Molex 0879140204 Equivalent & Substitute Parts

Part Overview

The Molex 0879140204 is an active rectangular connector header designed for through-hole mounting in board-to-board or cable applications. This 2-position, 2-row unshrouded header features male pins with gold-plated mating contacts and tin-plated posts, suitable for automotive, medical, telecommunications, and general-purpose applications. Finding equivalent substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and maintain compatibility across manufacturing batches and procurement cycles.

Substiute Parts

0879140204
MolexIn Stock: 7620879140204 Datasheet
0879140204
Current Part
67997-102HLF
Amphenol ICC (FCI)In Stock: 1747167997-102HLF Datasheet
67997-102HLF
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number 0879140204
Manufacturer Molex
Series C-Grid 87914
Category Rectangular Connectors
Connector Type Header, Breakaway
Number of Positions 2
Number of Rows 2
Row Spacing - Mating 0.100" (2.54mm)
Mounting Type Through Hole
Termination Solder
Contact Type Male Pin
Contact Finish - Mating Gold
Contact Finish - Post Tin
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Product Status Active

Substitute Part Grouping Explanation

Substitution eligibility for the Molex 0879140204 is determined by strict alignment of the following critical parameters:

Mandatory Matching Parameters:

  • Number of Positions: 2
  • Number of Rows: 2
  • Row Spacing - Mating: 0.100" (2.54mm)
  • Connector Type: Header
  • Contact Type: Male Pin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Fastening Type: Push-Pull
  • Contact Shape: Square
  • Shrouding: Unshrouded
  • Style: Board to Board or Cable
  • Material Flammability Rating: UL94 V-0
  • Moisture Sensitivity Level: 1 (Unlimited)

Allowable Variations:

  • Contact Length - Mating: Minor variations acceptable within mechanical envelope constraints
  • Contact Length - Post: Minor variations acceptable within PCB thickness tolerance
  • Overall Contact Length: Minor variations acceptable
  • Insulation Height: Minor variations acceptable
  • Contact Finish - Mating: Gold or equivalent noble metal plating acceptable
  • Contact Finish Thickness: Variations acceptable if meeting minimum durability requirements
  • Contact Material: Copper Alloy or Phosphor Bronze acceptable
  • Insulation Material: LCP or equivalent thermoplastic acceptable
  • Product Status: Active status required
  • RoHS Compliance: ROHS3 or RoHS Compliant acceptable

The substitute part Amphenol ICC (FCI) 67997-102HLF meets all mandatory matching parameters and allowable variation criteria.

Parameter Comparison

Parameter Molex 0879140204 Amphenol ICC (FCI) 67997-102HLF Compatibility
Manufacturer Part Number 0879140204 67997-102HLF Different manufacturers
Manufacturer Molex Amphenol ICC (FCI) Cross-manufacturer substitute
Series C-Grid 87914 BERGSTIK® II Different series
Category Rectangular Connectors Rectangular Connectors Match
Connector Type Header, Breakaway Header Compatible
Number of Positions 2 2 Match
Number of Rows 2 2 Match
Row Spacing - Mating 0.100" (2.54mm) 0.100" (2.54mm) Match
Mounting Type Through Hole Through Hole Match
Termination Solder Solder Match
Contact Type Male Pin Male Pin Match
Fastening Type Push-Pull Push-Pull Match
Contact Shape Square Square Match
Shrouding Unshrouded Unshrouded Match
Contact Length - Mating 0.240" (6.10mm) 0.230" (5.84mm) Compatible variation
Contact Length - Post 0.107" (2.71mm) 0.120" (3.05mm) Compatible variation
Overall Contact Length 0.437" (11.10mm) 0.450" (11.43mm) Compatible variation
Insulation Height 0.090" (2.29mm) 0.100" (2.54mm) Compatible variation
Contact Finish - Mating Gold Gold or Gold, GXT™ Compatible
Contact Finish Thickness - Mating 15.0µin (0.38µm) 30.0µin (0.76µm) Compatible variation
Contact Material Copper Alloy Phosphor Bronze Compatible variation
Material Flammability Rating UL94 V-0 UL94 V-0 Match
Insulation Color Black Black Match
Operating Temperature Not specified -65°C ~ 130°C Substitute provides specification
Current Rating (Amps) Not specified 3A Substitute provides specification
RoHS Status ROHS3 Compliant RoHS Compliant Compatible
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) Match
Product Status Active Active Match

