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Amphenol ICC 101-00581-59 microSD Card Connector: Equivalent & Substitute Parts
Part Overview
The Amphenol ICC 101-00581-59 is a 10-position (8 + 2) microSD card connector with push-push ejection mechanism, designed for surface mount right-angle applications. This part is classified as obsolete, making equivalent and substitute parts necessary for ongoing production and maintenance applications. The connector features gold-plated contacts and is RoHS compliant with MSL 1 rating, suitable for applications requiring secure digital card interfacing without moisture sensitivity constraints.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | 101-00581-59 |
| Manufacturer | Amphenol ICC (Commercial Products) |
| Category | Memory Connectors |
| Card Type | Secure Digital - microSD™ |
| Number of Positions | 10 (8 + 2) |
| Connector Type | Connector and Ejector |
| Insertion/Removal Method | Push In, Push Out |
| Mounting Type | Surface Mount, Right Angle |
| Height Above Board | 0.068" (1.73mm) |
| Contact Finish | Gold |
| Contact Finish Thickness | 20.0µin (0.51µm) |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution logic for the 101-00581-59 is determined by the following critical parameters:
Primary Substitution Criteria:
- Card Type: Secure Digital - microSD™ (mandatory match)
- Number of Positions: 10 (8 + 2) configuration (primary compatibility requirement)
- Connector Type: Connector and Ejector with Push In/Push Out mechanism
- Mounting Type: Surface Mount, Right Angle orientation
- Contact Finish: Gold plating
Secondary Compatibility Factors:
- Height Above Board: tolerance range 0.066" to 0.073" (1.68mm to 1.85mm)
- Contact Finish Thickness: 15.0µin to 30.0µin (0.38µm to 0.76µm)
- RoHS and MSL compliance status
Substitute parts are grouped into two categories:
Group A - Direct Equivalents (10-position, 8+2 configuration):
- 5025700893 (Molex 502570 series)
- 5027740891 (Molex 502774 series)
- DM3AT-SF-PEJM5(41) (Hirose DM3 series)
Group B - Functional Alternatives (9-position, 8+1 configuration):
- GTFP08431BEU (Amphenol ICC GTFP series)
- MEM2051-00-195-00-A (GCT MEM2051 series)
Group C - Reduced Position Alternative (8-position configuration):
- 2908-05WB-MG (3M 2900 series)
Parameter Comparison
| Parameter | 101-00581-59 | 5025700893 | 5027740891 | DM3AT-SF-PEJM5(41) | GTFP08431BEU | MEM2051-00-195-00-A | 2908-05WB-MG |
|---|---|---|---|---|---|---|---|
| Manufacturer | Amphenol ICC | Molex | Molex | Hirose | Amphenol ICC | GCT | 3M |
| Number of Positions | 10 (8+2) | 10 (8+2) | 10 (8+2) | 10 (8+2) | 9 (8+1) | 9 (8+1) | 8 |
| Card Type | microSD™ | microSD™ | microSD™ | microSD™ | microSD™ | microSD™ | microSD™ |
| Mounting Type | Surface Mount, Right Angle | Surface Mount, Right Angle | Surface Mount, Right Angle | Surface Mount, Right Angle | Surface Mount, Right Angle | Surface Mount, Right Angle | Surface Mount, Right Angle |
| Insertion/Removal | Push In, Push Out | Push In, Push Out | Push In, Push Out | Push In, Push Out | Not specified | Push In, Push Out | Push In, Push Out |
| Height Above Board | 0.068" (1.73mm) | 0.071" (1.80mm) | 0.071" (1.80mm) | 0.066" (1.68mm) | 0.073" (1.85mm) | 0.077" (1.95mm) | 0.073" (1.85mm) |
| Contact Finish | Gold | Gold | Gold | Gold | Gold | Gold | Gold |
| Contact Finish Thickness | 20.0µin (0.51µm) | 20.0µin (0.51µm) | 20.0µin (0.51µm) | Not specified | 30.0µin (0.76µm) | Flash | 15.0µin (0.38µm) |
| Mounting Feature | Normal, Standard - Top | Normal, Standard - Top | Reverse - Bottom | Normal, Standard - Top | Not specified | Normal, Standard - Top | Normal, Standard - Top |
| RoHS Status | RoHS Compliant | ROHS3 Compliant | ROHS3 Compliant | RoHS Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| MSL Rating | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| Product Status | Obsolete | Active | Active | Active | Active | Obsolete | Active |
Engineering Selection Recommendations
For Direct Pin-Compatible Replacement (10-position, 8+2 configuration):
The Molex 5025700893 (502570 series) and Molex 5027740891 (502774 series) are the primary active alternatives. Both maintain the 10-position configuration with identical contact finish thickness (20.0µin) matching the original part. The 5025700893 features standard top-side mounting, while the 5027740891 provides reverse bottom-side mounting for alternative PCB layout requirements. Both are ROHS3 compliant with active product status and high inventory availability.
