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IBF12012A007V-007-R
TDK-Lambda Americas Inc
DC DC CONVERTER 0.7-5.5V
1407 Pcs New Original In Stock
Non-Isolated PoL Module DC DC Converter 1 Output 0.7 ~ 5.5V 12A 4.5V - 14V Input
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5.0 / 5.0
- (67 Ratings)
IBF12012A007V-007-R
Product Overview
13049087
DiGi Electronics Part Number
IBF12012A007V-007-R-DGManufacturer
TDK-Lambda Americas Inc
IBF12012A007V-007-R
Description
DC DC CONVERTER 0.7-5.5VInventory
1407 Pcs New Original In Stock
Non-Isolated PoL Module DC DC Converter 1 Output 0.7 ~ 5.5V 12A 4.5V - 14V Input
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
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Worldwide Delivery in 3-5 Business Days
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IBF12012A007V-007-R Technical Specifications
Category
DC DC Converters
Packaging
Cut Tape (CT) & Digi-Reel®
Series
iBF (66W)
Product Status
Active
Type
Non-Isolated PoL Module
Number of Outputs
1
Voltage - Input (Min)
4.5V
Voltage - Input (Max)
14V
Voltage - Output 1
0.7 ~ 5.5V
Voltage - Output 2
-
Voltage - Output 3
-
Current - Output (Max)
12A
Applications
ITE (Commercial)
Features
Remote On/Off, OCP
Operating Temperature
-40°C ~ 115°C
Efficiency
94.5%
Mounting Type
Surface Mount
Package / Case
10-SMD Module
Size / Dimension
0.80" L x 0.45" W x 0.34" H (20.3mm x 11.4mm x 8.5mm)
Control Features
Enable, Active Low
Base Product Number
IBF12012
Datasheet & Documents
HTML Datasheet
IBF12012A007V-007-R-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.40.9580
Additional Information
Other Names
285-2234-1
-IBF12012A007V-007-RCT
-IBF12012A007V007R
285-2234-2
-IBF12012A007V-007-RDKR
285-2234-6
IBF12012A007V007R
-IBF12012A007V-007-R
-IBF12012A007V-007-R-ND
-IBF12012A007V007R-ND
Standard Package
300
Reviews
5.0/5.0-(Show up to 5 Ratings)
December 02, 2025
가격 대비 뛰어난 가치를 제공하는 곳으로, 항상 좋은 선택입니다.
December 02, 2025
Les prix sont compétitifs, et la qualité est au rendez-vous, je recommande.
December 02, 2025
Leur équipe support est toujours disponible et très professionnelle.
December 02, 2025
Grâce à leur inventaire bien géré, nous évitons toute interruption de production.
December 02, 2025
La rapidité de chargement du site est remarquable, même avec une connexion internet lente.
December 02, 2025
My overall experience with DiGi Electronics has been excellent due to their efficient logistics and helpful customer service.
December 02, 2025
The safety and creativity across their varied range are truly commendable.
December 02, 2025
The eco-packaging was well-designed, reducing waste and environmental impact.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the IBF12012A007V-007-R in a high-temperature environment near its 115°C operating limit?
When designing the IBF12012A007V-007-R into systems operating above 90°C, thermal derating becomes critical. Although the module supports up to 115°C, output current must be reduced above 85°C to avoid thermal shutdown. To mitigate risk, ensure at least 2-layer PCB with ample copper pour for heatsinking, avoid placing near heat-generating components, and validate under full load in final enclosure conditions. Monitor the case temperature directly during prototyping, as ambient measurements can underestimate localized heating. Consider using forced airflow if sustained 12A output is needed in high ambient temperatures.
How does the IBF12012A007V-007-R compare to the TI TPS82150 in terms of load transient response for point-of-load FPGA applications?
The IBF12012A007V-007-R offers superior transient response compared to the TPS82150 due to its higher bandwidth control architecture and lower output impedance, making it better suited for fast-loading FPGAs (e.g., Xilinx Kintex or Intel Cyclone series). While the TPS82150 requires larger external capacitors to handle dI/dt, the IBF12012A007V-007-R integrates optimized compensation, allowing fewer external components. However, for ultra-low-noise applications, the TPS82150 may offer slightly lower output ripple. Always simulate transient performance with your specific load capacitance profile when replacing TPS82150 with the IBF12012A007V-007-R.
Can the IBF12012A007V-007-R be used in parallel for higher current, and what are the stability risks?
The IBF12012A007V-007-R does not support direct parallel operation for higher current output due to lack of current-sharing control (e.g., no droop or external current share signal). Attempting to parallel units risks thermal runaway in one module due to slight output voltage mismatches. If >12A is required, consider using a higher-capacity module like the IBF12015A007V-008-R (15A) instead. Alternatively, use separate IBF12012A007V-007-R modules for different rails or domains, ensuring independent input filtering and layout symmetry to avoid interaction.
What PCB layout practices minimize EMI and ensure reliability when integrating the IBF12012A007V-007-R in dense digital systems?
To minimize EMI and ensure long-term reliability with the IBF12012A007V-007-R, keep input and output high-frequency paths short and wide—especially the VIN to PGND and VOUT to load. Use a solid ground plane directly beneath the module, place 10–22μF low-ESR ceramic capacitors within 5mm of VIN and VOUT pins, and avoid routing sensitive traces underneath the module. Since the IBF12012A007V-007-R operates at high efficiency (94.5%), switching noise is reduced, but poor layout can still couple noise into nearby ADCs or clocks. Follow the manufacturer’s recommended footprint and stencil design to prevent voiding and thermal stress during reflow.
Is the IBF12012A007V-007-R a drop-in replacement for the Murata OKLxx-78xx series in legacy 12V bus designs, and what changes are needed?
The IBF12012A007V-007-R can replace the Murata OKLxx-78xx series in 12V intermediate bus applications but is not a direct drop-in due to key differences. Unlike the fixed-output OKLxx-78xx, the IBF12012A007V-007-R has adjustable output (0.7–5.5V) via feedback resistor, requiring external resistors and disable control wiring. It also requires a pull-up resistor on the enable pin for active-low control. PCB re-layout is typically needed due to different pinouts and SMD footprint. However, the IBF12012A007V-007-R offers higher efficiency (94.5% vs ~90%), better thermal performance, and full RoHS compliance, making it a superior upgrade with proper design adjustments.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
IBF12012A007V-007-R CAD Models
TDK-Lambda Americas Inc IBF12012A007V-007-R PCB symbols & footprints
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