Equivalent & Substitute Parts for 1206J2500823KXT

Part Overview

The 1206J2500823KXT is a 0.082 µF ceramic capacitor rated at 250V with X7R temperature coefficient, manufactured by Knowles Syfer. This surface mount multilayer ceramic capacitor (MLCC) is designed for general purpose applications requiring stable capacitance across a wide operating temperature range of -55°C to 125°C. The part is currently active in production with ROHS3 compliance and unlimited moisture sensitivity rating (MSL 1). Equivalent and substitute parts are identified to provide procurement flexibility, supply chain alternatives, and inventory optimization while maintaining identical electrical and mechanical specifications.

Substiute Parts

1206J2500823KXT

Knowles SyferIn Stock: 8841206J2500823KXT Datasheet

Current PartRFQ

C1206C823KARAC7800

KEMETIn Stock: 16223C1206C823KARAC7800 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the 1206J2500823KXT are qualified based on strict equivalence of the following critical parameters:

• Capacitance value: 0.082 µF
• Tolerance: ±10%
• Voltage rating: 250V
• Temperature coefficient: X7R
• Package designation: 1206 (3216 Metric)
• Mounting technology: Surface Mount, MLCC
• Compliance certifications: ROHS3, REACH Unaffected

The KEMET part C1206C823KARAC7800 meets all substitution criteria as a direct equivalent. Both parts share identical electrical ratings, temperature performance characteristics, and physical package dimensions. Substitution is valid for applications where the main part is specified, provided that board layout and assembly processes accommodate the identified physical differences.

Parameter Comparison

Engineering Selection Recommendations

Both the 1206J2500823KXT and C1206C823KARAC7800 are active production parts with full ROHS3 compliance and REACH unaffected status, making them suitable for applications requiring regulatory compliance in restricted substance directives. The KEMET substitute offers a thickness advantage of 0.020" (0.50mm) maximum, which may provide benefits in space-constrained board designs while maintaining all electrical equivalence. Selection between these parts should be based on procurement availability, lead time requirements, and board assembly clearance specifications. Both parts carry MSL 1 rating, eliminating moisture sensitivity concerns for standard storage and handling conditions.

Frequently Asked Questions (FAQ)

Q: Can C1206C823KARAC7800 be used as a direct replacement for 1206J2500823KXT in existing designs?

A: Yes. Both parts are electrically identical with matching capacitance (0.082 µF), tolerance (±10%), voltage rating (250V), and temperature coefficient (X7R). The KEMET part is thinner (0.043" vs 0.063" maximum thickness), which is compatible with standard 1206 package footprints and may provide additional board clearance.

Q: Are there any compliance or certification differences between these parts?

A: No. Both parts carry identical ROHS3 compliance, REACH unaffected status, and MSL 1 moisture sensitivity rating. They are equivalent for applications requiring regulatory compliance.

Q: What is the significance of the thickness difference?

A: The KEMET C1206C823KARAC7800 has a maximum thickness of 0.043" compared to 0.063" for the Knowles Syfer part. This difference does not affect electrical performance and may provide additional clearance in designs with height constraints. Standard 1206 footprints accommodate both thicknesses.

Q: Are these parts interchangeable in terms of soldering and assembly?

A: Yes. Both parts use identical surface mount technology and 1206 package designation. Standard reflow soldering processes and pick-and-place assembly equipment are compatible with both parts without modification.

Q: What inventory considerations apply to these substitutes?

A: The KEMET part C1206C823KARAC7800 currently has higher inventory availability (16,119 pcs) compared to the Knowles Syfer part (827 pcs), which may influence procurement decisions for high-volume applications or extended lead time mitigation.