The Hirose DM3AT-SF-PEJM5(41) provides a 10-position equivalent with the lowest height above board (0.066"), suitable for space-constrained applications. This part maintains RoHS compliance and active status.
For Reduced Position Configurations:
The Amphenol ICC GTFP08431BEU and GCT MEM2051-00-195-00-A both provide 9-position (8+1) alternatives. The GTFP08431BEU is active with higher contact finish thickness (30.0µin), while the MEM2051-00-195-00-A is obsolete. Selection between these depends on whether the additional contact position is functionally required.
The 3M 2908-05WB-MG provides an 8-position alternative for applications where reduced contact count is acceptable. This part is active with ROHS3 compliance.
Compliance Considerations:
All substitute parts maintain MSL 1 rating and RoHS compliance. Parts with ROHS3 status (Molex, 3M, GCT, Amphenol ICC GTFP series) represent current regulatory compliance. The Hirose DM3AT-SF-PEJM5(41) maintains RoHS Compliant status. Selection should prioritize active product status for long-term supply chain stability.
Frequently Asked Questions (FAQ)
Q: Can the 101-00581-59 be directly replaced with a 9-position connector?
A: The GTFP08431BEU and MEM2051-00-195-00-A provide 9-position (8+1) alternatives. Direct replacement is possible only if the application does not require the additional contact position provided by the 10-position configuration. Verify PCB layout and firmware compatibility before substitution.
Q: What is the difference between the Molex 5025700893 and 5027740891?
A: Both are 10-position Molex microSD connectors with identical electrical specifications and contact finish thickness. The primary difference is mounting feature: the 5025700893 uses standard top-side mounting, while the 5027740891 uses reverse bottom-side mounting. Selection depends on PCB layout orientation requirements.
Q: Is the Hirose DM3AT-SF-PEJM5(41) suitable for height-constrained applications?
A: Yes. The DM3AT-SF-PEJM5(41) has the lowest height above board (0.066" / 1.68mm) among the 10-position alternatives, making it suitable for applications with vertical space constraints. Verify PCB clearance requirements before selection.
Q: Why is the 3M 2908-05WB-MG listed as an alternative if it has only 8 positions?
A: The 2908-05WB-MG is included as a functional alternative for applications where the full 10-position contact count is not required. It maintains push-push ejection, surface mount right-angle mounting, and gold contact finish. Use only if the application firmware and PCB design support 8-position operation.
Q: Are all substitute parts RoHS compliant?
A: Yes. All listed substitute parts are either RoHS Compliant or ROHS3 Compliant. ROHS3 status indicates compliance with current regulatory requirements. The original 101-00581-59 and Hirose DM3AT-SF-PEJM5(41) are RoHS Compliant; all other substitutes are ROHS3 Compliant.
Q: What is the significance of contact finish thickness variation?
A: Contact finish thickness ranges from 15.0µin (3M 2908-05WB-MG) to 30.0µin (Amphenol ICC GTFP08431BEU). The original part specifies 20.0µin. Thicker finishes provide enhanced durability for high-cycle insertion applications; thinner finishes reduce material cost. Selection should align with application insertion cycle requirements and reliability specifications.
Q: Can the MEM2051-00-195-00-A be used despite its obsolete status?
A: The MEM2051-00-195-00-A is listed as obsolete. While current inventory is available (1026 pcs), future supply cannot be guaranteed. Use only if no active alternatives meet application requirements, and establish long-term supply chain contingency planning.
Q: What packaging options are available for these substitutes?
A: Molex parts (5025700893, 5027740891) and 3M 2908-05WB-MG are available in Cut Tape (CT) and Digi-Reel® packaging. Amphenol ICC GTFP08431BEU and Hirose DM3AT-SF-PEJM5(41) are available in Cut Tape (CT). GCT MEM2051-00-195-00-A is available in Cut Tape (CT) and Digi-Reel®. Verify packaging requirements for automated assembly processes.
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