Molex 0877597629 Equivalent & Substitute Parts

Part Overview

The Molex 0877597629 is a surface mount rectangular connector header in the Milli-Grid 87759 series, featuring 14 positions arranged in 2 rows with 0.079" (2.00mm) pitch. This connector is designed for board-to-board applications with push-pull fastening and is actively manufactured. Substitute parts are identified to provide alternative sourcing options when the primary part is unavailable or when design flexibility permits component selection from qualified manufacturers.

Substiute Parts

0877597629
MolexIn Stock: 9810877597629 Datasheet
0877597629
Current Part
57202-G52-07LF
Amphenol ICC (FCI)In Stock: 211557202-G52-07LF Datasheet
57202-G52-07LF
MFR Recommended
57202-S52-07LF
Amphenol ICC (FCI)In Stock: 106357202-S52-07LF Datasheet
57202-S52-07LF
MFR Recommended

Key Parameters

Parameter Value
Connector Type Header, Breakaway
Contact Type Male Pin
Pitch - Mating 0.079" (2.00mm)
Number of Positions 14
Number of Rows 2
Row Spacing - Mating 0.079" (2.00mm)
Mounting Type Surface Mount
Termination Solder
Fastening Type Push-Pull
Contact Finish - Mating Gold
Insulation Material Polyamide (PA), Nylon, Glass Filled
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the Molex 0877597629 is determined by the following critical parameters that must remain constant:

  • Pitch - Mating: 0.079" (2.00mm)
  • Number of Positions: 14
  • Number of Rows: 2
  • Row Spacing - Mating: 0.079" (2.00mm)
  • Mounting Type: Surface Mount
  • Contact Type: Male Pin
  • Termination: Solder
  • Fastening Type: Push-Pull
  • Shrouding: Unshrouded
  • Style: Board to Board
  • Number of Positions Loaded: All

The identified substitute parts are Amphenol ICC (FCI) components from the Minitek® 2.00mm series: 57202-G52-07LF and 57202-S52-07LF. Both parts maintain identical mating pitch, position count, row configuration, and mounting characteristics. Differences exist in contact length specifications and packaging format, which do not affect functional interchangeability in standard board-to-board applications.

Parameter Comparison

Parameter Molex 0877597629 Amphenol ICC 57202-G52-07LF Amphenol ICC 57202-S52-07LF
Manufacturer Molex Amphenol ICC (FCI) Amphenol ICC (FCI)
Series Milli-Grid 87759 Minitek® 2.00mm Minitek® 2.00mm
Connector Type Header, Breakaway Header Header
Contact Type Male Pin Male Pin Male Pin
Pitch - Mating 0.079" (2.00mm) 0.079" (2.00mm) 0.079" (2.00mm)
Number of Positions 14 14 14
Number of Rows 2 2 2
Row Spacing - Mating 0.079" (2.00mm) 0.079" (2.00mm) 0.079" (2.00mm)
Mounting Type Surface Mount Surface Mount Surface Mount
Termination Solder Solder Solder
Fastening Type Push-Pull Push-Pull Push-Pull
Contact Length - Mating 0.150" (3.81mm) 0.157" (4.00mm) 0.157" (4.00mm)
Contact Finish - Mating Gold Gold, GXT™ Gold, GXT™
Contact Finish Thickness - Mating 15.0µin (0.38µm) 30.0µin (0.76µm) 15.0µin (0.38µm)
Contact Material Phosphor Bronze Copper Alloy Copper Alloy
Insulation Material Polyamide (PA), Nylon, Glass Filled Thermoplastic Thermoplastic
Material Flammability Rating UL94 V-0 UL94 V-0 UL94 V-0
Insulation Color Black Black Black
Current Rating (Amps) Not specified 2A (AC/DC) 2A (AC/DC)
Voltage Rating Not specified 200V (AC/DC) 200V (AC/DC)
RoHS Status ROHS3 Compliant RoHS Compliant RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
Packaging Tape & Reel (TR) Bulk Box
Product Status Active Active Active

Engineering Selection Recommendations

All three connectors maintain active product status and comply with UL94 V-0 flammability requirements and RoHS standards. The Molex 0877597629 is ROHS3 compliant, while the Amphenol ICC substitutes are RoHS compliant. Both substitute parts are manufactured by the same parent company (Amphenol ICC/FCI) and share identical electrical ratings of 2A at 200V (AC/DC).

The primary difference between substitute options is packaging format: 57202-G52-07LF is supplied in bulk packaging, while 57202-S52-07LF is supplied in box packaging. Contact length specifications differ slightly (0.150" for Molex versus 0.157" for Amphenol ICC), and contact finish thickness varies between the two Amphenol ICC options. These variations do not affect functional compatibility in standard board-to-board connector applications.

Frequently Asked Questions (FAQ)

Q: Can 57202-G52-07LF and 57202-S52-07LF be used interchangeably with the Molex 0877597629?

A: Both Amphenol ICC parts maintain the same mating pitch (0.079"), position count (14), row configuration (2 rows), and mounting type (surface mount). They are functionally compatible for board-to-board applications. The primary differences are packaging format and minor contact specifications that do not affect standard interconnect performance.

Q: What is the difference between the two Amphenol ICC substitute parts?

A: The 57202-G52-07LF and 57202-S52-07LF differ in packaging (bulk versus box) and contact finish thickness on the mating surface (30.0µin versus 15.0µin). Both maintain identical pitch, position count, and electrical ratings. Selection between them depends on procurement volume requirements and packaging preferences.

Q: Are there any compliance differences between the main part and substitutes?

A: The Molex 0877597629 is ROHS3 compliant, while the Amphenol ICC substitutes are RoHS compliant. All three parts meet UL94 V-0 flammability requirements and have MSL rating of 1 (Unlimited). The Amphenol ICC parts carry REACH Affected status, whereas the Molex part is REACH Unaffected.

Q: What are the electrical specifications for these connectors?

A: The Amphenol ICC substitute parts are rated for 2A (AC/DC) at 200V (AC/DC). The Molex 0877597629 does not specify current and voltage ratings in the provided data.

Q: How do the contact materials differ?

A: The Molex 0877597629 uses Phosphor Bronze contacts, while the Amphenol ICC substitutes use Copper Alloy contacts. Both materials are suitable for gold-plated mating surfaces in standard board-to-board applications.

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