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GL513F
Sharp Microelectronics
EMITTER IR 950NM 150MA TO-18
3355 Pcs New Original In Stock
Infrared (IR) Emitter 950nm 1.35V 150mA 100° TO-18-2 Metal Can
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5.0 / 5.0
- (366 Ratings)
GL513F
Product Overview
7927713
DiGi Electronics Part Number
GL513F-DGManufacturer
Sharp Microelectronics
GL513F
Description
EMITTER IR 950NM 150MA TO-18Inventory
3355 Pcs New Original In Stock
Infrared (IR) Emitter 950nm 1.35V 150mA 100° TO-18-2 Metal Can
Quantity
Minimum 1
Minimum 1
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GL513F Technical Specifications
Category
LED Emitters - Infrared, UV, Visible
Packaging
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Series
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Datasheet & Documents
Datasheets
Download GL513F Product Specification (PDF)
HTML Datasheet
GL513F-DG
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Reviews
5.0/5.0-(Show up to 5 Ratings)
December 02, 2025
구매 과정이 간편하고 가격도 적당해서 계속 이용하게 될 것 같아요.
December 02, 2025
他們的出貨速度超乎我的預期，總是準時送達，無拖延情況發生。
December 02, 2025
Je suis très satisfait de la rapidité d'envoi et de l'emballage sécurisé. Tout est arrivé en bon état.
December 02, 2025
Their customer care team is friendly and always ready to help.
December 02, 2025
The customer service representatives were patient and helpful, guiding me through the ordering process.
December 02, 2025
Their delivery service is very reliable—I received my order right on time.
December 02, 2025
Quick delivery and responsive support make this a highly reliable shopping platform.
December 02, 2025
I've had great experiences with their post-purchase support and product consistency.
December 02, 2025
The staff always ensures a pleasant shopping experience.
December 02, 2025
DiGi Electronics continually emphasizes quality control in their production process.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing a TSTA7500 with the GL513F in an existing IR transmission circuit?
When replacing the TSTA7500 with the GL513F, the primary design risks involve differences in forward voltage (Vf) and beam dispersion characteristics. The GL513F has a typical Vf of 1.35V at 150mA, which is slightly higher than the TSTA7500’s ~1.2V, potentially affecting current regulation in constant-voltage-driven designs. Additionally, the GL513F’s 100° emission angle is narrower than the TSTA7500’s 120°, which may reduce coverage in wide-angle sensing applications. Always verify drive circuit compatibility and perform optical alignment checks when substituting. Use a series resistor to regulate current precisely and test in worst-case ambient conditions to ensure reliability.
How does the TO-18 metal can package of the GL513F impact thermal management in high-duty-cycle IR applications?
The TO-18 metal can package of the GL513F offers good thermal stability but has limited heat dissipation compared to surface-mount or larger packages. In high-duty-cycle applications (e.g., >50% duty at 150mA), the junction temperature can rise significantly without adequate external heat sinking. Designers should limit continuous forward current or implement pulse-width modulation (PWM) with sufficient off-time to maintain junction temperature below 100°C. Mounting near PCB copper pours or using thermal vias can help, but note that the TO-18 case is not electrically and thermally conductive by default—mechanical mounting may be needed for thermal transfer.
What are the optical alignment challenges when integrating the GL513F into a through-hole IR transceiver module, and how can they be mitigated?
The GL513F’s 100° viewing angle and axial lead configuration in the TO-18 package make precise optical alignment critical in transceiver modules. Misalignment can result in reduced signal strength or crosstalk in proximity sensing or data transmission. To mitigate, use tight-tolerance mounting fixtures or molded housings with alignment sleeves during assembly. Ensure the emitter is perpendicular to the receiver plane and consider using IR-transparent optical filters or apertures to minimize ambient light interference. Prototyping with adjustable holders helps fine-tune alignment before mass production.
Can the GL513F be safely driven with a constant 150mA current in battery-powered IoT devices, and what are the trade-offs?
The GL513F is rated for 150mA DC forward current, but continuously driving it at this level in battery-powered IoT devices reduces battery life and increases thermal stress. For better efficiency, operate the GL513F in pulsed mode (e.g., 100mA peak, 20% duty cycle) to maintain sufficient IR output while minimizing average power. This extends battery life and reduces self-heating. Ensure the driving circuit (e.g., GPIO-driven transistor or dedicated LED driver) can handle inrush current and that PWM frequency exceeds 20kHz to prevent audible noise. Monitor forward voltage drift over temperature to avoid overdriving in low-temperature environments.
What reliability concerns should be considered when using the GL513F in outdoor or high-humidity environments?
The GL513F’s TO-18 metal can provides good mechanical robustness but is not inherently sealed against moisture ingress over time, especially at the epoxy lens seal. In outdoor or high-humidity environments, prolonged exposure can lead to corrosion of internal bond wires or reduced optical output due to lens fogging. To enhance reliability, encapsulate the base or use conformal coating (e.g., silicone or parylene) on the PCB around the leads. Avoid thermal cycling extremes, as CTE mismatches can compromise long-term hermeticity. Design in a margin for optical output degradation—operate at 80% of max current to extend lifetime under harsh conditions.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
GL513F CAD Models
Sharp Microelectronics GL513F PCB symbols & footprints
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