Equivalent & Substitute Parts for 1337DCGI

Part Overview

The 1337DCGI is a Real Time Clock (RTC) IC with Clock/Calendar functionality manufactured by Renesas Electronics Corporation. This 8-SOIC surface mount device provides I2C/2-Wire Serial interface with alarm, leap year, and square wave output capabilities. The part is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement continuity.

Key Parameters

Parameter	Value
Manufacturer	Renesas Electronics Corporation
Part Number	1337DCGI
Category	Clock/Timing
Type	Clock/Calendar
Package / Case	8-SOIC (0.154", 3.90mm Width)
Interface	I2C, 2-Wire Serial
Voltage - Supply	1.8V ~ 5.5V
Current - Timekeeping (Max)	0.6µA @ 1.3V ~ 1.8V
Operating Temperature	-40°C ~ 85°C
Time Format	HH:MM:SS (12/24 hr)
Date Format	YY-MM-DD-dd
Features	Alarm, Leap Year, Square Wave Output
Product Status	Obsolete
Mounting Type	Surface Mount
Moisture Sensitivity Level (MSL)	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the 1337DCGI is determined by the following critical parameters:

Primary Compatibility Criteria:

Package / Case: 8-SOIC (0.154", 3.90mm Width) — ensures PCB footprint compatibility
Interface: I2C, 2-Wire Serial — maintains firmware and hardware interface compatibility
Voltage - Supply: 1.8V ~ 5.5V — ensures power supply compatibility
Operating Temperature: -40°C ~ 85°C — maintains thermal operating range
Time Format: HH:MM:SS (12/24 hr) — preserves time representation capability
Date Format: YY-MM-DD-dd — preserves date representation capability
Features: Alarm, Leap Year, Square Wave Output — core functional requirements

Secondary Considerations:

Current - Timekeeping (Max): 0.6µA @ 1.3V ~ 1.8V — low-power operation requirement
Product Status: Active preferred for long-term availability
RoHS/REACH Compliance: Ensures regulatory alignment

Substitute parts are grouped into two categories: direct pin-compatible replacements (same package, interface, and voltage range) and functional equivalents with package variations that require PCB redesign.

Parameter Comparison

Parameter	1337DCGI	DS1337S+	DS1337S+T&R	DS1338Z-33+	BU9873FVT-GE2	BQ32000DR	AB-RTCMC-32.768KHZ-AIGZ-S7-T
Manufacturer	Renesas	Analog Devices/Maxim	Analog Devices/Maxim	Analog Devices/Maxim	Rohm Semiconductor	Texas Instruments	Abracon LLC
Package / Case	8-SOIC	8-SOIC	8-SOIC	8-SOIC	8-TSSOP	8-SOIC	8-WCDFN
Interface	I2C, 2-Wire	I2C, 2-Wire	I2C, 2-Wire	I2C, 2-Wire	I2C, 2-Wire	I2C, 2-Wire	I2C, 2-Wire
Voltage - Supply	1.8V ~ 5.5V	1.8V ~ 5.5V	1.8V ~ 5.5V	3V ~ 5.5V	1.8V ~ 5.5V	3V ~ 3.6V	1V ~ 4.4V
Current - Timekeeping (Max)	0.6µA @ 1.3V ~ 1.8V	0.6µA @ 1.3V ~ 1.8V	0.6µA @ 1.3V ~ 1.8V	125µA ~ 200µA @ 3.63V ~ 5.5V	1µA ~ 1.35µA @ 3V ~ 5.5V	100µA @ 3.3V	0.4µA ~ 0.95µA @ 1V ~ 4.4V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C
Time Format	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (24 hr)	HH:MM:SS:hh (24 hr)
Date Format	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd
Features	Alarm, Leap Year, Square Wave Output	Alarm, Leap Year, Square Wave Output	Alarm, Leap Year, Square Wave Output	Leap Year, NVSRAM, Square Wave Output	Alarm, Leap Year	Leap Year, Square Wave Output, Trickle-Charger	Alarm, Leap Year, Watchdog Timer
Memory Size	—	—	—	56B	—	—	—
Product Status	Obsolete	Active	Active	Active	Not For New Designs	Active	Active
RoHS Status	—	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected	REACH Unaffected	REACH Unaffected	REACH Unaffected	REACH Unaffected

Engineering Selection Recommendations

Tier 1 — Direct Pin-Compatible Replacements (No PCB Redesign Required):

DS1337S+ and DS1337S+T&R are the primary substitutes. Both are manufactured by Analog Devices Inc./Maxim Integrated and provide identical electrical and mechanical compatibility with the 1337DCGI. These parts maintain the 8-SOIC package, I2C interface, 1.8V ~ 5.5V supply voltage range, and core RTC functionality. Both are Active status products with ROHS3 compliance and REACH Unaffected designation. The DS1337S+T&R variant offers higher inventory availability (100,100 pcs) in Cut Tape & Digi-Reel packaging.

