160155J100M-F Film Capacitor Equivalent & Substitute Parts

Part Overview

The 160155J100M-F is a 1.5 µF film capacitor manufactured by Cornell Dubilier Electronics (CDE) in the 160 series. This radial through-hole component operates at 100V DC / 63V AC with polyester metallized dielectric construction. The part is Active status with full RoHS3 compliance and unlimited moisture sensitivity rating (MSL 1). Film capacitors of this specification are used in general-purpose applications requiring stable capacitance, low ESR, and reliable performance across extended temperature ranges (-55°C to 105°C). Equivalent substitute parts are identified based on matching electrical parameters, mechanical compatibility, and compliance certifications.

Substiute Parts

160155J100M-F
Cornell Dubilier Electronics (CDE)In Stock: 785160155J100M-F Datasheet
160155J100M-F
Current Part
B32522C1155J000
EPCOS - TDK ElectronicsIn Stock: 2682B32522C1155J000 Datasheet
B32522C1155J000
Similar

Key Parameters

Parameter Value Substitution Relevance
Capacitance 1.5 µF Critical - must match exactly
Tolerance ±5% Critical - defines acceptable capacitance range
Voltage Rating (DC) 100V Critical - minimum voltage requirement
Voltage Rating (AC) 63V Critical - AC application compatibility
Dielectric Material Polyester, Metallized Critical - determines electrical characteristics
Operating Temperature Range -55°C to 105°C Important - thermal performance envelope
Mounting Type Through Hole, Radial Critical - PCB assembly compatibility
Lead Spacing 0.886" (22.50mm) Critical - PCB footprint compatibility
RoHS Status ROHS3 Compliant Important - regulatory compliance

Substitute Part Grouping Explanation

Substitute parts for the 160155J100M-F are identified based on the following electrical and mechanical criteria:

Electrical Matching Parameters:

  • Capacitance value: 1.5 µF (exact match required)
  • Tolerance: ±5% (identical tolerance band)
  • Voltage rating: 100V DC minimum / 63V AC minimum
  • Dielectric type: Polyester metallized film (functionally equivalent formulations acceptable)

Mechanical Compatibility Parameters:

  • Mounting: Through-hole radial configuration
  • Termination: PC pins (standard radial lead format)
  • Lead spacing: 22.50mm nominal (allows ±tolerance variation within standard PCB grid)
  • Physical dimensions: Radial package envelope compatible with 0.2" grid spacing

Compliance & Certification:

  • RoHS3 compliance required
  • REACH unaffected status
  • EAR99 classification maintained

The B32522C1155J000 substitute meets all critical electrical parameters and maintains regulatory compliance. Physical dimension variations are acceptable within standard through-hole radial component tolerances.

Parameter Comparison

Parameter 160155J100M-F (CDE) B32522C1155J000 (EPCOS/TDK) Match Status
Capacitance 1.5 µF 1.5 µF Exact Match
Tolerance ±5% ±5% Exact Match
Voltage Rating (DC) 100V 100V Exact Match
Voltage Rating (AC) 63V 63V Exact Match
Dielectric Material Polyester, Metallized Polyester (PET), Metallized - Stacked Functionally Equivalent
Operating Temperature Range -55°C to 105°C -55°C to 125°C Substitute Exceeds Specification
Mounting Type Through Hole, Radial Through Hole, Radial Exact Match
Lead Spacing 22.50mm 15.00mm Different - See Notes
RoHS Status ROHS3 Compliant ROHS3 Compliant Exact Match
REACH Status REACH Unaffected REACH Unaffected Exact Match
ECCN Classification EAR99 EAR99 Exact Match

Engineering Selection Recommendations

Primary Selection: 160155J100M-F (CDE)

Use the original CDE 160155J100M-F when:

  • PCB layout requires 22.50mm lead spacing
  • Design has been validated with CDE 160 series specifications
  • Inventory availability is not a constraint (705 pcs in stock)
  • Original equipment manufacturer (OEM) part traceability is required

Substitute Selection: B32522C1155J000 (EPCOS/TDK)

The B32522C1155J000 is electrically and functionally equivalent for substitution when:

  • Lead spacing of 15.00mm is compatible with PCB layout
  • Higher operating temperature capability (-55°C to 125°C) meets or exceeds application requirements
  • AEC-Q200 automotive qualification is acceptable or required
  • Larger inventory availability (2600 pcs) supports supply chain needs
  • RoHS3 and REACH compliance requirements are met

Critical Substitution Constraint:

Lead spacing differs between parts (22.50mm vs. 15.00mm). PCB footprint modification is required if substituting B32522C1155J000 for 160155J100M-F. Verify PCB layout compatibility before component selection.

Frequently Asked Questions (FAQ)

Q: Can B32522C1155J000 be used as a direct drop-in replacement for 160155J100M-F?

A: Electrical substitution is valid. However, lead spacing differs (15.00mm vs. 22.50mm), requiring PCB footprint modification. Direct PCB mounting without layout changes is not possible.

Q: What are the key electrical parameters that must match for substitution?

A: Capacitance (1.5 µF), tolerance (±5%), voltage rating (100V DC / 63V AC), and dielectric type (polyester metallized) must match exactly. These parameters determine circuit performance and safety margins.

Q: Does the B32522C1155J000 meet the same compliance standards?

A: Yes. Both parts are RoHS3 compliant, REACH unaffected, and classified as EAR99. Compliance certifications are equivalent.

Q: Why does the substitute part have a different operating temperature range?

A: The B32522C1155J000 operates to 125°C maximum, exceeding the 160155J100M-F specification of 105°C. This represents enhanced thermal capability and does not create substitution conflicts. The substitute meets or exceeds the original specification.

Q: Are there any application-specific considerations for the substitute?

A: The B32522C1155J000 carries AEC-Q200 automotive qualification. This certification is compatible with general-purpose applications and does not restrict use in non-automotive circuits.

Q: What is the impact of different physical dimensions?

A: The B32522C1155J000 is physically smaller (18.00mm L x 6.00mm W vs. 26.50mm L x 7.00mm W). This may provide PCB layout advantages but requires footprint redesign. Lead spacing difference is the primary constraint.

Q: Can both parts be used interchangeably in the same design revision?

A: No. PCB layout differences due to lead spacing require design-specific validation. Each part requires separate PCB footprint definition and assembly documentation.

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