Amphenol ICC 10076443-101 RDIMM DDR3 SDRAM Socket — Equivalent & Substitute Parts

Part Overview

The Amphenol ICC 10076443-101 is a 240-position RDIMM DDR3 SDRAM socket connector designed for through-hole PCB mounting. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations. The connector features board guide and latch mechanisms, gold-plated contacts, and compliance with MO-269 standards for memory module interfaces.

Substiute Parts

10076443-101

Amphenol ICC (FCI)In Stock: 83510076443-101 Datasheet

Current PartRFQ

1-1932000-7

TE Connectivity AMP ConnectorsIn Stock: 8241-1932000-7 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the Amphenol ICC 10076443-101 is determined by the following critical parameters:

• Number of Positions: 240 positions (electrical interface requirement)
• Memory Type: DDR3 SDRAM (protocol and signal compatibility)
• Standards Compliance: MO-269 (mechanical and electrical interface standard)
• Mounting Type: Through Hole (PCB assembly method)
• Card Thickness: 0.050" (1.27mm) (mechanical fit requirement)
• Contact Finish: Gold (electrical performance and reliability)
• Mounting Feature: Normal, Standard - Top (board-level integration)

The identified substitute part TE Connectivity AMP Connectors 1-1932000-7 meets all critical substitution parameters. While the connector style differs (DIMM vs. RDIMM), both are 240-position DDR3 SDRAM sockets compliant with MO-269 standards, designed for through-hole mounting with identical card thickness and gold contact finish specifications.

Parameter Comparison

Engineering Selection Recommendations

The TE Connectivity AMP Connectors 1-1932000-7 is the identified equivalent substitute for the obsolete Amphenol ICC 10076443-101. Selection rationale is based on the following factors:

Product Status: The TE Connectivity part maintains active production status, ensuring availability and supply chain continuity compared to the obsolete Amphenol ICC component.

Standards Compliance: Both connectors conform to MO-269 standards for DDR3 SDRAM memory module interfaces, guaranteeing electrical and mechanical compatibility at the socket level.

Regulatory Compliance: The TE Connectivity substitute achieves ROHS3 compliance, addressing environmental and regulatory requirements that the non-compliant Amphenol ICC part does not meet.

Electrical and Mechanical Parameters: Identical specifications across 240 positions, DDR3 SDRAM memory type, through-hole mounting, 0.050" card thickness, and gold contact finish ensure functional equivalence in PCB assembly and system operation.

Connector Style Variation: The DIMM style of the TE Connectivity part differs from the RDIMM style of the original component. Both are 240-position DDR3 SDRAM sockets meeting MO-269 standards; however, physical form factor differences require verification of mechanical fit within the target application.

Frequently Asked Questions (FAQ)

Q: Can the TE Connectivity 1-1932000-7 directly replace the Amphenol ICC 10076443-101 in existing designs?

A: The TE Connectivity part meets all critical electrical and mechanical parameters: 240 positions, DDR3 SDRAM protocol, MO-269 standards compliance, through-hole mounting, and identical card thickness. However, the connector style differs (DIMM vs. RDIMM). Verification of mechanical fit and board layout compatibility is required before implementation.

Q: What is the significance of the connector style difference (RDIMM vs. DIMM)?

A: RDIMM (Registered DIMM) and DIMM (Dual In-line Memory Module) are both 240-position DDR3 SDRAM socket types compliant with MO-269 standards. The primary difference lies in physical form factor and module registration features. Both are suitable for DDR3 memory applications; however, the specific module type supported by each socket must align with system requirements.

Q: Does the TE Connectivity substitute offer improved compliance compared to the original part?

A: Yes. The TE Connectivity 1-1932000-7 achieves ROHS3 compliance, whereas the Amphenol ICC 10076443-101 is RoHS non-compliant. This represents an improvement in environmental and regulatory alignment for new designs and systems subject to RoHS requirements.

Q: Are the contact finish specifications equivalent between the two parts?

A: Both connectors feature gold contact finish. The Amphenol ICC part specifies flash thickness, while the TE Connectivity part specifies 15.0µin (0.38µm) thickness. Both gold finishes meet MO-269 standards for DDR3 SDRAM socket applications.

Q: What is the MSL rating for both connectors?

A: Both the Amphenol ICC 10076443-101 and TE Connectivity 1-1932000-7 carry an MSL rating of 1 (Unlimited), indicating no moisture sensitivity constraints for storage, handling, or assembly processes.