DS1338Z-33+ is a pin-compatible alternative with identical package and interface specifications. This part includes 56B NVSRAM, providing additional non-volatile storage capability. However, the supply voltage range is restricted to 3V ~ 5.5V, which may not support the full 1.8V lower limit of the original design. Current consumption is significantly higher (125µA ~ 200µA vs. 0.6µA), making it unsuitable for ultra-low-power applications.

Tier 2 — Functional Equivalents with Package Variations (PCB Redesign Required):

BU9873FVT-GE2 (Rohm Semiconductor) maintains the I2C interface and core RTC functionality but uses an 8-TSSOP package instead of 8-SOIC. This requires PCB footprint redesign. The part is classified as Not For New Designs, limiting its suitability for long-term production. Supply voltage range (1.8V ~ 5.5V) and operating temperature (-40°C ~ 85°C) are compatible.

AB-RTCMC-32.768KHZ-AIGZ-S7-T (Abracon LLC) uses an 8-WCDFN package, requiring PCB redesign. This part offers the lowest timekeeping current (0.4µA ~ 0.95µA) and extended supply voltage range (1V ~ 4.4V), making it suitable for ultra-low-power designs. However, the time format includes hundredths of seconds (HH:MM:SS:hh), which may require firmware adaptation.

BQ32000DR (Texas Instruments) is restricted to 3V ~ 3.6V supply voltage and 24-hour time format only, limiting compatibility with designs requiring 12-hour operation or lower voltage operation.

Compliance and Availability:

All recommended Tier 1 substitutes are ROHS3 compliant and REACH Unaffected, meeting current regulatory requirements. DS1337S+T&R offers the highest inventory availability for immediate procurement.

Frequently Asked Questions (FAQ)

Q: Can DS1337S+ be used as a direct replacement for 1337DCGI without PCB modifications?

A: Yes. DS1337S+ is pin-compatible with identical 8-SOIC packaging, I2C interface, and 1.8V ~ 5.5V supply voltage range. No PCB redesign is required. Firmware compatibility depends on register-level implementation details not specified in this reference.

Q: What is the primary difference between DS1337S+ and DS1338Z-33+?

A: DS1338Z-33+ includes 56B of NVSRAM for data storage, whereas DS1337S+ does not. However, DS1338Z-33+ has a restricted supply voltage range (3V ~ 5.5V) and significantly higher timekeeping current (125µA ~ 200µA vs. 0.6µA), making it unsuitable for designs requiring the full 1.8V lower limit or ultra-low-power operation.

Q: Why is BU9873FVT-GE2 marked as "Not For New Designs"?

A: This designation indicates the manufacturer has discontinued active development and support for this product line. While functionally compatible, it is not recommended for new designs due to limited long-term availability and support.

Q: Can AB-RTCMC-32.768KHZ-AIGZ-S7-T be used in existing designs without firmware changes?

A: The 8-WCDFN package requires PCB redesign. Additionally, the time format includes hundredths of seconds (HH:MM:SS:hh) compared to the original HH:MM:SS format, which may require firmware adaptation depending on the application's time resolution requirements.

Q: What is the key limitation of BQ32000DR as a substitute?

A: BQ32000DR operates only in 24-hour time format and requires a 3V ~ 3.6V supply voltage. Designs requiring 12-hour operation or lower voltage operation (down to 1.8V) cannot use this part.

Q: Which substitute offers the lowest power consumption?

A: AB-RTCMC-32.768KHZ-AIGZ-S7-T provides the lowest timekeeping current at 0.4µA ~ 0.95µA across its 1V ~ 4.4V supply range, compared to 0.6µA for the original 1337DCGI. However, this requires PCB redesign due to the 8-WCDFN package.

Q: Are all substitute parts RoHS and REACH compliant?

A: All Tier 1 and Tier 2 substitutes listed are ROHS3 compliant and REACH Unaffected, meeting current regulatory requirements for electronic components.

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