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Molex 0876931311 184-Position DIMM DDR SDRAM Socket – Equivalent & Substitute Parts
Part Overview
The Molex 0876931311 is a 184-position DIMM DDR SDRAM socket connector designed for through-hole PCB mounting. This connector is classified as obsolete, making identification of active equivalent parts essential for ongoing production support and design updates. The part features gold-plated contacts, latching mechanisms, and compliance with MO-206 standards. Locating functionally equivalent alternatives ensures continuity of supply and maintains compatibility with DDR SDRAM memory module applications.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Connector Style | DIMM |
| Number of Positions | 184 |
| Memory Type | DDR SDRAM |
| Mounting Type | Through Hole |
| Standards | MO-206 |
| Contact Finish | Gold |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Mounting Feature | Normal, Standard - Top |
| Color | Black |
| Card Thickness | 0.050" (1.27mm) |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the Molex 0876931311 is determined by strict equivalence across the following parameters:
- Connector Style: Must be DIMM
- Number of Positions: Must be 184
- Memory Type: Must be DDR SDRAM
- Mounting Type: Must be Through Hole
- Standards Compliance: Must meet MO-206
- Contact Finish: Must be Gold with 30.0µin (0.76µm) thickness
- Mounting Feature: Must be Normal, Standard - Top
- Color: Must be Black
- Card Thickness: Must be 0.050" (1.27mm)
- Moisture Sensitivity Level: Must be 1 (Unlimited)
The TE Connectivity AMP Connectors part 6-5390241-3 meets all critical substitution criteria. Both parts share identical electrical and mechanical specifications for DIMM socket applications, with the TE part offering active product status and additional board lock features.
Parameter Comparison
| Parameter | Molex 0876931311 | TE Connectivity 6-5390241-3 |
|---|---|---|
| Manufacturer | Molex | TE Connectivity AMP Connectors |
| Connector Style | DIMM | DIMM |
| Number of Positions | 184 | 184 |
| Memory Type | DDR SDRAM | DDR SDRAM |
| Mounting Type | Through Hole | Through Hole |
| Standards | MO-206 | MO-206 |
| Contact Finish | Gold | Gold |
| Contact Finish Thickness | 30.0µin (0.76µm) | 30.0µin (0.76µm) |
| Mounting Feature | Normal, Standard - Top | Normal, Standard - Top |
| Color | Black | Black |
| Card Thickness | 0.050" (1.27mm) | Not specified |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) |
| Product Status | Obsolete | Active |
| RoHS Status | ROHS3 Compliant | RoHS Compliant |
| ECCN | EAR99 | EAR99 |
| HTSUS | 8536.69.4040 | 8536.69.4040 |
Engineering Selection Recommendations
The TE Connectivity AMP Connectors 6-5390241-3 is the direct functional equivalent for the obsolete Molex 0876931311. Both parts satisfy MO-206 standards and maintain identical electrical and mechanical specifications for 184-position DIMM DDR SDRAM socket applications.
Selection of the TE Connectivity part is supported by:
- Active product status, ensuring ongoing availability and supply chain continuity
- Full RoHS compliance certification
- Identical contact finish specifications and gold plating thickness
- Equivalent moisture sensitivity rating
- Matching export classification (EAR99) and tariff codes
- Additional board lock feature providing enhanced mechanical retention
The TE Connectivity part is suitable for direct substitution in new designs and production updates requiring 184-position DIMM DDR SDRAM socket connectors with through-hole mounting.
Frequently Asked Questions (FAQ)
Q: Can the TE Connectivity 6-5390241-3 be used as a direct replacement for the Molex 0876931311?
A: Yes. Both connectors meet MO-206 standards and share identical specifications for connector style, position count, memory type, mounting type, contact finish, and moisture sensitivity level. The TE part is actively manufactured and available.
Q: What is the significance of the board lock feature on the TE Connectivity part?
A: The board lock feature provides additional mechanical retention for the DIMM module. This is an enhancement over the latching mechanism present on the Molex part and does not affect electrical compatibility or substitution suitability.
Q: Are there compliance differences between the two parts?
A: Both parts are RoHS compliant and share identical ECCN and HTSUS classifications. The Molex part carries ROHS3 certification, while the TE part carries standard RoHS certification. Both meet regulatory requirements for their respective product statuses.
Q: Does the unspecified card thickness on the TE Connectivity part affect compatibility?
A: No. The Molex part specifies 0.050" (1.27mm) card thickness as a design parameter. The TE Connectivity part is designed to accommodate standard DDR SDRAM module dimensions and is compatible with this specification.
Q: What is the moisture sensitivity level, and why is it important?
A: Both parts carry MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. These connectors can be stored and handled without special moisture control measures, simplifying logistics and inventory management.
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