Equivalent & Substitute Parts for 1337GDVGI Real Time Clock IC

Part Overview

The 1337GDVGI is an active Real Time Clock (RTC) IC manufactured by Renesas Electronics Corporation, designed for clock/calendar applications with I2C serial interface. This 8-TSSOP surface mount device operates across 1.8V to 5.5V supply range with ultra-low timekeeping current of 0.6µA at 1.3V–1.8V. The part is ROHS3 compliant and carries MSL 3 moisture sensitivity rating.

Equivalent and substitute parts are identified to address inventory availability, packaging preferences, performance optimization, or design flexibility requirements while maintaining functional compatibility within the I2C clock/calendar category.

Key Parameters

Parameter	1337GDVGI
Manufacturer	Renesas Electronics Corporation
Category	Clock/Timing
Type	Clock/Calendar
Interface	I2C, 2-Wire Serial
Package / Case	8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Voltage - Supply	1.8V ~ 5.5V
Current - Timekeeping (Max)	0.6µA @ 1.3V ~ 1.8V
Operating Temperature	-40°C ~ 85°C
Features	Alarm, Leap Year, Square Wave Output
Time Format	HH:MM:SS (12/24 hr)
Date Format	YY-MM-DD-dd
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Product Status	Active

Substitute Part Grouping Explanation

Substitution logic is based on the following critical parameters that determine functional compatibility:

Primary Compatibility Criteria:

Interface type: I2C, 2-Wire Serial (mandatory match)
Time format: HH:MM:SS with 12/24 hour support
Date format: YY-MM-DD-dd
Operating temperature range: -40°C ~ 85°C
Supply voltage overlap: minimum 1.8V to 5.5V range
Mounting type: Surface Mount
RoHS3 compliance and active product status

Secondary Compatibility Criteria:

Package / Case: 8-pin configurations (8-TSSOP, 8-MSOP, 8-SOIC, 8-uMAX/uSOP acceptable)
Features: Alarm and Leap Year support (core requirements)
Current consumption: Lower or equivalent timekeeping current preferred

Substitute parts are grouped into two categories:

Category A - Direct Renesas Equivalent: 1337AGDVGI (same manufacturer, identical electrical specifications, packaging variant)

Category B - Cross-Manufacturer Alternatives: DS1339BU+T, DS1339U-3+, DS1342U+ (Analog Devices/Maxim Integrated, 8-pin TSSOP/uMAX packages) DS1340Z-33+ (Analog Devices/Maxim Integrated, 8-pin SOIC package) M41T82RM6F (STMicroelectronics, 8-pin SOIC package) MCP7940MT-I/MS, MCP7940N-I/ST (Microchip Technology, 8-pin MSOP/TSSOP packages)

Category C - Enhanced Feature Alternatives: AB1805-T3 (Abracon LLC, 16-pin QFN with extended memory and watchdog timer) M41T83ZQA6F (STMicroelectronics, 16-pin QFN with extended memory and watchdog timer)

Parameter Comparison

Part Number	Manufacturer	Package / Case	Voltage - Supply	Current - Timekeeping (Max)	Features	Memory Size	RoHS Status	Product Status
1337GDVGI	Renesas Electronics	8-TSSOP, 8-MSOP	1.8V ~ 5.5V	0.6µA @ 1.3V ~ 1.8V	Alarm, Leap Year, Square Wave Output	—	ROHS3	Active
1337AGDVGI	Renesas Electronics	8-TSSOP, 8-MSOP	1.8V ~ 5.5V	0.3µA @ 1.3V ~ 1.8V	Alarm, Leap Year, Square Wave Output	—	ROHS3	Active
DS1339BU+T	Analog Devices/Maxim	8-TSSOP, 8-MSOP	1.71V ~ 5.5V	200µA @ 1.71V ~ 5.5V	Alarm, Leap Year, Square Wave Output, Trickle-Charger	—	ROHS3	Active
DS1339U-3+	Analog Devices/Maxim	8-TSSOP, 8-MSOP	2.7V ~ 5.5V	150µA @ 3.3V	Alarm, Leap Year, Square Wave Output, Trickle-Charger	—	ROHS3	Active
DS1340Z-33+	Analog Devices/Maxim	8-SOIC	2.97V ~ 5.5V	150µA @ 5.5V	Leap Year, Trickle-Charger	—	ROHS3	Active
DS1342U+	Analog Devices/Maxim	8-TSSOP, 8-MSOP	1.8V ~ 5.5V	0.6µA ~ 0.7µA @ 3V ~ 5V	Alarm, Leap Year, Square Wave Output	—	ROHS3	Active
AB1805-T3	Abracon LLC	16-VFQFN Exposed Pad	1.7V ~ 3.6V	0.17µA ~ 0.22µA @ 1.8V ~ 3V	Alarm, Leap Year, SRAM, Trickle-Charger, Watchdog Timer	256B	ROHS3	Active
M41T82RM6F	STMicroelectronics	8-SOIC	2.7V ~ 5.5V	10µA @ 5.5V	Alarm, Leap Year, SRAM, Watchdog Timer	7B	ROHS3	Active
M41T83ZQA6F	STMicroelectronics	16-VQFN Exposed Pad	2.38V ~ 5.5V	10µA @ 5.5V	Alarm, Leap Year, Square Wave Output, SRAM, Watchdog Timer	7B	ROHS3	Active
MCP7940MT-I/MS	Microchip Technology	8-TSSOP, 8-MSOP	1.8V ~ 5.5V	1µA @ 5.5V	Alarm, Leap Year, Square Wave Output, SRAM	64B	ROHS3	Active
MCP7940N-I/ST	Microchip Technology	8-TSSOP	1.8V ~ 5.5V	1.2µA @ 3.3V	Alarm, Leap Year, Square Wave Output, SRAM	64B	ROHS3	Active

Engineering Selection Recommendations

Direct Equivalent (Recommended for Pin-Compatible Replacement):

1337AGDVGI is the primary equivalent, manufactured by Renesas Electronics Corporation with identical electrical interface and package specifications. This part demonstrates improved timekeeping current performance (0.3µA versus 0.6µA) while maintaining full compatibility with 1337GDVGI designs. Both parts carry ROHS3 compliance and active product status.

