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Molex 0761601010 Equivalent & Substitute Parts
Part Overview
The Molex 0761601010 is a 120-position backplane connector receptacle designed for board edge, through-hole mounting applications. This Impact series connector features female sockets with right-angle orientation and press-fit termination, suitable for high-density interconnect applications requiring 40 differential pairs. The part maintains Active product status with 1037 units in current inventory. Substitute parts are identified when equivalent electrical and mechanical parameters align with application requirements, particularly when connector position count, pitch, mounting style, and termination method remain compatible within specified operating ranges.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | 0761601010 |
| Manufacturer | Molex |
| Category | Backplane Connectors |
| Connector Type | Receptacle, Female Sockets |
| Number of Positions | 120 |
| Pitch | 0.053" (1.35mm) |
| Mounting Type | Board Edge, Through Hole, Right Angle |
| Termination | Press-Fit |
| Contact Finish | Gold, 30.0µin (0.76µm) |
| Operating Temperature | -55°C ~ 85°C |
| Voltage Rating | 30V |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
| Product Status | Active |
Substitute Part Grouping Explanation
Substitute part identification for the Molex 0761601010 is based on the following critical parameters that determine functional compatibility:
Position Count & Pitch Relationship: The main part operates at 120 positions with 0.053" (1.35mm) pitch. Substitute parts must maintain board edge, through-hole, right-angle mounting with press-fit termination to ensure mechanical and electrical compatibility within the same application envelope.
Electrical Specifications: Operating temperature range, voltage rating, and contact finish specifications must support the intended circuit environment. Gold plating thickness and flammability ratings ensure reliability and safety compliance.
Connector Style & Series: The Impact series designation and receptacle configuration with female sockets define the connector family. Substitutes from equivalent high-density backplane connector families with comparable electrical performance are evaluated.
Compliance & Certification: RoHS3 compliance, UL94 V-0 flammability rating, and REACH status ensure regulatory alignment across substitute options.
Parameter Comparison
| Parameter | Molex 0761601010 | TE Connectivity 1934224-1 |
|---|---|---|
| Manufacturer | Molex | TE Connectivity AMP Connectors |
| Category | Backplane Connectors | Backplane Connectors |
| Connector Type | Receptacle, Female Sockets | Receptacle, Female Sockets |
| Number of Positions | 120 | 80 |
| Pitch | 0.053" (1.35mm) | 0.075" (1.90mm) |
| Mounting Type | Board Edge, Through Hole, Right Angle | Board Edge, Through Hole, Right Angle |
| Termination | Press-Fit | Press-Fit |
| Contact Finish | Gold, 30.0µin (0.76µm) | Gold, 30.0µin (0.76µm) |
| Operating Temperature | -55°C ~ 85°C | -65°C ~ 90°C |
| Voltage Rating | 30V | 250V |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Product Status | Active | Active |
Engineering Selection Recommendations
Primary Part (Molex 0761601010): Recommended for applications requiring 120-position density at 0.053" pitch with 30V operating voltage. Active product status ensures ongoing availability and supply chain stability. ROHS3 compliance and UL94 V-0 rating meet current regulatory requirements.
Substitute Part (TE Connectivity 1934224-1): The Z-PACK TinMan series connector provides an alternative for applications where 80-position density at 0.075" pitch is acceptable. This substitute offers extended operating temperature range (-65°C ~ 90°C) and higher voltage rating (250V), making it suitable for more demanding thermal and electrical environments. Both parts share identical mounting methodology (board edge, through-hole, right-angle, press-fit) and contact finish specifications, ensuring mechanical interchangeability within compatible PCB designs.
Selection between these parts depends on specific position count requirements and voltage/temperature operating envelope. Both maintain Active product status and full regulatory compliance.
Frequently Asked Questions (FAQ)
Q: Can the TE Connectivity 1934224-1 directly replace the Molex 0761601010 in existing designs?
A: Direct replacement requires PCB redesign. The TE part operates at 80 positions with 0.075" pitch versus the Molex part's 120 positions at 0.053" pitch. While both use board edge, through-hole, right-angle, press-fit mounting, the different position counts and pitch specifications necessitate layout modifications.
Q: What are the key compatibility factors between these backplane connectors?
A: Compatibility is determined by mounting type (board edge, through-hole, right-angle), termination method (press-fit), contact finish (gold plating), and flammability rating (UL94 V-0). Both parts meet these criteria. Position count and pitch are application-specific parameters that must align with PCB design requirements.
Q: Are both parts RoHS3 compliant?
A: Yes. Both the Molex 0761601010 and TE Connectivity 1934224-1 maintain ROHS3 compliance and are REACH unaffected, meeting current regulatory requirements for electronic component manufacturing and distribution.
Q: What is the difference in operating temperature ranges?
A: The Molex part operates from -55°C to 85°C, while the TE part extends to -65°C to 90°C. The TE substitute provides wider temperature coverage, suitable for applications requiring enhanced thermal performance.
Q: How do voltage ratings differ between these parts?
A: The Molex 0761601010 is rated for 30V operation, while the TE Connectivity 1934224-1 supports 250V. Selection depends on circuit voltage requirements; the TE part accommodates higher-voltage applications.
Q: What packaging formats are available?
A: The Molex 0761601010 is supplied in Tray packaging, while the TE Connectivity 1934224-1 is supplied in Tube packaging. Packaging selection may affect handling, storage, and integration into assembly workflows.
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