1N5818M-13 Equivalent & Substitute Parts

Part Overview

The 1N5818M-13 is a Schottky rectifier diode manufactured by Diodes Incorporated, rated for 30 V DC reverse voltage and 1 A average rectified current in a surface mount MELF (DO-213AB) package. This component is classified as obsolete, necessitating identification of equivalent substitute parts for ongoing design requirements and production continuity. Equivalent parts must maintain electrical performance within the specified parameters while accommodating available packaging and compliance options.

Substiute Parts

1N5818M-13

Diodes IncorporatedIn Stock: 10291N5818M-13 Datasheet

Current PartRFQ

B130-13-F

Diodes IncorporatedIn Stock: 155160B130-13-F Datasheet

MFR RecommendedRFQ

CDLL1A30

Microchip TechnologyIn Stock: 1213CDLL1A30 Datasheet

MFR RecommendedRFQ

CDLL5818

Microchip TechnologyIn Stock: 1116CDLL5818 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the 1N5818M-13 are selected based on electrical equivalence across the following critical parameters:

• Voltage Rating: All substitutes maintain 30 V DC reverse voltage maximum
• Current Rating: All substitutes support 1 A average rectified current
• Technology: All substitutes employ Schottky rectifier technology with fast recovery characteristics (≤ 500ns)
• Mounting Type: All substitutes are surface mount configurations
• Forward Voltage: Substitutes operate within acceptable forward voltage ranges at rated current
• Reverse Leakage: Substitutes maintain controlled reverse leakage characteristics at rated voltage

Substitutes are grouped by package type: MELF (DO-213AB) and SMA (DO-214AC). Package selection depends on PCB layout requirements and assembly process compatibility.

Parameter Comparison

Engineering Selection Recommendations

B130-13-F (Diodes Incorporated): This part is the manufacturer-recommended substitute. It maintains ROHS3 compliance and active product status. The SMA package (DO-214AC) differs from the original MELF package, requiring PCB layout modification. Forward voltage is improved at 500 mV versus 550 mV. Operating temperature range extends to 150°C, providing enhanced thermal margin. This substitute is suitable for new designs and production transitions where package change is acceptable.

CDLL5818 (Microchip Technology): This part maintains the original MELF package (DO-213AB), eliminating PCB layout changes. It is active and available. Operating temperature range extends to 150°C. However, RoHS non-compliance status must be evaluated against project requirements. Forward voltage increases to 600 mV. Reverse leakage improves to 100 µA. This substitute is suitable for applications where package compatibility is critical and RoHS compliance is not mandated.

CDLL1A30 (Microchip Technology): This part maintains the original MELF package (DO-213AB). It is active and available. RoHS non-compliance status applies. Operating temperature range is not specified in available data. Forward voltage is 600 mV. Reverse leakage is 100 µA. This substitute is suitable for package-critical applications where operating temperature data is not a design constraint and RoHS compliance is not required.

Frequently Asked Questions (FAQ)

Q: Can B130-13-F replace 1N5818M-13 directly on the PCB?

A: B130-13-F uses the SMA package (DO-214AC) while 1N5818M-13 uses MELF (DO-213AB). These packages have different footprints and land patterns. PCB layout modification is required. Direct mechanical substitution is not possible without redesign.

Q: What is the difference between MELF and SMA packages?

A: MELF (DO-213AB) and SMA (DO-214AC) are both surface mount packages but have different dimensions and land patterns. MELF is cylindrical with axial leads, while SMA is rectangular. Component selection depends on available PCB space and assembly equipment compatibility.

Q: Are CDLL5818 and CDLL1A30 interchangeable?

A: CDLL5818 and CDLL1A30 are both Microchip Schottky diodes in MELF packages with identical electrical ratings (30 V, 1 A). Both have 100 µA reverse leakage and 600 mV forward voltage. CDLL5818 specifies operating temperature range (-65°C ~ 150°C) while CDLL1A30 does not. For applications requiring defined temperature specifications, CDLL5818 is the appropriate selection.

Q: Does forward voltage difference affect circuit performance?

A: Forward voltage differences exist between substitutes: 1N5818M-13 at 550 mV, B130-13-F at 500 mV, and CDLL5818/CDLL1A30 at 600 mV. In rectification and switching applications, these differences may affect voltage drop and power dissipation. Circuit analysis is required to confirm acceptable performance within design margins.

Q: What is the impact of reverse leakage current differences?

A: Reverse leakage varies: 1N5818M-13 at 1 mA, B130-13-F at 500 µA, and CDLL5818/CDLL1A30 at 100 µA. Lower reverse leakage reduces standby current and improves efficiency in low-power applications. Higher leakage may be acceptable in high-current applications where leakage is negligible relative to forward current.

Q: Which substitute is recommended for new designs?

A: B130-13-F is the manufacturer-recommended substitute with active status, ROHS3 compliance, and extended operating temperature range. It requires PCB layout modification due to package change. For applications where package compatibility is mandatory, CDLL5818 maintains the MELF package with active status and extended temperature range, though RoHS compliance differs.

Q: Are all substitutes RoHS compliant?

A: B130-13-F is ROHS3 compliant. CDLL5818 and CDLL1A30 are RoHS non-compliant. Project requirements and regulatory obligations determine acceptable compliance status.