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TE Connectivity 1-103675-4 Equivalent & Substitute Parts
Part Overview
The TE Connectivity 1-103675-4 is a rectangular connector header manufactured under the AMPMODU Mod II series. This through-hole connector features 26 positions arranged in 2 rows with 0.100" (2.54mm) pitch spacing, designed for board-to-board or cable interconnection applications. The connector utilizes male pins with gold-plated mating contacts and tin-lead plated posts, terminated through solder.
The 1-103675-4 is classified as obsolete product status. Identification of equivalent and substitute parts is necessary to support ongoing maintenance, repair, and new design requirements where this connector type is specified or functionally required.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Connector Type | Header, Breakaway |
| Contact Type | Male Pin |
| Number of Positions | 26 |
| Number of Rows | 2 |
| Pitch - Mating | 0.100" (2.54mm) |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Termination | Solder |
| Fastening Type | Push-Pull |
| Contact Shape | Square |
| Insulation Material | Thermoplastic |
| Material Flammability Rating | UL94 V-0 |
| Insulation Color | Black |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the TE Connectivity 1-103675-4 is determined by strict alignment of the following critical parameters:
Primary Matching Criteria:
- Connector type: Header, Breakaway
- Contact type: Male Pin
- Number of positions: 26
- Number of rows: 2
- Pitch - mating: 0.100" (2.54mm)
- Row spacing - mating: 0.100" (2.54mm)
- Mounting type: Through Hole
- Termination: Solder
- Fastening type: Push-Pull
- Contact shape: Square
- Material flammability rating: UL94 V-0
- Insulation color: Black
- Moisture sensitivity level: 1 (Unlimited)
Secondary Compatibility Considerations:
- Contact length variations within mechanical envelope constraints
- Insulation material composition (thermoplastic vs. liquid crystal polymer)
- Contact finish specifications (gold vs. tin plating)
- Contact finish thickness tolerances
- Overall contact length and post length dimensions
Substitute parts are grouped by manufacturer and series. All listed substitutes maintain the core electrical and mechanical interface requirements necessary for functional equivalence in standard through-hole PCB applications.
Parameter Comparison
| Parameter | 1-103675-4 (TE) | 0010897260 (Molex) | 0010897261 (Molex) | 0010897262 (Molex) | 0702871109 (Molex) | 0879142616 (Molex) | 10076801-101-26LF (Amphenol) | 10076801-401A26LF (Amphenol) | 67997-726HLF (Amphenol) | TSW-113-08-F-D (Samtec) |
|---|---|---|---|---|---|---|---|---|---|---|
| Connector Type | Header, Breakaway | Header, Breakaway | Header, Breakaway | Header, Breakaway | Header, Breakaway | Header, Breakaway | Header, Breakaway | Header, Breakaway | Header | Header |
| Contact Type | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin | Male Pin |
| Number of Positions | 26 | 26 | 26 | 26 | 26 | 26 | 26 | 26 | 26 | 26 |
| Number of Rows | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Row Spacing - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole | Through Hole |
| Termination | Solder | Solder | Solder | Solder | Kinked Pin, Solder | Solder | Solder | Solder | Solder | Solder |
| Fastening Type | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull | Push-Pull |
| Contact Shape | Square | Square | Square | Square | Square | Square | Square | Square | Square | Square |
| Contact Length - Mating | 0.230" (5.84mm) | 0.240" (6.10mm) | 0.240" (6.10mm) | 0.240" (6.10mm) | 0.240" (6.10mm) | 0.230" (5.84mm) | 0.230" (5.84mm) | 0.230" (5.84mm) | 0.230" (5.84mm) | 0.230" (5.84mm) |
| Contact Length - Post | 0.120" (3.05mm) | 0.107" (2.71mm) | 0.107" (2.71mm) | 0.107" (2.71mm) | 0.125" (3.18mm) | 0.110" (2.79mm) | 0.098" (2.50mm) | 0.098" (2.50mm) | 0.120" (3.05mm) | 0.200" (5.08mm) |
| Overall Contact Length | 0.440" (11.18mm) | 0.437" (11.10mm) | 0.437" (11.10mm) | 0.437" (11.10mm) | 0.455" (11.56mm) | 0.430" (10.92mm) | 0.440" (11.18mm) | 0.440" (11.18mm) | 0.450" (11.43mm) | 0.530" (13.46mm) |
