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2N708
Microchip Technology
TRANS NPN 15V TO18
727 Pcs New Original In Stock
Bipolar (BJT) Transistor NPN 15 V 360 mW Through Hole TO-18 (TO-206AA)
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5.0 / 5.0
- (296 Ratings)
2N708
Product Overview
13263942
DiGi Electronics Part Number
2N708-DGManufacturer
Microchip Technology
2N708
Description
TRANS NPN 15V TO18Inventory
727 Pcs New Original In Stock
Bipolar (BJT) Transistor NPN 15 V 360 mW Through Hole TO-18 (TO-206AA)
Quantity
Minimum 1
Minimum 1
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2N708 Technical Specifications
Category
Transistors, Bipolar (BJT), Single Bipolar Transistors
Packaging
-
Series
-
Product Status
Active
Transistor Type
NPN
Voltage - Collector Emitter Breakdown (Max)
15 V
Vce Saturation (Max) @ Ib, Ic
400mV @ 1mA, 10mA
Current - Collector Cutoff (Max)
25nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce
30 @ 10mA, 1V
Power - Max
360 mW
Frequency - Transition
-
Operating Temperature
-65°C ~ 200°C (TA)
Mounting Type
Through Hole
Package / Case
TO-206AA, TO-18-3 Metal Can
Supplier Device Package
TO-18 (TO-206AA)
Datasheet & Documents
Datasheets
Download 2N708 Product Specification (PDF)
HTML Datasheet
2N708-DG
Environmental & Export Classification
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8541.21.0095
Additional Information
Other Names
2N708MS
Standard Package
1
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Reviews
5.0/5.0-(Show up to 5 Ratings)
December 02, 2025
접속이 안정적이고 장애 없이 이용할 수 있어서 만족스러웠어요.
December 02, 2025
Les pages chargent rapidement, même lors des pics de trafic, ce qui est impressionnant.
December 02, 2025
Consistent product quality gives me peace of mind every time.
December 02, 2025
I am consistently amazed by how quickly DiGi Electronics gets my orders shipped out, even during peak times.
December 02, 2025
The friendly support staff made the entire process easy and enjoyable.
December 02, 2025
The team’s dedication to after-sales service enhances overall customer loyalty.
December 02, 2025
Their reliable products combined with excellent customer service have strengthened our partnership.
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Frequently Asked Questions (FAQ)
What are the key reliability risks when using the 2N708 transistor in high-temperature industrial environments above 125°C, and how can they be mitigated?
The 2N708 has a maximum junction temperature of 200°C, but prolonged operation near this limit—especially above 125°C—can accelerate thermal runaway and degradation due to increased leakage currents and reduced hFE stability. In industrial applications, this may lead to premature failure or drift in switching performance. To mitigate risk, ensure adequate heatsinking, maintain airflow, and derate power dissipation by at least 50% above 100°C ambient. Consider monitoring base drive current and using negative temperature coefficient (NTC) biasing techniques to stabilize gain. For mission-critical designs, evaluate higher-reliability alternatives like the 2N2222A in TO-18 or hermetically sealed versions if available.
Can the 2N708 be safely used as a drop-in replacement for the 2N3904 in low-power switching applications, and what design trade-offs should I expect?
While both are general-purpose NPN transistors, the 2N708 is not a direct performance-equivalent replacement for the 2N3904 due to key differences in package, power handling, and frequency response. The 2N708’s TO-18 metal can offers better thermal performance than the 2N3904’s plastic TO-92, but it has a lower transition frequency (unspecified but typically <100 MHz vs. ~300 MHz for 2N3904), making it less suitable for high-speed digital logic or RF stages. Additionally, the 2N708’s higher collector cutoff current (25nA vs. ~5nA) may affect leakage-sensitive circuits. It can work in low-speed switching (e.g., relay drivers, LED control) if base drive and saturation voltage are verified, but avoid substitution in timing-critical or high-frequency applications without re-characterizing the circuit.
How does the 2N708 compare to the modern MMBT2222A in surface-mount designs, and should I consider migrating despite the packaging difference?
The MMBT2222A (SOT-23) offers superior performance in most modern applications compared to the through-hole 2N708, including higher DC current gain (hFE >100 vs. ~30–70 for 2N708), better frequency response, and lower saturation voltage. However, the 2N708’s TO-18 metal can provides superior thermal conductivity and mechanical robustness, which can be advantageous in high-reliability or high-vibration environments. Migrating to MMBT2222A is recommended for space-constrained, high-volume PCBs where board real estate and automated assembly matter—but only if the circuit can tolerate slightly higher leakage and lower power dissipation (350 mW vs. 360 mW, nearly equivalent). For legacy systems requiring through-hole mounting or enhanced thermal performance, the 2N708 remains a viable choice, but consider hybrid designs with adapter pads if transitioning.
What precautions should I take when designing a base drive circuit for the 2N708 to avoid saturation delay and ensure fast turn-off in switching applications?
The 2N708’s moderate hFE (minimum 30 @ 10mA) and unspecified transition frequency make it prone to storage delay during hard saturation, especially in inductive load switching. To minimize turn-off time, use a Baker clamp or active pull-down resistor (e.g., 1kΩ from base to ground) and overdrive the base with a higher initial current (2–3× Ic/hFE) followed by reduced hold current. Avoid excessive base resistor values—calculate Rb ≤ (Vdrive – Vbe) / (Ic / 10) for near-saturation operation. Also, ensure the driver stage can sink base charge quickly; a totem-pole or dedicated gate driver IC improves performance. Without these measures, the 2N708 may exhibit tail current and thermal stress in PWM applications.
Is the 2N708 suitable for use in automotive under-hood applications given its -65°C to 200°C operating range, and what qualification gaps should I address?
While the 2N708’s temperature range technically covers automotive under-hood conditions, it lacks AEC-Q101 qualification and is not rated for automotive-grade reliability testing (e.g., thermal cycling, HTRB, ESD robustness per ISO 10605). Microchip lists it as ‘Active’ but does not market it for automotive use. Relying on it in safety-critical systems (e.g., engine control, lighting) introduces significant risk due to unverified long-term drift, moisture sensitivity (TO-18 is not inherently sealed), and lack of traceability. For prototyping or non-critical subsystems, it may suffice with extensive environmental testing, but for production vehicles, prefer AEC-Q101-qualified alternatives like the MJD31C or through-hole equivalents such as the 2N5551 in qualified packaging. Always perform HASS/HALT validation if considering the 2N708 in harsh environments.
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2N708 CAD Models
Microchip Technology 2N708 PCB symbols & footprints
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