Equivalent & Substitute Parts for 09M1002JF

Part Overview

The 09M1002JF is an NTC thermistor manufactured by Vishay Dale, featuring a 10kΩ resistance at 25°C in a bead package configuration. This component is classified as not suitable for new designs, making identification of functionally equivalent alternatives essential for ongoing maintenance, repair, and legacy system support applications.

Substiute Parts

09M1002JF

Vishay DaleIn Stock: 71609M1002JF Datasheet

Current PartRFQ

ND03N00103J--

KYOCERA AVXIn Stock: 946ND03N00103J-- Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the 09M1002JF is determined by the following critical parameters:

• Resistance Value: 10kΩ at 25°C (primary electrical specification)
• Resistance Tolerance: ±5% (acceptable tolerance band)
• Package Configuration: Bead or disc form factor with compatible lead wire length
• Mounting Compatibility: Free hanging or through-hole mounting capability
• Environmental Compliance: RoHS status and operating temperature range

The ND03N00103J-- from KYOCERA AVX meets the core electrical requirements (10kΩ ±5%) and provides compatible physical dimensions and lead wire length. However, differences in package form factor (disc vs. bead), RoHS compliance status, and operating temperature range must be evaluated for specific application requirements.

Parameter Comparison

Engineering Selection Recommendations

The ND03N00103J-- serves as a functional substitute for the 09M1002JF based on matching resistance specifications and tolerance requirements. Selection between these components should account for the following factors:

RoHS Compliance Consideration: The 09M1002JF maintains RoHS3 compliance, while the ND03N00103J-- is RoHS non-compliant. Applications subject to RoHS regulatory requirements must retain the original 09M1002JF or identify alternative RoHS-compliant 10kΩ NTC thermistors.

Package Form Factor: The transition from bead to disc configuration requires mechanical redesign of mounting provisions. The disc package (3.5mm diameter × 3.0mm width) with through-hole mounting differs from the free-hanging bead configuration.

Lead Wire Length: Both components provide comparable lead wire lengths (36mm vs. 35mm), suitable for most circuit board layouts with minimal adjustment.

Product Status: The ND03N00103J-- maintains active product status, ensuring continued availability and supply chain stability compared to the legacy 09M1002JF designation.

Frequently Asked Questions (FAQ)

Q: Can the ND03N00103J-- directly replace the 09M1002JF without circuit modification?

A: Direct replacement is possible from an electrical standpoint, as both components share identical 10kΩ resistance and ±5% tolerance specifications. However, mechanical redesign is required due to package form factor differences (bead vs. disc) and mounting type changes (free hanging vs. through hole).

Q: What is the significance of the RoHS compliance difference?

A: The 09M1002JF is RoHS3 compliant, while the ND03N00103J-- is RoHS non-compliant. Applications requiring RoHS certification must use the original part or identify alternative RoHS-compliant 10kΩ NTC thermistors. This distinction is critical for products destined for regulated markets.

Q: Are the lead wire lengths compatible?

A: Yes. The 09M1002JF provides 36.00mm lead wire length, and the ND03N00103J-- provides 35.00mm. This 1mm difference is negligible for most circuit board layouts and does not affect electrical performance.

Q: What operating temperature range should be considered?

A: The 09M1002JF operating temperature range is not specified in available documentation. The ND03N00103J-- operates across -55°C to 150°C. Applications requiring operation outside this range should verify compatibility with the original 09M1002JF specifications or consult manufacturer datasheets.

Q: How does the disc package differ from the bead package?

A: The bead package (09M1002JF) is a spherical configuration suitable for free-hanging mounting in temperature sensing applications. The disc package (ND03N00103J--) is a flat cylindrical form factor (3.5mm diameter × 3.0mm width) designed for through-hole PCB mounting. Package selection depends on circuit board layout and mechanical mounting requirements.