| Insulation Height | 0.090" (2.29mm) | 0.090" (2.29mm) | 0.090" (2.29mm) | 0.090" (2.29mm) | 0.090" (2.29mm) | 0.090" (2.29mm) | 0.112" (2.85mm) | 0.112" (2.85mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold | Gold | Tin | Gold | Gold | Tin | Gold or Gold, GXT™ | Tin | Gold or Gold, GXT™ | Gold |
| Contact Finish Thickness - Mating | 15.0µin (0.38µm) | 30.0µin (0.76µm) | 150.0µin (3.81µm) | 15.0µin (0.38µm) | 15.0µin (0.38µm) | 100.0µin (2.54µm) | 30.0µin (0.76µm) | 78.7µin (2.00µm) | 30.0µin (0.76µm) | 3.00µin (0.076µm) |
| Contact Finish - Post | Tin-Lead | Tin | Tin | Tin | Tin | Tin | Tin | Tin | Not Specified | Tin |
| Contact Material | Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy | Phosphor Bronze | Phosphor Bronze | Phosphor Bronze | Phosphor Bronze |
| Insulation Material | Thermoplastic | Liquid Crystal Polymer (LCP), Glass Filled | Liquid Crystal Polymer (LCP), Glass Filled | Liquid Crystal Polymer (LCP), Glass Filled | Liquid Crystal Polymer (LCP), Glass Filled | Liquid Crystal Polymer (LCP), Glass Filled | Thermoplastic | Thermoplastic | Not Specified | Polybutylene Terephthalate (PBT) |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 |
| Insulation Color | Black | Black | Black | Black | Black | Black | Black | Black | Black | Black |
| Product Status | Obsolete | Active | Active | Active | Active | Active | Active | Active | Active | Active |
| RoHS Status | RoHS non-compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
Primary Substitutes (Highest Compatibility):
The Molex C-Grid 70280 series parts (0010897260, 0010897261, 0010897262) and Molex C-Grid 87914 series part (0879142616) provide direct functional equivalence to the 1-103675-4. These parts maintain identical pitch spacing, row configuration, position count, and through-hole solder termination. All Molex substitutes carry active product status and ROHS3 compliance, addressing the obsolescence and regulatory limitations of the original TE part.
The Amphenol ICC BERGSTIK® series parts (10076801-101-26LF, 10076801-401A26LF) and BERGSTIK® II series part (67997-726HLF) offer functional equivalence with active product status and RoHS compliance. These parts feature phosphor bronze contacts and thermoplastic insulation materials similar to the original design. The 10076801-101-26LF variant is available in standard bag packaging, while 10076801-401A26LF includes pick-and-place features in tape and reel format.
The Samtec TSW series part (TSW-113-08-F-D) provides functional equivalence with active product status and ROHS3 compliance. This part features polybutylene terephthalate insulation material and phosphor bronze contacts. The TSW series exhibits a longer contact post length (0.200" vs. 0.120") compared to the original part, which may require PCB design verification for clearance compatibility.
Regulatory Compliance Considerations:
The original 1-103675-4 is classified as RoHS non-compliant. All listed substitute parts meet either RoHS or ROHS3 compliance standards, making them suitable for applications subject to RoHS directives. The Molex C-Grid series parts are ROHS3 compliant and REACH unaffected, providing the most favorable regulatory profile for new designs and procurement.
Product Availability:
All substitute parts maintain active product status with current manufacturing and distribution. Inventory levels across substitute options range from 717 to 3245 units, ensuring supply chain continuity for both prototype and production requirements.
Frequently Asked Questions (FAQ)
Q: Can the Molex 0010897260 directly replace the TE Connectivity 1-103675-4 in existing designs?
A: The Molex 0010897260 maintains identical pitch spacing (0.100"), row configuration (2 rows), position count (26), and through-hole solder termination. The contact length mating dimension differs by 0.010" (0.26mm), which falls within standard mechanical tolerance ranges for push-pull connector interfaces. Functional compatibility is established for standard PCB applications. Physical verification of the connector interface in the specific application is recommended to confirm clearance and mating force compatibility.
