Molex 0876362002 184-Position DIMM DDR SDRAM Socket – Equivalent & Substitute Parts

Part Overview

The Molex 0876362002 is a 184-position DIMM DDR SDRAM socket connector designed for through-hole PCB mounting. This connector features board lock and latches, with gold-plated contacts rated at 15.0µin (0.38µm) thickness. The part is classified as obsolete, making equivalent substitutes from active manufacturers necessary for new designs and ongoing production support.

Substiute Parts

0876362002
MolexIn Stock: 8880876362002 Datasheet
0876362002
Current Part
52515-21002
Amphenol ICC (FCI)In Stock: 107552515-21002 Datasheet
52515-21002
MFR Recommended
52515-21003
Amphenol ICC (FCI)In Stock: 93952515-21003 Datasheet
52515-21003
MFR Recommended
52515-21004
Amphenol ICC (FCI)In Stock: 87552515-21004 Datasheet
52515-21004
MFR Recommended
52515-21102
Amphenol ICC (FCI)In Stock: 86752515-21102 Datasheet
52515-21102
MFR Recommended
52515-21104
Amphenol ICC (FCI)In Stock: 89552515-21104 Datasheet
52515-21104
MFR Recommended

Key Parameters

Parameter Value
Connector Style DIMM
Number of Positions 184
Memory Type DDR SDRAM
Mounting Type Through Hole
Features Board Lock, Latches
Contact Finish Gold
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the Molex 0876362002 is determined by strict adherence to the following parameters:

  • Connector Style: Must be DIMM
  • Number of Positions: Must be 184
  • Memory Type: Must be DDR SDRAM
  • Mounting Type: Must be Through Hole
  • Features: Must include Board Lock and Latches
  • Contact Finish: Must be Gold
  • Moisture Sensitivity Level: Must be 1 (Unlimited)

All five substitute parts from Amphenol ICC (FCI) meet these core electrical and mechanical requirements. Variations in contact finish thickness (15.0µin, 30.0µin, or Flash) do not disqualify substitution, as these represent different plating specifications within the gold contact finish category. RoHS compliance status differs between the main part (ROHS3 Compliant) and substitutes (RoHS non-compliant), which must be evaluated based on application requirements.

Parameter Comparison

Parameter Molex 0876362002 Amphenol ICC 52515-21002 Amphenol ICC 52515-21003 Amphenol ICC 52515-21004 Amphenol ICC 52515-21102 Amphenol ICC 52515-21104
Manufacturer Molex Amphenol ICC (FCI) Amphenol ICC (FCI) Amphenol ICC (FCI) Amphenol ICC (FCI) Amphenol ICC (FCI)
Connector Style DIMM DIMM DIMM DIMM DIMM DIMM
Number of Positions 184 184 184 184 184 184
Memory Type DDR SDRAM DDR SDRAM DDR SDRAM DDR SDRAM DDR SDRAM DDR SDRAM
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole Through Hole
Features Board Lock, Latches Board Lock, Latches Board Lock, Latches Board Lock, Latches Board Lock, Latches Board Lock, Latches
Contact Finish Gold Gold Gold Gold Gold Gold
Contact Finish Thickness 15.0µin (0.38µm) 15.0µin (0.38µm) 30.0µin (0.76µm) Flash 15.0µin (0.38µm) Flash
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
Product Status Obsolete Active Active Active Active Active
RoHS Status ROHS3 Compliant RoHS non-compliant RoHS non-compliant RoHS non-compliant RoHS non-compliant RoHS non-compliant

Engineering Selection Recommendations

All five Amphenol ICC (FCI) substitute parts satisfy the core electrical and mechanical requirements for direct substitution with the Molex 0876362002. Selection among these alternatives should be based on the following factors:

Product Status: The Molex 0876362002 is obsolete. All substitute parts are active products with confirmed inventory availability, ensuring long-term supply chain continuity.

RoHS Compliance: The main part is ROHS3 compliant, while all substitutes are RoHS non-compliant. Applications subject to RoHS regulations must account for this compliance difference during design validation.

Contact Finish Thickness: Three variants are available—15.0µin (0.38µm) in parts 52515-21002 and 52515-21102, 30.0µin (0.76µm) in part 52515-21003, and Flash plating in parts 52515-21004 and 52515-21104. Contact finish thickness selection depends on application-specific wear and corrosion requirements.

Inventory Availability: All substitutes maintain active stock levels ranging from 799 to 1040 pieces, supporting both prototype and production quantities.

Frequently Asked Questions (FAQ)

Q: Can the Amphenol ICC 52515 series parts directly replace the Molex 0876362002?

A: Yes. All five Amphenol ICC (FCI) substitute parts meet the core substitution criteria: 184-position DIMM connector, DDR SDRAM memory type, through-hole mounting, board lock and latches, gold contact finish, and MSL 1 rating. Electrical and mechanical compatibility is established.

Q: What is the difference between the five substitute part numbers?

A: The five Amphenol ICC parts differ only in contact finish thickness specification. Parts 52515-21002 and 52515-21102 feature 15.0µin (0.38µm) gold plating, part 52515-21003 features 30.0µin (0.76µm) gold plating, and parts 52515-21004 and 52515-21104 feature Flash gold plating. All other electrical and mechanical parameters are identical.

Q: Does the RoHS non-compliance of substitute parts affect substitution eligibility?

A: RoHS compliance status is a regulatory and application-specific consideration, not an electrical or mechanical compatibility factor. Applications operating under RoHS restrictions must evaluate compliance requirements independently. For applications without RoHS mandates, RoHS non-compliant substitutes are electrically and mechanically equivalent.

Q: Are there any insertion angle or mounting feature differences between the main part and substitutes?

A: No. Both the main part and all substitutes are specified for standard top mounting with through-hole insertion. Insertion angle and mounting feature parameters are not differentiated across these parts.

Q: What packaging format are the substitute parts supplied in?

A: All five Amphenol ICC substitute parts are supplied in bulk packaging, suitable for production assembly and component procurement workflows.

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