Amphenol ICC 10076443-103 RDIMM DDR3 SDRAM Socket – Equivalent & Substitute Parts

Part Overview

The Amphenol ICC 10076443-103 is a 240-position RDIMM DDR3 SDRAM socket connector designed for through-hole PCB mounting. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, board redesigns, and inventory management. The connector accommodates registered DIMM memory modules with DDR3 SDRAM specifications and includes board guide and latch features for secure module retention.

Substiute Parts

10076443-103

Amphenol ICC (FCI)In Stock: 97310076443-103 Datasheet

Current PartRFQ

1932000-4

TE Connectivity AMP ConnectorsIn Stock: 7531932000-4 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the Amphenol ICC 10076443-103 is determined by the following critical parameters:

• Connector Style: RDIMM vs. DIMM compatibility
• Number of Positions: Must be 240 to maintain electrical and mechanical alignment
• Memory Type: DDR3 SDRAM specification
• Standards Compliance: MO-269 standard adherence
• Mounting Type: Through-hole PCB mounting requirement
• Card Thickness: 0.050" (1.27mm) module accommodation
• Contact Finish: Gold plating for signal integrity
• Mounting Feature: Normal, Standard - Top orientation

The identified substitute part (TE Connectivity AMP 1932000-4) shares 240-position capacity, DDR3 SDRAM memory type, MO-269 standards compliance, through-hole mounting, and identical card thickness specifications. However, the substitute uses DIMM connector style rather than RDIMM, which represents a functional difference in module registration capability.

Parameter Comparison

Engineering Selection Recommendations

The TE Connectivity AMP 1932000-4 provides functional equivalence for 240-position DDR3 SDRAM socket applications requiring through-hole PCB mounting with MO-269 standards compliance. The substitute part offers active product status and RoHS compliance, addressing obsolescence and regulatory requirements associated with the Amphenol ICC 10076443-103.

The primary distinction between the main part and substitute is the connector style designation: RDIMM versus DIMM. This difference reflects module registration architecture. Selection between these parts depends on whether the target application requires registered DIMM module support (RDIMM) or standard DIMM module support (DIMM). Both parts accommodate identical 240-position electrical interfaces, card thickness specifications, and through-hole mounting configurations.

Frequently Asked Questions (FAQ)

Q: Can the TE Connectivity AMP 1932000-4 directly replace the Amphenol ICC 10076443-103 in existing designs?

A: Direct replacement is possible only if the application does not require registered DIMM (RDIMM) module functionality. The TE Connectivity part supports standard DIMM modules. If the original design uses registered DIMM modules, the connector style difference must be evaluated against system memory controller specifications.

Q: What is the significance of the RDIMM versus DIMM connector style difference?

A: RDIMM (Registered DIMM) includes a register chip on the module that buffers control signals, while DIMM (Dual In-line Memory Module) does not. The connector style determines module compatibility. Verify memory module type requirements before substitution.

Q: Are the 240-position electrical interfaces identical between these parts?

A: Yes. Both parts maintain 240-position capacity, DDR3 SDRAM memory type, and MO-269 standards compliance, ensuring electrical interface compatibility for applications that do not require RDIMM-specific registration features.

Q: What is the impact of RoHS compliance differences?

A: The Amphenol ICC 10076443-103 is RoHS non-compliant, while the TE Connectivity AMP 1932000-4 is RoHS compliant. For applications subject to RoHS regulations or customer requirements, the TE Connectivity part provides regulatory alignment.

Q: Are the through-hole mounting configurations equivalent?

A: Yes. Both parts use through-hole PCB mounting with identical card thickness specifications (0.050" / 1.27mm) and normal, standard-top mounting features, ensuring mechanical compatibility in PCB layouts designed for either connector.