1N5819M-13 Equivalent & Substitute Parts

Part Overview

The 1N5819M-13 is a Schottky rectifier diode manufactured by Diodes Incorporated, rated for 40 V DC reverse voltage and 1 A average rectified current in a surface mount MELF (DO-213AB) package. This component is classified as obsolete product status. Equivalent and substitute parts are necessary to maintain design continuity and ensure component availability for new production runs and legacy system support.

Key Parameters

Parameter	Value
Voltage - DC Reverse (Vr) (Max)	40 V
Current - Average Rectified (Io)	1 A
Voltage - Forward (Vf) (Max) @ If	600 mV @ 1 A
Speed	Fast Recovery ≤ 500ns, > 200mA (Io)
Current - Reverse Leakage @ Vr	1 mA @ 40 V
Mounting Type	Surface Mount
Package / Case	DO-213AB, MELF
Technology	Schottky
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the 1N5819M-13 is determined by the following critical parameters:

Electrical Compatibility Requirements:

Voltage - DC Reverse (Vr) (Max): 40 V minimum
Current - Average Rectified (Io): 1 A minimum
Technology: Schottky
Speed: Fast Recovery ≤ 500ns, > 200mA (Io)

Mechanical Compatibility Requirements:

Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (or equivalent surface mount packages)

Compliance Requirements:

RoHS Status: ROHS3 Compliant preferred
Moisture Sensitivity Level (MSL): 1 (Unlimited)

Substitute parts are grouped into two categories:

Category 1: Direct MELF Package Substitutes – Parts maintaining the same DO-213AB MELF package form factor with identical or superior electrical ratings.

Category 2: Alternative Surface Mount Package Substitutes – Parts with equivalent electrical performance in alternative surface mount packages (SMA, DO-41 through-hole) for applications where package form factor flexibility exists.

Parameter Comparison

Part Number	Manufacturer	Vr (Max)	Io	Vf (Max) @ If	Package	Mounting Type	Product Status	RoHS Status
1N5819M-13	Diodes Incorporated	40 V	1 A	600 mV @ 1 A	DO-213AB, MELF	Surface Mount	Obsolete	ROHS3 Compliant
1N5819-T	Diodes Incorporated	40 V	1 A	600 mV @ 1 A	DO-204AL, DO-41	Through Hole	Active	ROHS3 Compliant
B140-13-F	Diodes Incorporated	40 V	1 A	500 mV @ 1 A	DO-214AC, SMA	Surface Mount	Active	ROHS3 Compliant
BYM13-40-E3/96	Vishay General Semiconductor	40 V	1 A	500 mV @ 1 A	DO-213AB, MELF	Surface Mount	Active	ROHS3 Compliant
BYM13-40-E3/97	Vishay General Semiconductor	40 V	1 A	500 mV @ 1 A	DO-213AB, MELF	Surface Mount	Active	ROHS3 Compliant
BYM13-40HE3/96	Vishay General Semiconductor	40 V	1 A	500 mV @ 1 A	DO-213AB, MELF	Surface Mount	Active	ROHS3 Compliant
CDLL5819	Microchip Technology	45 V	1 A	490 mV @ 1 A	DO-213AB, MELF	Surface Mount	Active	RoHS non-compliant
SGL41-40-E3/96	Vishay General Semiconductor	40 V	1 A	500 mV @ 1 A	DO-213AB, MELF	Surface Mount	Active	ROHS3 Compliant
SGL41-40-E3/97	Vishay General Semiconductor	40 V	1 A	500 mV @ 1 A	DO-213AB, MELF	Surface Mount	Active	ROHS3 Compliant

Engineering Selection Recommendations

Primary Substitutes (Recommended for Direct Replacement):

The Vishay General Semiconductor parts BYM13-40-E3/96, BYM13-40-E3/97, BYM13-40HE3/96, SGL41-40-E3/96, and SGL41-40-E3/97 are recommended as primary substitutes. These parts maintain the identical DO-213AB MELF package form factor, meet or exceed the electrical specifications of the 1N5819M-13, and carry active product status with ROHS3 compliance. The forward voltage specification of 500 mV at 1 A represents an improvement over the original 600 mV specification.

Secondary Substitutes (Alternative Package Options):

The Diodes Incorporated B140-13-F provides equivalent electrical performance in an SMA surface mount package with active product status and ROHS3 compliance. This option is suitable for applications where alternative surface mount packages are acceptable.

The Diodes Incorporated 1N5819-T offers identical electrical specifications in a through-hole DO-41 package with active product status and ROHS3 compliance. This option is applicable only to designs that support through-hole mounting.

Conditional Substitute:

The Microchip Technology CDLL5819 meets electrical requirements with a 45 V reverse voltage rating and improved forward voltage specification of 490 mV at 1 A. However, this part carries RoHS non-compliant status and should be selected only when RoHS compliance is not a design requirement.

Frequently Asked Questions (FAQ)

Q: Can the 1N5819M-13 be directly replaced with any of the listed substitutes?

A: Direct replacement depends on package requirements. The Vishay BYM13 and SGL41 series parts in DO-213AB MELF package provide direct mechanical and electrical substitution. The Diodes B140-13-F requires an SMA footprint, and the 1N5819-T requires a through-hole footprint.

Q: What is the difference between BYM13-40-E3/96 and BYM13-40-E3/97?

A: Both parts are electrically and mechanically identical. The difference is in packaging: BYM13-40-E3/96 is supplied in Cut Tape (CT) & Digi-Reel format, while BYM13-40-E3/97 is supplied in Tape & Reel (TR) format.

Q: Why does the CDLL5819 have a higher reverse voltage rating (45 V) than the original part (40 V)?

A: The CDLL5819 is rated for 45 V maximum reverse voltage, which exceeds the 40 V requirement of the 1N5819M-13. This higher rating provides additional design margin. However, the CDLL5819 is RoHS non-compliant and should be evaluated against compliance requirements.

Q: Are all substitute parts ROHS3 compliant?

A: All substitutes except the CDLL5819 are ROHS3 compliant. The CDLL5819 is RoHS non-compliant and should be used only in applications where RoHS compliance is not required.

Q: What is the significance of the forward voltage difference between the original part (600 mV) and most substitutes (500 mV)?

A: The lower forward voltage specification of 500 mV in the Vishay and Diodes B140 parts represents improved performance characteristics. Lower forward voltage reduces power dissipation and heat generation in the application circuit.

Q: Can the 1N5819-T through-hole part be used as a substitute in a surface mount application?

A: No. The 1N5819-T is a through-hole component with DO-41 axial package and cannot be mounted on surface mount PCB layouts designed for the MELF package.

Q: What is the difference between SGL41-40-E3/96 and SGL41-40-E3/97?

A: Both parts are electrically and mechanically identical. The difference is in packaging: SGL41-40-E3/96 is supplied in Cut Tape (CT) & Digi-Reel format, while SGL41-40-E3/97 is supplied in Tape & Reel (TR) format.

Q: Is the B140-13-F suitable for applications requiring the MELF package form factor?

A: No. The B140-13-F uses the SMA package (DO-214AC), which has different physical dimensions and PCB footprint compared to the MELF package (DO-213AB). It is suitable only for designs with SMA footprints.

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