Cross-Manufacturer Alternatives (8-Pin Packages):

DS1342U+ (Analog Devices/Maxim Integrated) provides the closest electrical match among cross-manufacturer options, with timekeeping current of 0.6µA–0.7µA and identical 1.8V–5.5V supply range. This part maintains 8-TSSOP/8-MSOP package compatibility and includes alarm, leap year, and square wave output features. ROHS3 compliant and active product status.

DS1339BU+T and DS1339U-3+ offer alternative 8-pin configurations with trickle-charger functionality. DS1339BU+T supports 1.71V minimum supply voltage; DS1339U-3+ requires 2.7V minimum. Both are ROHS3 compliant and active.

DS1340Z-33+ (Analog Devices/Maxim Integrated) uses 8-SOIC package format with trickle-charger support. Minimum supply voltage is 2.97V. ROHS3 compliant and active product status.

Microchip Technology Alternatives (8-Pin Packages):

MCP7940MT-I/MS and MCP7940N-I/ST both provide 64B SRAM memory with alarm, leap year, and square wave output features. Supply range matches 1337GDVGI (1.8V–5.5V). MCP7940N-I/ST carries AEC-Q100 automotive qualification. Both ROHS3 compliant and active.

Enhanced Feature Alternatives (16-Pin Packages):

AB1805-T3 (Abracon LLC) and M41T83ZQA6F (STMicroelectronics) offer expanded functionality including watchdog timer, SRAM memory, and trickle-charger in 16-pin QFN packages. These require PCB layout redesign but provide additional system protection features. Both ROHS3 compliant and active product status.

Frequently Asked Questions (FAQ)

Q: Can 1337AGDVGI directly replace 1337GDVGI without design changes?

A: Yes. 1337AGDVGI is manufactured by Renesas Electronics Corporation with identical pin configuration, package dimensions (8-TSSOP, 8-MSOP 0.118" × 3.00mm), and electrical interface (I2C, 2-Wire Serial). Supply voltage range (1.8V–5.5V), operating temperature (-40°C–85°C), and feature set (Alarm, Leap Year, Square Wave Output) are identical. The primary difference is improved timekeeping current (0.3µA versus 0.6µA). No design modifications required.

Q: What are the key differences between 8-pin and 16-pin RTC alternatives?

A: 8-pin packages (TSSOP, MSOP, SOIC, uMAX) maintain the same footprint as 1337GDVGI and require no PCB layout changes. 16-pin packages (QFN) require PCB redesign but provide additional features such as watchdog timer, extended SRAM memory (256B or 7B), and trickle-charger functionality. Select 8-pin alternatives for drop-in replacement; select 16-pin alternatives when additional system protection or memory is required.

Q: Which substitute parts have the lowest timekeeping current consumption?

A: AB1805-T3 (Abracon LLC) demonstrates the lowest timekeeping current at 0.17µA–0.22µA @ 1.8V–3V. 1337AGDVGI provides 0.3µA @ 1.3V–1.8V. DS1342U+ offers 0.6µA–0.7µA @ 3V–5V. Select based on supply voltage operating point and power budget requirements.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All listed substitute parts carry ROHS3 compliance certification and active product status, meeting environmental and regulatory requirements equivalent to 1337GDVGI.

Q: What is the difference between 8-TSSOP and 8-SOIC packages?

A: 8-TSSOP (Thin Shrink Small Outline Package) measures 0.118" × 3.00mm width. 8-SOIC (Small Outline Integrated Circuit) measures 0.154" × 3.90mm width. SOIC packages are slightly larger and may require PCB footprint adjustment. Verify PCB layout compatibility before selecting SOIC alternatives such as DS1340Z-33+ or M41T82RM6F.

Q: Can I use DS1339 or DS1340 series parts as direct replacements?

A: DS1339BU+T and DS1339U-3+ are functionally compatible with I2C interface, alarm, leap year, and square wave output features. However, timekeeping current is significantly higher (150µA–200µA versus 0.6µA), making them unsuitable for ultra-low-power applications. DS1340Z-33+ uses 8-SOIC package (not 8-TSSOP) and requires PCB layout verification. Use only if power consumption increase is acceptable and package change is feasible.

Q: Which substitute parts include SRAM memory?

A: AB1805-T3 (256B SRAM), M41T82RM6F (7B SRAM), M41T83ZQA6F (7B SRAM), MCP7940MT-I/MS (64B SRAM), and MCP7940N-I/ST (64B SRAM) include integrated SRAM. 1337GDVGI does not include SRAM. Select memory-equipped alternatives only if application requires non-volatile data storage beyond time/date registers.

Q: Is MCP7940N-I/ST suitable for automotive applications?

A: Yes. MCP7940N-I/ST carries AEC-Q100 automotive qualification and Grade designation. This part is suitable for automotive-grade designs requiring qualified component documentation. Other alternatives do not carry automotive qualification.

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