1N5239C-TAP Zener Diode Equivalent & Substitute Parts

Part Overview

The 1N5239C-TAP is a 9.1 V zener diode rated at 500 mW with ±2% tolerance, manufactured by Vishay General Semiconductor - Diodes Division. This through-hole component operates at a maximum temperature of 175°C and is qualified to AEC-Q101 automotive standards. The part is currently active and available in stock. Equivalent and substitute parts are identified based on matching electrical specifications and mechanical compatibility within the zener diode category, enabling component selection flexibility across multiple manufacturers and packaging formats.

Substiute Parts

1N5239C-TAP
Vishay General Semiconductor - Diodes DivisionIn Stock: 10081N5239C-TAP Datasheet
1N5239C-TAP
Current Part
1N5239B
Taiwan Semiconductor CorporationIn Stock: 18261N5239B Datasheet
1N5239B
MFR Recommended
1N5239BTR
Fairchild SemiconductorIn Stock: 419981N5239BTR Datasheet
1N5239BTR
MFR Recommended
1N757A-1
Microchip TechnologyIn Stock: 20331N757A-1 Datasheet
1N757A-1
MFR Recommended
BZX79-B9V1,113
Nexperia USA Inc.In Stock: 10895BZX79-B9V1,113 Datasheet
BZX79-B9V1,113
MFR Recommended
BZX79-B9V1,133
Nexperia USA Inc.In Stock: 8211BZX79-B9V1,133 Datasheet
BZX79-B9V1,133
MFR Recommended
BZX79-B9V1,143
NXP SemiconductorsIn Stock: 104210BZX79-B9V1,143 Datasheet
BZX79-B9V1,143
MFR Recommended
BZX79C9V1
Taiwan Semiconductor CorporationIn Stock: 25350BZX79C9V1 Datasheet
BZX79C9V1
MFR Recommended
BZX79C9V1-T50A
onsemiIn Stock: 15818BZX79C9V1-T50A Datasheet
BZX79C9V1-T50A
MFR Recommended

Key Parameters

Parameter Value Unit
Voltage - Zener (Nominal) 9.1 V
Tolerance ±2% -
Power - Maximum 500 mW
Impedance (Maximum) 10 Ohms
Current - Reverse Leakage @ Vr 3 µA @ 7 V
Voltage - Forward (Maximum) @ If 1.1 V @ 200 mA
Operating Temperature 175 °C
Mounting Type Through Hole -
Package / Case DO-204AH, DO-35, Axial -
RoHS Status ROHS3 Compliant -

Substitute Part Grouping Explanation

Substitution of the 1N5239C-TAP is determined by the following critical parameters: nominal zener voltage (9.1 V), maximum power dissipation (500 mW or higher), tolerance specification, impedance characteristics, reverse leakage current, forward voltage drop, operating temperature range, and through-hole mounting compatibility. Parts are grouped into two categories based on these criteria:

Group 1: Direct Electrical Equivalents (500 mW Rating) Parts matching the 500 mW power rating with 9.1 V nominal zener voltage and compatible electrical characteristics. These parts maintain the same power handling capability as the main part.

Group 2: Reduced Power Equivalents (400 mW Rating) Parts with 400 mW maximum power rating but matching 9.1 V nominal zener voltage and ±2% tolerance. These parts operate within reduced power dissipation limits and are suitable for applications where the full 500 mW capability is not required.

All substitute parts maintain through-hole mounting configuration and DO-35 or equivalent axial package compatibility. Tolerance, impedance, and temperature range variations are noted for application-specific selection.

Parameter Comparison

Part Number Manufacturer Vz (Nom) Tolerance Power (Max) Zzt (Max) Vf (Max) @ If Temp Range Package RoHS
1N5239C-TAP Vishay 9.1 V ±2% 500 mW 10 Ω 1.1 V @ 200 mA -65 to 175°C DO-35 ROHS3
1N5239B Taiwan Semiconductor 9.1 V ±5% 500 mW 10 Ω 1.1 V @ 200 mA -65 to 200°C DO-35 ROHS3
1N5239BTR Fairchild Semiconductor 9.1 V ±5% 500 mW 10 Ω 1.2 V @ 200 mA -65 to 200°C DO-35 Not specified
1N757A-1 Microchip Technology 9.1 V ±5% 500 mW 10 Ω 1.1 V @ 200 mA -65 to 175°C DO-35 Non-compliant
BZX79-B9V1,113 Nexperia USA Inc. 9.1 V ±2% 400 mW 15 Ω 900 mV @ 10 mA -65 to 200°C ALF2 ROHS3
BZX79-B9V1,133 Nexperia USA Inc. 9.1 V ±2% 400 mW 15 Ω 900 mV @ 10 mA -65 to 200°C ALF2 ROHS3
BZX79-B9V1,143 NXP Semiconductors 9.1 V ±2% 400 mW 15 Ω 900 mV @ 10 mA -65 to 200°C ALF2 Not specified
BZX79C9V1 Taiwan Semiconductor 9.1 V ±5% 500 mW 15 Ω 1.5 V @ 100 mA -65 to 175°C DO-35 ROHS3
BZX79C9V1-T50A onsemi 9.1 V ±5% 500 mW 15 Ω 1.5 V @ 100 mA -65 to 200°C DO-35 ROHS3

