active product status with ROHS3 compliance and REACH unaffected classification. Selection between these parts should be based on:

  • Packaging format requirement: Cut Tape (CT) & Digi-Reel® for 1SS356TW11 versus Tape & Reel (TR) for 1SS356VMTE-17
  • Operating temperature environment: 125°C maximum junction temperature for 1SS356TW11 versus 150°C for 1SS356VMTE-17
  • Inventory availability and supply chain lead times
  • PCB assembly process compatibility with respective packaging formats

Frequently Asked Questions (FAQ)

Q: Can 1SS356VMTE-17 directly replace 1SS356TW11 in existing designs?

A: Yes, provided the application environment does not exceed 125°C junction temperature and the assembly process accommodates Tape & Reel packaging. All critical electrical parameters match exactly.

Q: What is the difference between SOD-323F and SOD-323FL packages?

A: Both are SC-90 series packages within the SOD-323 family. The specific variant designation (F versus FL) indicates minor physical or lead configuration differences. Verify PCB footprint compatibility before substitution.

Q: Are there inventory or lead time advantages to using the substitute part?

A: The 1SS356VMTE-17 shows 2037 pieces in stock versus 120100 pieces for the 1SS356TW11. Selection should align with project timeline and volume requirements.

Q: Do both parts meet the same compliance standards?

A: Yes. Both parts are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99 with identical HTSUS codes.

Q: What determines whether a part qualifies as a substitute for RF diode applications?

A: Peak reverse voltage, maximum current rating, capacitance characteristics, resistance at specified frequency, and package family compatibility are the primary determining factors. Operating temperature and packaging format are secondary considerations based on application requirements.

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