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ES3JB-13-F
Diodes Incorporated
DIODE GEN PURP 600V 3A SMB
10425 Pcs New Original In Stock
Diode 600 V 3A Surface Mount SMB
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5.0 / 5.0
- (363 Ratings)
ES3JB-13-F
Product Overview
12978616
DiGi Electronics Part Number
ES3JB-13-F-DGManufacturer
Diodes Incorporated
ES3JB-13-F
Description
DIODE GEN PURP 600V 3A SMBInventory
10425 Pcs New Original In Stock
Diode 600 V 3A Surface Mount SMB
Quantity
Minimum 1
Minimum 1
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ES3JB-13-F Technical Specifications
Category
Diodes, Rectifiers, Single Diodes
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Technology
Standard
Voltage - DC Reverse (Vr) (Max)
600 V
Current - Average Rectified (Io)
3A
Voltage - Forward (Vf) (Max) @ If
1.3 V @ 3 A
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
35 ns
Current - Reverse Leakage @ Vr
10 µA @ 600 V
Capacitance @ Vr, F
45pF @ 4V, 1MHz
Mounting Type
Surface Mount
Package / Case
DO-214AA, SMB
Supplier Device Package
SMB
Operating Temperature - Junction
-55°C ~ 150°C
Datasheet & Documents
HTML Datasheet
ES3JB-13-F-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8541.10.0080
Additional Information
Other Names
31-ES3JB-13-FCT
31-ES3JB-13-FTR
31-ES3JB-13-FDKR
Standard Package
3,000
Alternative Parts
View DetailsPART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
December 02, 2025
적당한 가격과 친절한 서비스 덕분에 항상 만족하고 있어요.
December 02, 2025
Die Verpackung sieht nicht nur schick aus, sondern bietet auch einen hervorragenden Schutz während des Transports.
December 02, 2025
DiGi Electronics’s inventory management is top-notch, preventing delays in our projects.
December 02, 2025
Choosing DiGi Electronics was the best decision—reliable quality at an accessible price.
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Frequently Asked Questions (FAQ)
Can the ES3JB-13-F diode safely replace a legacy through-hole 1N5406 in a 240VAC rectifier circuit, and what layout or thermal risks should I consider during the migration to surface mount?
Yes, the ES3JB-13-F (600V, 3A, SMB package) is a technically suitable drop-in replacement for the 1N5406 (600V, 3A, axial lead) in most 240VAC rectifier applications due to matching voltage and current ratings. However, migrating from through-hole to surface mount introduces critical design risks: the SMB package has significantly less thermal mass and relies entirely on PCB copper for heat dissipation. Ensure adequate thermal relief pads, use multiple vias to a ground or power plane if possible, and avoid placing the ES3JB-13-F on narrow traces. Without proper thermal management, junction temperatures may exceed safe limits under continuous load, leading to premature failure—especially in enclosed or high-ambient-temperature environments.
How does the reverse recovery time of the ES3JB-13-F (35 ns) compare to ultrafast alternatives like the STTH3R06 (25 ns), and when does this difference actually matter in a 50 kHz switch-mode power supply?
While the ES3JB-13-F’s 35 ns reverse recovery time is classified as 'fast,' it is notably slower than ultrafast diodes like the STTH3R06 (25 ns). In a 50 kHz SMPS, this 10 ns difference may seem minor, but it translates to higher switching losses and increased EMI, especially under hard-switching conditions. If your design operates near the upper edge of efficiency targets or uses synchronous rectification downstream, the extra recovery charge of the ES3JB-13-F could cause cross-conduction or elevate MOSFET stress. For soft-switched or low-duty-cycle topologies, the ES3JB-13-F remains acceptable—but for high-efficiency or high-density designs, consider upgrading to a true ultrafast diode to reduce thermal derating needs and improve reliability.
Is the ES3JB-13-F reliable for use in outdoor solar inverter applications where ambient temperatures regularly reach 50°C and the diode sees continuous 2.8A load?
The ES3JB-13-F is rated for 3A average forward current, but derating is essential at elevated temperatures. At 50°C ambient and 2.8A continuous load, the diode will experience significant self-heating—especially with its 1.3V forward drop (≈3.6W dissipation). Without aggressive copper heatsinking or forced airflow, the junction temperature may approach or exceed 150°C under sustained operation, risking thermal runaway or long-term degradation. For outdoor solar inverters, we recommend either active cooling, doubling the PCB copper area under the SMB pad, or selecting a higher-current-rated diode (e.g., ES4JB-13-F, 4A version). Additionally, verify that your layout minimizes thermal resistance from junction to ambient, as MSL 1 rating doesn’t mitigate thermal stress.
Can I substitute the ES3JB-13-F with the RS3JB-HF in a high-reliability industrial motor drive, and what qualification steps are needed to ensure long-term compatibility?
The RS3JB-HF is listed as a substitute, but it’s manufactured by a different supplier and may have subtle parametric differences—particularly in leakage current, surge capability, or long-term thermal cycling performance. Before substituting the ES3JB-13-F in a high-reliability motor drive (where diode failure can cause cascading damage), perform a side-by-side comparison of reverse leakage at 600V under temperature stress (e.g., 125°C), validate surge current handling (I²t), and conduct thermal cycling tests. Also confirm package coplanarity and solder joint reliability, as SMB joints are more susceptible to fatigue than larger packages. Always run a pilot build with the RS3JB-HF and monitor junction temperatures under worst-case load conditions before full qualification.
What PCB layout practices are critical when placing the ES3JB-13-F in a compact 230VAC input stage to avoid partial discharge or arcing due to its 600V rating?
Even though the ES3JB-13-F is rated for 600V, creepage and clearance distances on the PCB must be maintained to prevent partial discharge, especially in humid or polluted environments. Maintain at least 4mm clearance between the anode and cathode pads (or to any low-voltage circuitry), and increase this to 6mm if operating above 300VAC RMS. Avoid sharp copper edges near the diode terminals, and consider using slotting or conformal coating to enhance insulation. The SMB package’s small footprint increases the risk of unintended arcing if traces are routed too closely beneath or adjacent to the component. Always follow IEC 60664-1 guidelines for pollution degree 2 environments, and perform hipot testing (e.g., 2.5kV AC for 60s) on prototypes to validate insulation integrity.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
ES3JB-13-F CAD Models
Diodes Incorporated ES3JB-13-F PCB symbols & footprints
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