Engineering Selection Recommendations

For Direct Replacement (500 mW Power Rating):

The 1N5239B (Taiwan Semiconductor) and BZX79C9V1 (Taiwan Semiconductor) are suitable direct replacements when 500 mW power dissipation capacity is required. Both parts maintain the 9.1 V nominal zener voltage and through-hole DO-35 package configuration. The 1N5239B offers extended operating temperature to 200°C and ROHS3 compliance. The BZX79C9V1 provides equivalent power handling with ROHS3 compliance and extended temperature range to 200°C.

The 1N5239BTR (Fairchild Semiconductor) and BZX79C9V1-T50A (onsemi) are additional 500 mW options with extended temperature ranges to 200°C and ROHS3 compliance status.

For Reduced Power Applications (400 mW Power Rating):

The BZX79-B9V1,113, BZX79-B9V1,133, and BZX79-B9V1,143 (Nexperia/NXP) are suitable when maximum power dissipation of 400 mW is acceptable. These parts maintain ±2% tolerance matching the main part specification and operate across -65°C to 200°C. All three variants are ROHS3 compliant.

Compliance Considerations:

All recommended substitutes maintain ROHS3 compliance except 1N757A-1, which is RoHS non-compliant. The 1N757A-1 is included as a historical equivalent but should be selected only when RoHS non-compliance is acceptable for the application.

Frequently Asked Questions (FAQ)

Q: Can 1N5239B be used as a direct replacement for 1N5239C-TAP?

A: Yes. Both parts share the same 9.1 V nominal zener voltage, 500 mW power rating, and DO-35 through-hole package. The primary difference is tolerance (±5% versus ±2%) and operating temperature range (200°C versus 175°C maximum). The 1N5239B is suitable for applications where the tighter tolerance of the original part is not critical.

Q: What is the difference between the 500 mW and 400 mW zener diode options?

A: The 500 mW parts (1N5239B, 1N5239BTR, BZX79C9V1, BZX79C9V1-T50A) dissipate up to 500 mW of power. The 400 mW parts (BZX79-B9V1,113, BZX79-B9V1,133, BZX79-B9V1,143) dissipate up to 400 mW. Selection depends on the circuit's power dissipation requirements. If the application requires less than 400 mW, either option is acceptable.

Q: Are the ALF2 and DO-35 packages interchangeable?

A: Both ALF2 and DO-35 are through-hole axial packages for zener diodes. The ALF2 is a variant designation used by Nexperia/NXP for their through-hole zener package. Physical compatibility depends on PCB footprint design. Verify footprint compatibility before substitution.

Q: Why does 1N757A-1 show RoHS non-compliance?

A: The 1N757A-1 is listed as RoHS non-compliant in the provided data. This part should be selected only when RoHS compliance is not a requirement for the application. All other substitute options listed are ROHS3 compliant.

Q: What is the significance of the ±2% versus ±5% tolerance difference?

A: The 1N5239C-TAP specifies ±2% tolerance, meaning the actual zener voltage will be within 9.1 V ± 0.182 V. Substitute parts with ±5% tolerance (1N5239B, 1N757A-1, BZX79C9V1, BZX79C9V1-T50A) allow variation within 9.1 V ± 0.455 V. Applications requiring precise voltage regulation should use ±2% tolerance parts. Applications with wider voltage tolerance can use ±5% parts.

Q: Can I use BZX79-B9V1 series parts in automotive applications?

A: The main part 1N5239C-TAP is qualified to AEC-Q101 automotive standards. The BZX79-B9V1 series parts do not show AEC-Q101 qualification in the provided data. Verify automotive qualification requirements before substitution in automotive applications.

Q: What is the difference in forward voltage characteristics between substitute parts?

A: The main part specifies 1.1 V maximum forward voltage at 200 mA. Substitute parts vary: 1N5239B and 1N757A-1 match at 1.1 V @ 200 mA; 1N5239BTR is 1.2 V @ 200 mA; BZX79 series parts specify 1.5 V @ 100 mA. Forward voltage differences affect circuit behavior in forward-biased conditions. Select based on application requirements.

Q: Are all substitute parts available in the same packaging format?

A: No. The main part uses Tape & Box (TB) packaging. Substitute parts use various formats: Tape & Reel (TR), Bulk, and Cut Tape (CT). Packaging selection affects procurement, handling, and assembly processes. Verify packaging compatibility with your supply chain and assembly requirements.

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