Molex 0711092006 Card Edge Connector - Equivalent & Substitute Parts

Part Overview

The Molex 0711092006 is a 330-position female card edge connector from the HiSpec 71109 series, designed for dual-edge applications with 0.030" (0.76mm) pitch spacing. This connector features gold-plated phosphor bronze contacts, through-hole solder termination, and operates across -40°C to 85°C. The product is classified as obsolete, making identification of compatible substitute components essential for ongoing system support and new design implementations.

Substiute Parts

0711092006

MolexIn Stock: 8290711092006 Datasheet

Current PartRFQ

10058831-110LF

Amphenol ICC (FCI)In Stock: 178710058831-110LF Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the Molex 0711092006 is determined by the following critical parameters:

Mechanical Compatibility:

• Female gender connector
• Dual-row configuration
• Through-hole mounting
• Card thickness tolerance of 0.062" (1.57mm)
• Board guide feature

Electrical Compatibility:

• Gold contact finish with equivalent thickness (30.0µin minimum)
• Operating temperature range of -40°C to 85°C minimum
• Solder or press-fit termination acceptable for through-hole applications

Position and Pitch Considerations: The substitute part (Amphenol ICC 10058831-110LF) operates at 0.029" (0.75mm) pitch with 170 positions across 2 rows. This represents a reduced position count and marginally tighter pitch spacing compared to the original 330-position, 0.030" pitch design. Substitution is valid where the application can accommodate the reduced contact density and pitch tolerance variance of ±0.001" (0.025mm).

Parameter Comparison

Engineering Selection Recommendations

The Amphenol ICC 10058831-110LF (MicroTCA™ series) is identified as a functional substitute for the obsolete Molex 0711092006 based on the following criteria:

Compliance and Availability: The substitute part maintains active product status with current manufacturing support, ensuring long-term availability and supply chain continuity. Both the original and substitute parts are RoHS compliant and REACH unaffected, meeting regulatory requirements for industrial and commercial applications.

Mechanical and Electrical Equivalence: Both connectors share identical card thickness (0.062"), operating temperature range (-40°C to 85°C), dual-row configuration, through-hole mounting, and gold contact finish specifications. The pitch variance of 0.001" (0.025mm) and reduced position count (170 vs. 330) represent the primary design trade-offs in substitution.

Application-Specific Considerations: Selection of the substitute requires verification that the application can function with 170 contact positions instead of 330, and that the tighter 0.029" pitch spacing is compatible with existing card edge designs. The press-fit termination method of the substitute offers alternative assembly advantages compared to the original solder termination.

Frequently Asked Questions (FAQ)

Q: Can the Amphenol ICC 10058831-110LF directly replace the Molex 0711092006 in existing designs?

A: Direct mechanical replacement is possible due to matched card thickness (0.062"), dual-row configuration, and identical operating temperature range. However, the reduced position count (170 vs. 330) and tighter pitch (0.029" vs. 0.030") require verification that the application does not depend on the full 330-position capacity or the original pitch specification.

Q: What is the pitch tolerance difference between these connectors?

A: The Molex 0711092006 operates at 0.030" (0.76mm) pitch, while the Amphenol ICC substitute operates at 0.029" (0.75mm) pitch. This represents a 0.001" (0.025mm) tighter spacing. Card edge designs must accommodate this variance to ensure proper contact engagement.

Q: Are the contact materials interchangeable?

A: The original uses phosphor bronze contacts while the substitute uses copper alloy contacts. Both materials provide equivalent electrical conductivity and corrosion resistance when finished with gold plating at 30.0µin thickness. The contact material difference does not affect electrical performance in standard applications.

Q: What is the difference between solder and press-fit termination?

A: The Molex 0711092006 uses solder termination, requiring wave or reflow soldering during PCB assembly. The Amphenol ICC substitute uses press-fit termination, which compresses contacts into plated through-holes without solder. Press-fit termination offers improved reliability in high-vibration environments and eliminates solder joint fatigue concerns.

Q: Does the insulation material change affect performance?

A: The original uses liquid crystal polymer (LCP) with glass fill, while the substitute uses polyamide (PA) nylon. Both materials are rated for the -40°C to 85°C operating temperature range and provide equivalent electrical insulation properties. The material change does not impact functional performance within specified operating conditions.

Q: Is the substitute part currently available?

A: Yes. The Amphenol ICC 10058831-110LF maintains active product status with 1770 pieces in stock as new original inventory, ensuring immediate availability compared to the obsolete Molex part.