Q: What is the difference between the Molex C-Grid 70280 series (0010897260, 0010897261, 0010897262) variants?
A: The three C-Grid 70280 variants differ in contact finish specifications. Part 0010897260 features gold-plated mating contacts with 30.0µin thickness. Part 0010897261 features tin-plated mating contacts with 150.0µin thickness. Part 0010897262 features gold-plated mating contacts with 15.0µin thickness, matching the original TE part finish thickness. All three variants maintain identical electrical and mechanical interface parameters. Selection depends on specific contact finish requirements for the application.
Q: How does the Amphenol BERGSTIK® series differ from the Molex C-Grid series?
A: The Amphenol BERGSTIK® series (10076801-101-26LF, 10076801-401A26LF) utilizes phosphor bronze contacts and thermoplastic insulation, matching the material composition of the original TE part more closely than the Molex alternatives. The Molex C-Grid series uses copper alloy contacts and liquid crystal polymer insulation. Both series maintain identical pitch, position count, and row spacing. The BERGSTIK® series offers operating temperature range specification (-65°C to 130°C) and current rating (3A per contact), which are not specified for the original TE part or Molex alternatives.
Q: What packaging options are available for these substitute parts?
A: Packaging varies by manufacturer and part number. Molex C-Grid series parts are supplied in bulk packaging. The Molex C-Grid 87914 series part (0879142616) is supplied in tray format. Amphenol BERGSTIK® series part 10076801-101-26LF is supplied in bag packaging, while 10076801-401A26LF is supplied in tape and reel format with pick-and-place features. Samtec TSW-113-08-F-D is supplied in bag packaging. Selection of packaging format depends on assembly process requirements and volume specifications.
Q: Are there compatibility considerations for the Samtec TSW-113-08-F-D substitute?
A: The Samtec TSW-113-08-F-D maintains identical pitch, position count, and row spacing as the original part. The contact post length is 0.200" (5.08mm) compared to 0.120" (3.05mm) for the original part, representing a 0.080" (2.03mm) difference. This longer post length may affect PCB design clearance, particularly in applications with limited board thickness or component density constraints. The TSW series features polybutylene terephthalate insulation and phosphor bronze contacts with gold plating (3.00µin thickness). Operating temperature range is -55°C to 125°C. PCB design verification is necessary to confirm mechanical compatibility before implementation.
Q: What is the significance of the RoHS compliance difference between the original part and substitutes?
A: The original TE Connectivity 1-103675-4 is RoHS non-compliant, indicating it may contain restricted substances such as lead in solder or plating materials. All listed substitute parts meet RoHS or ROHS3 compliance standards, which restrict the use of lead, cadmium, hexavalent chromium, and other hazardous substances. For applications subject to RoHS directives or customer requirements, substitute parts provide regulatory compliance. The Molex C-Grid series parts are ROHS3 compliant and REACH unaffected, offering the most favorable regulatory profile.
Q: Can the Molex 0702871109 (C-Grid 70287 series) be used as a substitute?
A: The Molex 0702871109 maintains identical pitch spacing, row configuration, and position count as the original part. The termination type differs: the 0702871109 features kinked pin solder termination, while the original part features standard solder termination. The contact post length is 0.125" (3.18mm) compared to 0.120" (3.05mm) for the original part. The overall contact length is 0.455" (11.56mm) compared to 0.440" (11.18mm). These dimensional variations may affect PCB design compatibility. The kinked pin termination provides enhanced mechanical retention in the PCB. This part is suitable for applications where kinked pin termination is acceptable or preferred.
Q: What inventory levels are available for these substitute parts?
A: Current inventory levels vary by part number. Molex 0879142616 has the highest inventory at 3245 units. Molex 0010897261 has 1260 units. Molex 0702871109 has 994 units. Amphenol 10076801-101-26LF has 1454 units. Samtec TSW-113-08-F-D has 1049 units. Amphenol 10076801-401A26LF has 1043 units. Amphenol 67997-726HLF has 717 units. Molex 0010897260 has 982 units. Inventory levels support both prototype and production volume requirements across all substitute options.
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