Molex 0711095005 Card Edge Connector - Equivalent & Substitute Parts

Part Overview

The Molex 0711095005 is a 330-position female card edge connector from the HiSpec 71109 series, designed for dual-edge applications with 0.030" (0.76mm) pitch spacing. This connector features gold-plated phosphor bronze contacts, through-hole solder termination, and board lock mounting. The product is currently obsolete, making identification of compatible substitute components essential for legacy system maintenance and board redesigns.

Substiute Parts

0711095005
MolexIn Stock: 12470711095005 Datasheet
0711095005
Current Part
10058831-110LF
Amphenol ICC (FCI)In Stock: 178710058831-110LF Datasheet
10058831-110LF
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number 0711095005
Manufacturer Molex
Category Card Edge Connectors
Number of Positions 330
Gender Female
Pitch 0.030" (0.76mm)
Number of Rows 2
Card Thickness 0.062" (1.57mm)
Contact Material Phosphor Bronze
Contact Finish Gold (30.0µin / 0.76µm)
Mounting Type Through Hole
Termination Solder
Operating Temperature -40°C ~ 85°C
Material - Insulation Liquid Crystal Polymer (LCP), Glass Filled
RoHS Status ROHS3 Compliant
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the Molex 0711095005 is determined by the following critical parameters:

  • Number of Positions: 330 positions required for functional equivalence
  • Pitch Specification: 0.030" (0.76mm) nominal spacing
  • Number of Rows: Dual-row (2-row) configuration
  • Card Thickness: 0.062" (1.57mm) mechanical compatibility
  • Gender: Female connector orientation
  • Contact Finish: Gold plating for signal integrity and corrosion resistance
  • Operating Temperature Range: -40°C ~ 85°C minimum requirement
  • Mounting Type: Through-hole solder termination for PCB integration

The substitute part 10058831-110LF from Amphenol ICC (FCI) shares compatible mechanical and electrical parameters within acceptable tolerances for card edge connector applications, though with variations in position count, pitch tolerance, and termination method.

Parameter Comparison

Parameter Molex 0711095005 Amphenol ICC 10058831-110LF Compatibility Notes
Number of Positions 330 170 Reduced position count; application-dependent compatibility
Pitch 0.030" (0.76mm) 0.029" (0.75mm) Nominal pitch variance within 0.001" tolerance
Number of Rows 2 2 Identical dual-row configuration
Card Thickness 0.062" (1.57mm) 0.062" (1.57mm) Identical mechanical specification
Gender Female Female Identical orientation
Contact Finish Gold (30.0µin) Gold (30.0µin) Identical finish specification
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C Identical temperature range
Mounting Type Through Hole Through Hole Identical mounting method
Termination Solder Press-Fit Different termination technology
Contact Material Phosphor Bronze Copper Alloy Different base material composition
Insulation Material LCP, Glass Filled Polyamide (PA), Nylon Different polymer system
Product Status Obsolete Active Substitute is currently manufactured
RoHS Status ROHS3 Compliant RoHS Compliant Both meet RoHS requirements

Engineering Selection Recommendations

The Amphenol ICC 10058831-110LF represents an active-production alternative to the obsolete Molex 0711095005. Selection criteria are based on the following factors:

Product Status: The Molex part is obsolete with no ongoing manufacturing. The Amphenol ICC substitute is active-production with documented inventory availability (1770 pcs).

Compliance: Both parts meet RoHS requirements and REACH compliance. Both operate within the -40°C ~ 85°C temperature range and maintain identical gold contact finish specifications (30.0µin).

Mechanical Compatibility: Card thickness (0.062"), dual-row configuration, and through-hole mounting are identical. Pitch tolerance variance (0.030" vs. 0.029") is within standard connector manufacturing tolerances.

Critical Differences: The substitute features press-fit termination versus solder termination, copper alloy contacts versus phosphor bronze, and polyamide insulation versus LCP. These differences require PCB design and assembly process evaluation for specific applications.

Position Count Variance: The substitute provides 170 positions versus 330 positions in the original. Applications requiring the full 330-position capacity cannot use this substitute without redesign.

Frequently Asked Questions (FAQ)

Q: Can the Amphenol ICC 10058831-110LF directly replace the Molex 0711095005 in existing designs?

A: Direct replacement is not possible due to position count reduction (170 vs. 330 positions) and termination method change (press-fit vs. solder). PCB layout and assembly process modifications are required.

Q: What is the significance of the pitch difference (0.030" vs. 0.029")?

A: The 0.001" variance falls within standard card edge connector manufacturing tolerances. Both pitches are compatible with standard 0.030" nominal spacing applications, though mechanical fit should be verified for specific card edge designs.

Q: Are the contact materials interchangeable from a signal integrity perspective?

A: Both phosphor bronze and copper alloy contacts with gold plating provide equivalent electrical performance for standard card edge applications. Contact material selection depends on specific current-carrying requirements and environmental exposure.

Q: What assembly considerations apply to the press-fit termination of the substitute?

A: Press-fit termination requires different tooling and assembly procedures than solder termination. Hole sizing, insertion force, and PCB material specifications must be verified against Amphenol ICC documentation for the 10058831-110LF.

Q: Are both parts suitable for the same operating temperature range?

A: Yes. Both parts operate across -40°C ~ 85°C. Insulation material differences (LCP vs. polyamide) do not affect this temperature specification.

Q: What packaging differences exist between these parts?

A: The Molex 0711095005 packaging is not specified in available documentation. The Amphenol ICC 10058831-110LF is supplied in tray packaging. Packaging format may affect handling, storage, and assembly logistics.

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