Engineering Selection Recommendations

The Amphenol ICC (FCI) 67997-102HLF is a qualified substitute for the Molex 0879140204 based on the following engineering criteria:

Compliance and Certification Alignment: Both parts maintain UL94 V-0 material flammability rating and MSL 1 (Unlimited) moisture sensitivity level, ensuring equivalent environmental performance in automotive, medical, telecommunications, and general-purpose applications.

RoHS Compliance: The Molex part is ROHS3 Compliant, while the Amphenol ICC part is RoHS Compliant. Both meet regulatory requirements for hazardous substance restrictions.

Product Status: Both parts are Active, confirming ongoing manufacturer support and availability.

Mechanical and Electrical Compatibility: The substitute part maintains identical row spacing (0.100" / 2.54mm), position count (2 positions, 2 rows), and contact configuration (male pin, square shape, unshrouded). Minor dimensional variations in contact length and insulation height fall within acceptable mechanical envelope tolerances for through-hole PCB mounting and do not compromise functional interchangeability.

Contact Finish and Material: The substitute provides gold-plated mating contacts equivalent to the original specification. Phosphor Bronze contact material in the substitute offers equivalent or superior electrical and mechanical performance compared to Copper Alloy in the original part.

Supply Chain Advantage: The substitute part shows significantly higher inventory availability (17,439 pcs vs. 719 pcs), supporting procurement continuity and cost optimization.

Frequently Asked Questions (FAQ)

Q: Can the Amphenol ICC 67997-102HLF be used as a direct replacement for the Molex 0879140204 in existing designs?

A: Yes. Both parts share identical row spacing (0.100" / 2.54mm), position count (2 positions, 2 rows), mounting type (through-hole solder), and contact configuration (male pin, square, unshrouded). The minor dimensional variations in contact length and insulation height are within acceptable mechanical tolerances for PCB mounting and do not affect functional interchangeability.

Q: What are the key differences between these two parts?

A: The primary differences are manufacturer (Molex vs. Amphenol ICC), series designation (C-Grid 87914 vs. BERGSTIK® II), contact material (Copper Alloy vs. Phosphor Bronze), and contact finish thickness (15.0µin vs. 30.0µin). The substitute provides higher contact finish thickness and documented operating temperature range (-65°C ~ 130°C) and current rating (3A), which the original part does not specify.

Q: Are there packaging differences between these parts?

A: Yes. The Molex part is supplied in Tray packaging, while the Amphenol ICC substitute is supplied in Bag packaging. Procurement and assembly processes may require adjustment to accommodate different packaging formats.

Q: Do both parts meet the same regulatory and compliance standards?

A: Both parts are UL94 V-0 rated and MSL 1 (Unlimited). The Molex part is ROHS3 Compliant, and the Amphenol ICC part is RoHS Compliant. Both meet regulatory requirements for hazardous substance restrictions in their respective compliance frameworks.

Q: What is the inventory status of each part?

A: The Molex 0879140204 has 719 pcs in stock. The Amphenol ICC 67997-102HLF has 17,439 pcs in stock, providing significantly greater availability for supply chain continuity.

Q: Are there any operating temperature or current rating specifications for the Molex part?

A: The Molex 0879140204 does not provide operating temperature or current rating specifications in the available data. The Amphenol ICC substitute specifies -65°C ~ 130°C operating temperature and 3A current rating, which may be used as reference performance levels for the application.

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